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Cu3Sn joint based on transient liquid phase bonding of Cu@Cu6Sn5 core–shell particles
- Source :
- Scientific Reports, Vol 13, Iss 1, Pp 1-12 (2023)
- Publication Year :
- 2023
- Publisher :
- Nature Portfolio, 2023.
-
Abstract
- Abstract With the development of high-integration and high-power electronics, the lack of matching chip connecting materials that can withstand high temperatures has been a challenge. In this manuscript, a Cu@Cu6Sn5 core–shell bimetallic particles (approx. 1 μm in diameter) are successfully prepared and introduced as a new solder material for the packaging of power devices to obtain a Cu3Sn all-IMC solder joint. The joint consisted mainly of equiaxed Cu3Sn grains, and a small portion of columnar Cu3Sn grains. In columnar-type growth, Sn is the dominant diffusing species, which comes from the depletion of Sn in Cu6Sn5. The depleted Cu6Sn5 is transformed into columnar Cu3Sn. In equiaxed-type growth, Cu is the dominant diffusing species. Cu reacts with Cu6Sn5 to grow a Cu3Sn layer. This conclusion was confirmed by the orientation relationship. The equiaxed Cu3Sn grain nucleates at the Cu/Cu3Sn interface have an orientation relationship with the Cu substrate. Columnar Cu3Sn grains at the Cu6Sn5/Cu3Sn interface have an orientation relationship with Cu6Sn5.
Details
- Language :
- English
- ISSN :
- 20452322
- Volume :
- 13
- Issue :
- 1
- Database :
- Directory of Open Access Journals
- Journal :
- Scientific Reports
- Publication Type :
- Academic Journal
- Accession number :
- edsdoj.9b85b823e4dc421c88271f277ff9dc30
- Document Type :
- article
- Full Text :
- https://doi.org/10.1038/s41598-023-27870-3