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Supercritical CO 2 -Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application.

Authors :
Kondo, Hikaru
Kurioka, Tomoyuki
Chiu, Wan-Ting
Chen, Chun-Yi
Wu, Jhen-Yang
Chang, Tso-Fu Mark
Yamaguchi, Machiko
Kurosu, Hiromichi
Sone, Masato
Source :
Electrochem; Jun2024, Vol. 5 Issue 2, p213-222, 10p
Publication Year :
2024

Abstract

This study reports on the use of supercritical CO<subscript>2</subscript> (scCO<subscript>2</subscript>) for the metallization of ultrahigh-molecular-weight polyethylene (UHMW-PE) filaments, which are used as functional components in weavable devices. UHMW-PE is well known for its chemical and impact resistance, making it suitable for use in bulletproof clothing and shields. However, its chemical resistance poses a challenge for metallization. By utilizing scCO<subscript>2</subscript> as the solvent in the catalyzation process, a uniform and defect-free layer of Ni-P is successfully deposited on the UHMW-PE filaments. The deposition rate of Ni-P is enhanced at higher temperatures during the scCO<subscript>2</subscript> catalyzation. Importantly, the durability of the Ni-P-metalized UHMW-PE filaments is improved when the scCO<subscript>2</subscript> catalyzation is carried out at 120 °C, as evidenced by minimal changes in electrical resistivity after a rolling test. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
26733293
Volume :
5
Issue :
2
Database :
Complementary Index
Journal :
Electrochem
Publication Type :
Academic Journal
Accession number :
178153277
Full Text :
https://doi.org/10.3390/electrochem5020013