Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage

Authors :: Jiangfeng Ni
Xiaocui Zhu
Yifei Yuan
Zhenzhu Wang
Yingbo Li
Lu Ma
Alvin Dai
Matthew Li
Tianpin Wu
Reza Shahbazian-Yassar
Jun Lu
Liang Li
Source :: Nature Communications, Vol 11, Iss 1, Pp 1-8 (2020)
Publication Year :: 2020
Publisher :: Nature Portfolio, 2020.
Abstract: The authors here report a binder-free electrode based on tin nanoarrays deposited on copper substrate. It is found that the locally formed electrochemically inactive tin-copper alloys work as a glue that bridges tin and copper to survive harsh cycling conditions in sodium ion batteries.

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