Influence of the topology on thermal dissipation in high power density GaAs devices

Authors :: J. Tasselli
J.P. Bailbe
P. Souverain
Thierry Camps
A. Marty
Source :: Solid-State Electronics. 46:1919-1924
Publication Year :: 2002
Publisher :: Elsevier BV, 2002.
Abstract: This paper presents an analysis of the influence of the active zone topology on the heat dissipation for GaAs devices. It highlights the influence of the width and the form factor on the thermal behavior of the device. It also shows the sensitivity of the thermal resistance to the increase of the dissipated power. For multi-cellular structures the impact of the thermal coupling between heat sources is studied.

Subjects :: Materials science
Form factor (electronics)
Thermal resistance
Topology optimization
Topology (electrical circuits)
High power density
Condensed Matter Physics
Topology
Electronic, Optical and Magnetic Materials
Thermal dissipation
Thermal
Materials Chemistry
Sensitivity (control systems)
Electrical and Electronic Engineering

Full Text Access

Tools