Measurement and Crosstalk Analysis of Hexagonal TSV Bundle in 3D ICs

Hexagonal ground-shielding through silicon vias (TSVs) in 3D ICs are explored based on measurement and simulation. The measured S-parameters of the TSV-bundle part are successfully extracted by de-embedding technique. The results math well with simulations up to 20GHz. The proposed TSV bundle has a good performance of return and insertion loss. For the hexagonal ground TSV shield system, the crosstalk analysis of neighbor signals in the TSV shield system is made based on the measurements and simulations. The electronic and magnetic field plots show a good capacitive and inductive coupling isolation for the victim signal TSV with shielding ground TSVs. Compared to those coupled-TSVs systems without ground guide, the ground-shielding TSV as well as coaxial TSV has higher noise over the range of frequencies.