Digital Lithography for Advanced Packaging and Heterogenous Integration

Authors :: B. Dielacher
S. Schmolzer
T. Matthias
B. Povazay
F. Bogelsack
R. Holly
T. Zenger
T. Uhrmann
B. Thallner
Source :: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Publication Year :: 2022
Publisher :: IEEE, 2022.

Database :: OpenAIRE
Journal :: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
Accession number :: edsair.doi...........d6fd20c16e62748e33c4fc727313521b
Full Text :: https://doi.org/10.1109/eptc56328.2022.10013141