Search

The article evaluates a range of products including the Broadband Low Noise Amplifier from Agile Microwave Technology Inc., the Torque Wrench from Anoison Electronics and the Frequency Extenders from Eravant.

The article discusses the development of chipless radio frequency identification (RFID) tags with microstrip patch resonators to achieve higher coding capacity. The tags can be printed directly on products like credit cards, paper and textiles. Other topics include the effects of mutual coupling on the tags, and the categories of chipless RFID tags, including time domain reflectometry based chipless RFID.

The article discusses the application of X-parameters modeling technology in power amplifiers (PA) design. PA designers can develop measurement-based behavior models of unmatched devices by integrating X-parameter modeling with load-pull measurements. A simple matching network topology is used to reduce fabrication related errors. The matching network and the X-parameter model are combined to predict the effects of connecting the matching networks to the transistor ports.

The article focuses on the necessity of developing a comprehensive roadmap for new commercially available spectrum to ensure the successful deployment of future mobile networks, as highlighted in a white paper by 5G Americas titled "The Evolution of 5G Spectrum."

The article focuses on the transformative potential of 3GPP's advancements, particularly in Release 17, toward shaping a future where connectivity is seamlessly integrated into daily life, as highlighted in a white paper by 5G Americas titled "3GPP Technology Trends."

The article discusses the publication and distribution of the 5 generation (5G) executive version white paper from Frankfurt, Germany-based mobile telecommunications association Next Generation Mobile Networks (NGMN) Alliance.

The author discusses the paper proposals submitted to the Electronic Design Innovation (EDI) Conference technical committee for review for the 2013 EDI Conference. According to him, many of the most exciting technologies in the microwave devices industry were well represented in the papers. He mentions that the technical committee is evaluating the papers based on quality, impact, originality and relevance.

The article presents several invited papers regarding radiofrequency (RF) and microwave electronic design automation (EDA) that support internet of things (IoT) design. Invited papers presented include from software companies including ANSYS, Computer Simulation Technology (CST), and FEKO (Altair Development). Topics of the papers include the use of over-the-air and mobile/base station antennas from baseband to RF, simulation of wearable antennas, and 5G antenna designs for mobile phones.

The article discusses the International Microwave Symposium 2022 held from 19-24 June 2022, Denver, Colorado. Topics include the robust technical program, social opportunities presented in the symposium; industrial showcase receiving papers with industrial authors presenting poster and Systems Forum and contributions from MTT-S Sister Societies.

This article presents information on the 2005 International Microwave Symposium to be held in Long Beach, California in June 11, 2005. There are nine hotels with convention rates. Five of these are downtown within walking distance of the convention center. There are six guest program tours for either full or half days plus a golf tournament on June 17, 2005. All of the tour busses load at the entrance of the Hyatt Hotel. This year there will be 344 papers presented in seven parallel regular IMS sessions plus an additional 149 papers presented in the open forum format. There will be 160 papers presented in tbe RFIC sessions.

The article presents information on 2004 IEEE MTT-S technical programs. Nonlinear device modeling session deals with nonlinear modeling of LDMOS devices. Papers describe formulations and results for IMD an ACPR prediction in GaN as well as electrothermal effects. Five sessions are presented in the theory and design of power dividers. The first paper covers a reconfigurable power-division tehnique using coupled lines or hybrid. The second paper describes a phase combiner for power amplifiers. The third paper presents a multiway power divider with arbitrary terminating impedences.

The article discusses the Wireless Broadband Alliance (WBA) published a paper which explores how Wi-Fi's latest features are ideal for meeting the demanding requirements for a wide variety of existing and emerging IIoT applications.

This article updates previous papers discussing significant developments, trends and breakthroughs in radar, phased arrays and the underlying technologies that enable them.1-8 [ABSTRACT FROM AUTHOR]

The article discusses the Automatic Radio Frequency Techniques Group Microwave Measurement Conference focused on the calibration and automation of early vector network analyzers. Topics include the studies related to the microwave test and measurement; awarding fellowships and sponsorships to students presenting the papers on the study of microwave measurement.

The article offers information about a research paper Antenna Design Challenges for New-Generation Nano Satellites. Topics discussed include the challenges faced during the standardization of satellites infrastructure and communication capabilities, impact of size of satellite as well as size and weight restrictions of launch vehicle on the development of antennas and impact of external factors on the performance of antennas. It further discusses importance of shape of the deployed antennas.

The article discusses publication of a new white paper entitled Mobile Communications Towards 2030 by 5G Americas, which details how the industry will continue to build and evolve wireless communications networks for consumers and enterprises.

The article reviews the production of two- and three-dimensional (2D/3D) wireless sensor modules on paper or liquid crystal polymer (LCP) substrates using inkjet printers and nanosilver ink technology. An overview is provided of printed wireless module fabrication, including antennas, carbon nanotube sensors, and power scavengers. The possible applications for these printed modules include power sources for radio frequency identification (RFID) and wireless sensor networks.

In this paper, the figures of merit for a satellite-terrestrial handset with internal and external antennas are extracted, based on the antenna measurements with the handset mechanics in free space. The gain statistics are derived from the measured antenna patterns. The antenna noise temperature is calculated from the sky brightness, the antenna efficiency and loss, and a few critical conclusions are obtained. [ABSTRACT FROM AUTHOR]

The object of this paper is to outline the present state of art in the high power microwave field with special emphasis on linear beam circuits interacting with periodically loaded waveguides. A number of interaction circuits are discussed, both for "O" and "M" type tubes and areas of advances and future trends are indicated. [ABSTRACT FROM AUTHOR]

The article offers news briefs related to engineering in the U.S. The Institute of Electrical and Electronics Engineers Inc.(IEEE) International Reliability Physics Symposium (IRPS) 46th annual conference will feature new technical sessions and invited papers about microelectronic. RF Micro Devices Inc. has acquired Filtronic Compound Semiconductors Ltd. AAE Systems Inc. expanded its operations with the opening of an office in India to provide regional sales, engineering and customer support.

The article reports on the development of beam-forming network for European satellite antennas which is known to be connected to that of beam-forming networks. Related topics discussed include a proposal for a beam-forming network classification, beam-forming network topologies, beam-forming network transmission lines and transmission lines. It is concluded that this paper reviewed the basic concepts and techniques of beam-forming networks for satellite multiple beams and reconfigurable antennas.

Microwave Week included the MTT-S international Microwave Symposium and Exhibition, as well as the 2004 IEEE Radio Frequency Integrated Circuit Symposium. Robert L. Leheny of DARPA and Michael J. Marcus of the Federal Communications Commission appropriately launched IMS 2004 with inspiring plenary speeches. They are to be congratulated on assembling a very talented technical program committee and presenting an unusually comprehensive and informative program. In addition, there were 141-student papers presented always one of the highlights of Microwave Week.

Presents information on the 2003 IEEE MTT-S International Microwave Symposium held from June 18 through 13, 2003 in Philadelphia, Pennsylvania. Number of research papers received for the symposium; Social events of the symposium; Details of the exhibition also held during the symposium.

Highlights the IMS 2002 symposium and exhibition at the Washington State Convention and Trade Center in Seattle, Washington. Overview of technical papers accepted for the symposium; Social events; Details on industry exhibition.

The article focuses on fifth generation (5G) networks having just finished their second year in existence, wireless industry leaders are exploring the path to future wireless networks beyond 5G. Topics include the 5G Americas has announced the publication of a white paper Mobile Communications Beyond 2020 The Evolution of 5G Toward Next G, and the global work from several academic and industry presents potential use cases and technologies integral to the evolution of 5G toward the "Next G."

The article offers information on the history of developments of Nokia Corporation from the 19th century to the 20th century and the new technology they are focusing for the 21st century in Finland. It states that the company got its name from the Nokianvirta river. It notes that Nokia started by making paper which is considered to be the original communications technology. It mentions several Nokia Research Centers (NRC) locations which includes NRC Helsinki, Finland, NRC Cambridge, U.S., and NRC Hollywood in Los Angeles, California, U.S.

The article focuses on successful deployment of fifth generation (5G) of mobile network operators need transport technologies that can meet stringent throughput, latency and reliability requirements over increasingly has densified. Topics icnlude the wireless industry trade association and voice of 5G and LTE for the Americas, and the published a white paper highlighting new innovative backhaul, midhaul and fronthaul transport technologies for 5G network.

The article discusses various papers published within the issue, including one by Ted Saad about his experiences on the 1967 IMS Boston conference, another by Richard Mumford on an interview with 2009 IMS Plenary Speaker Peterri Alinikula, and one by Gayle Collins on the PA papers being delivered at IMS and their potential effects on the field.

The article reports on the white paper from ISCO International Inc. which discusses the statistical distributions of traffic and interference in 3G networks. The white paper determines how poor correlation between measured traffic and uplink channel power can be used to assess interference severity. It is concluded that the application of a more network-centric approach represents a more proactive approach to interference management.

An introduction to the journal is presented in which the editor discusses several papers published within the issue concerning passive designs from the journal's divider/combiner/coupler files and technical papers on filter performance including one that incorporate a balun and another that consists of a bandpass filter to improve balanced port characteristics.

The article presents corrections to papers that were previously published in the April 2005 issue of the "Microwave Journal." In the paper, "A Unified Theory for Nonlinear Distortion Characteristics in Different Amplifier Technologies," by Pedro Miguel Cabral, José Carlos Pedro and Nuno Borges Carvalho,the affiliations of Cabral, Pedro and Carvalho were wrong. In the article "Amplifier and Transistor Gains Revisited," by George D. Vedein, José Carlos Pedro and Pedro Miguel Cabral, the affiliations of Pedro and Cabral were not correct.

Reports that the Institute of Electrical and Electronics Engineers (IEEE) has formed an interest group in July 2003 that will develop an alternative physical layer for the IEEE wireless personal area networks (WPAN) standard. Details of the call for papers issued by the interest group; Overview of research papers about telecommunication systems that were presented during the group's initial meeting in Singapore in September 2003.

The article offers brief information on a free CD containing papers on Long Term Evoluton-Advanced (LTE-A) and other mobile technologies from Agilent Technologies Inc., AWR Visual System Simulator software for evaluating LTE components from AWR Corp. and CST Microwave Studio software for analysis of high frequency devices from Computer Simulation Technology.

The article offers forecasts concerning telecommunications, mass media and the Internet industry worldwide. A research entitled "UWB 2008: Short-Term Problems and Long-Term Potential," by In-Stat shows that the ultra-wideband (UWB) technology market experienced setbacks in 2008 but will show progress in 2009. Meanwhile, ABI Research's white paper "What Isn't Going to Happen in 2009," looks into possible innovations in digital media, mobile communications and wireless fidelity (WiFi). Moreover, M/C Venture Partners predicts that the economic downturn will create investment opportunities in the communications and media sectors in 2009.

The article discusses the forthcoming 2008 Institute of Electrical and Electronics Engineers/Microwave Theory and Techniques Society (IEEE/MTT-S) International Microwave Symposium (IMS) to be held in Atlanta, Georgia from June 15 to 20, 2008. The event will include a student paper competition as well as three design competitions which is conducted by 240 reviewers on the Technical Program committee for the interactive forums. The event has historically been the premier opportunity to observe and showcase the latest technology while networking with other attendees. Organizers also rearranged the schedules of the regular sessions to allow the IMS attendees to have more flexibility to attend the sessions on radio frequency integrated circuit (RFIC).

Information about the various conferences of the European Microwave Week (EuMW), held in October 2007 in Munich, Germany is presented. The European Microwave Conference (EuMIC) featured 66 regular oral sessions. The 10th European Conference on Wireless Technology was a forum concerning wireless technology. The 2007 European Microwave Integrated Circuits Conference had 100 technical papers that spanned more than 20 sessions.

The article presents information on the IEEE MTT-S Radio and Wireless Symposium. It is reported that the symposium will be held in conjunction with the 6th Topical Meeting on Silicon Monolithic ICs, the IEEE Topical Workshop on Power Amplifiers for Wireless Communications and the Radio and Wireless Exhibition. The program includes 157 papers, five workshops, two short courses, two panel sessions and a rump session. The Radio and Wireless Exhibition at the symposium will feature new products and services for wireless design engineers from principle suppliers in the industry.

The article reports on the paper "LTE-Advanced Carrier Aggregation Deployments: Peak Speeds," by Global mobile Suppliers Association (GSA) which confirms that 20 operators launched 300 Mpbs Category 6 Long-Term Evolution (LTE) Adavanced services in 15 countries including Austria, Spain and Russia.

The article presents a step-by-step instruction for making a ring using a ribbon of paper, comic strip on how to keep the day occupied, and a poem by Eleanor Ninestein.

A calendar of business events related to electronic industry worldwide for September 2010 is presented including the Call for Papers Microwave Update (MUD) on August 31, the IEEE Great Lakes Technology Symposium in Ann Arbor, Michigan, and the Antenna Application Symposium in Monticello, Illinois.

The article reports on a set of papers released by the Global mobile Suppliers Association (GSA) concerning the trend of mobile broadbrand including High Speed Packet Access (HSPA), smartphones and computer networks.

The article presents a reprint of "Editorial," by Ted Saad, which appeared in the September/October 1958 issue of the periodical "Microwave Journal." It states the important policy which is to strive for balance of content without diluting the quality of the magazine. It shows that most of the reader response in the field of specialization indicated a desire for papers on antennas including Ferrites, Solid State, and microwave tubes.

The article provides an overview of the Microwave Theory and Technique Society (MMTS) International Microwave Symposium (IMS) in Honolulu, Hawaii. The theme of the 2007 event is "Microwave across the Pacific". According to the article, about 30 percent of the submitted papers came from Asia. The event offers an opportunity to become current on all of the latest technologies being advanced worldwide.

The article reports features Cornell Dubilier's executed capacitor web site. The site has one-click access to 10 technical papers, three capacitor life-temperature calculators and a thermal modeling applet and one-click access to capacitor types of dielectric, application or type letters. It also has application and product selector guides.

The article presents information on the Microwave Diode Packages from Microsemi Corp. The papers in this package discuss the different types of microwave diode packages available, the attributes of each, and the effects one might expect when used in some common circuit applications.

This article presents information on the 2005 International Microwave Symposium to be held in Long Beach, California in June 11, 2005. This year's technical program has more than 70 sessions, 37 workshops and seven panels. There will be 493 technical presentations, spread out over three days. This year there will not be a paper copy of the digest, there will only be a CD-ROM. It will be possible to order a soft bound copy from the IEEE Conference Publication Program; details will be available on-site.