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Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition.
- Source :
- Soldering & Surface Mount Technology; 2019, Vol. 31 Issue 2, p102-108, 7p
- Publication Year :
- 2019
-
Abstract
- Purpose The purpose of this paper is to discuss the effect of a blast wave on the microstructure, intermetallic layers and hardness properties of Sn0.3Ag0.7Cu (SAC0307) lead-free solder.Design/methodology/approach Soldered samples were exposed to the blast wave by using trinitrotoluene (TNT) explosive. Microstructure and intermetallic layer thickness were identified using Alicona ® Infinite Focus Measurement software. Hardness properties of investigated solders were determined using a nanoindentation approach.Findings Microstructure and intermetallic layers changed under blast wave condition. Hardness properties of exposed solders decreased with an increase in the TNT explosive weight.Originality/value Microstructural evolution and mechanical properties of the exposed solder to the blast wave provide a fundamental understanding on how blast waves can affect the reliability of a solder joint, especially for military applications. [ABSTRACT FROM AUTHOR]
- Subjects :
- BLAST waves
LEAD-free solder
SOLDER joints
HARDNESS
BLAST effect
NANOINDENTATION
Subjects
Details
- Language :
- English
- ISSN :
- 09540911
- Volume :
- 31
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- Soldering & Surface Mount Technology
- Publication Type :
- Academic Journal
- Accession number :
- 135888261
- Full Text :
- https://doi.org/10.1108/SSMT-06-2018-0019