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The ultimate dielectric is... nothing: IBM packs wires in vacuum to speed chips and save power

Authors :
Adee, Sarah
Source :
IEEE Spectrum. Jan, 2008, Vol. 45 Issue 1, p39, 4 p.
Publication Year :
2008

Details

Language :
English
ISSN :
00189235
Volume :
45
Issue :
1
Database :
Gale General OneFile
Journal :
IEEE Spectrum
Publication Type :
Periodical
Accession number :
edsgcl.175152404