Effect of Au thickness on laser beam penetration in semiconductor laser packages

Dual-in-line package (DIP) and butterfly package with fiber pigtails are widely used package styles in laser-based transmitters in lightwave communication systems. There is only limited information on optoelectronic joining applications where joint strength is important for package reliability, in spite of many studies on the laser welding technique. The dependence of laser beam penetration on the Au coating thickness in dual-in-line constructions has been studied and the experimental measurements are presented, using the finite-element method.