Advanced resist processing for thick photoresist applications

Interest in thick photoresist applications is steadily growing. Specialised equipment has been developed to cope with the new challenges in the field of preparing extremely thick photoresist layers and the process to pattern these thick resists. A new technology called 3D UV-Microforming consisting of an advanced resist preparation process, UV lithographic steps, resist development, moulding procedures by electrodeposition, and finally stripping and cleaning for finishing the structures was developed. It enables the low-cost fabrication of a wide variety of micro components for many different users.