Electrical performance analysis of a three-dimensional package.

Authors :: Seung-Ho Ahn
Kyung-Sun Lee
Se-Young Oh
Miersch, E.
Source :: Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium 'Manufacturing Technologies - Present & Future'; 1995, p112-119, 8p
Publication Year :: 1995

Language :: English
ISBNs :: 9780780329966
Database :: Complementary Index
Journal :: Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium 'Manufacturing Technologies - Present & Future'
Publication Type :: Conference
Accession number :: 92348950
Full Text :: https://doi.org/10.1109/IEMT.1995.526102