Models for physics of failures analysis during printed circuit board bending.

Authors :: Jan-Long Yang
Mei-Ling Wu
Source :: Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International; 2011, p474-477, 4p
Publication Year :: 2011

Language :: English
ISBNs :: 9781457713873
Database :: Complementary Index
Journal :: Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International
Publication Type :: Conference
Accession number :: 81451686
Full Text :: https://doi.org/10.1109/IMPACT.2011.6117282