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Early detection for Cu wire bonding corrosion using accelerated Autoclave reliability test.

Authors :
Tai, C. T.
Lim, H. Y.
Teo, C. H.
Audrey Swee, P. J.
Source :
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013, p309-312, 4p
Publication Year :
2013

Details

Language :
English
ISBNs :
9781479928347
Database :
Complementary Index
Journal :
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)
Publication Type :
Conference
Accession number :
95076270
Full Text :
https://doi.org/10.1109/EPTC.2013.6745733