Quality Improvement by Preliminary Action through the Semiconductor Wire Bonding Process TRIZ

Authors :: Kwang Jun Lee
Hong Kyun Shim
Yong Won Song
Chan Ho Park
Sang Ook Jun
Source :: Asia-pacific Journal of Convergent Research Interchange. 7:15-28
Publication Year :: 2021
Publisher :: Future Convergence Technology Research Society, 2021.

Subjects :: Wire bonding
Materials science
Quality management
Semiconductor
Action (philosophy)
law
business.industry
Process (computing)
TRIZ
Mechanical engineering
business
General Economics, Econometrics and Finance
law.invention

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