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Intermetallic compound evolution and mechanical properties of Cu/Sn58Bi/Cu 3D structures blended with B4C nanoparticles during isothermal aging

Authors :
Chen Chen
Liang Zhang
Xi Wang
Xiao Lu
Yong-huan Guo
Source :
Journal of Materials Research and Technology. 24:3643-3656
Publication Year :
2023
Publisher :
Elsevier BV, 2023.

Details

ISSN :
22387854
Volume :
24
Database :
OpenAIRE
Journal :
Journal of Materials Research and Technology
Accession number :
edsair.doi...........2d74a2221c9977170f81abbdfbafd8a0