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Halbach-Array Magnetic Coil Arrangement on CMOS Chip for Sensitivity Enhancement of Inductive Tactile Sensor
- Source :
- 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS).
- Publication Year :
- 2023
- Publisher :
- IEEE, 2023.
Details
- Database :
- OpenAIRE
- Journal :
- 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
- Accession number :
- edsair.doi...........1a557b74ddd82e08e1b9b179172a55bb
- Full Text :
- https://doi.org/10.1109/mems49605.2023.10052312