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256-Mb DRAM circuit technologies for file applications

Authors :
Kitsukawa, G.
Horiguchi, M.
Kawajiri, Y.
Kawahara, T.
Akiba, T.
Kawase, Y.
Tachibana, T.
Sakai, T.
Aoki, M.
Shukuri, S.
Sagara, K.
Nagai, R.
Ohji, Y.
Hasegawa, N.
Yokoyama, N.
Kisu, T.
Yamashita, H.
Kure, T.
Nishida, T.
Source :
IEEE Journal of Solid-State Circuits; November 1993, Vol. 28 Issue: 11 p1105-1113, 9p
Publication Year :
1993

Abstract

256-Mb DRAM circuit technologies characterized by low power and high fabrication yield for file applications are described. The newly proposed and developed circuits are a self-reverse-biasing circuit for word drivers and decoders to suppress the subthreshold current to 3% of the conventional scheme, and a subarray-replacement redundancy technique that doubles chip yield and consequently reduces manufacturing costs. An experimental 256-Mb DRAM has been designed and fabricated by combining the proposed circuit techniques and a 0.25- mu m phase-shift optical lithography, and its basic operations are verified. A 0.72- mu m/sup 2/ double-cylindrical recessed stacked-capacitor (RSTC) cell is used to ensure a storage capacitance of 25 fF/cell. A typical access time under a 2-V power supply voltage was 70 ns. With the proper device characteristics, the simulated performances of the 256-Mb DRAM operating with a 1.5-V power supply voltage are a data-retention current of 53 mu A and an access time of 48 ns.<<ETX>>

Details

Language :
English
ISSN :
00189200 and 1558173X
Volume :
28
Issue :
11
Database :
Supplemental Index
Journal :
IEEE Journal of Solid-State Circuits
Publication Type :
Periodical
Accession number :
ejs57915717
Full Text :
https://doi.org/10.1109/4.245589