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In this work, by using an on-chip integrated Schottky-on-heterojunction light-emitting diode (SoHLED) which is seamlessly integrated with the AlGaN/GaN high electron mobility transistor (HEMT), we studied the effect of on-chip light illumination on the de-trapping processes of electrons from both surface and bulk traps. Surface trapping was generated by applying OFF-state drain bias stress, while bulk trapping was generated by applying positive substrate bias stress. The detrapping processes of surface and/or bulk traps were monitored by measuring the recovery of dynamic on-resistance Ron and/or threshold voltage Vth of the HEMT. The results show that the recovery processes of both dynamic Ron and threshold voltage Vth of the HEMT can be accelerated by the on-chip SoH-LED light illumination, demonstrating the potentiality of on-chip hybrid opto-HEMTs to minimize the influences of traps during dynamic operation of AlGaN/GaN power HEMTs. [ABSTRACT FROM AUTHOR]

In this work, we attempt to reveal the underlying mechanisms of divergent V TH-thermal-stabilities in III-nitride metal-insulator-semiconductor high-electron-mobility transistor (MIS-HEMT) and MOS-Channel-HEMT (MOSC-HEMT). In marked contrast to MOSC-HEMT featuring temperature-independent VTH, MIS-HEMT with the same high-quality gate-dielectric/III-nitride interface and similar interface trap distribution exhibits manifest thermally induced VTH shift. The temperature-dependent VTH of MIS-HEMT is attributed to the polarized III-nitride barrier layer, which spatially separates the critical gate-dielectric/III-nitride interface from the channel and allows "deeper" interface trap levels emerging above the Fermi level at pinch-off. This model is further experimentally validated by distinct VG-driven Fermi level movements at the critical interfaces in MIS-HEMT and MOSC-HEMT. The mechanisms of polarized III-nitride barrier layer in influencing VTH-thermal-stability provide guidelines for the optimization of insulated-gate III-nitride power switching devices. [ABSTRACT FROM AUTHOR]

We report that a simple metal-AlGaN/GaN Schottky diode is capable of producing GaN band-edge ultraviolet emission at 3.4 eV at a small forward bias larger than ~2V at room temperature. Based on the surface states distribution of AlGaN, a mature impact-ionization-induced Fermi-level depinning model is proposed to explain the underlying mechanism of the electroluminescence (EL) process. By experimenting with different Schottky metals, Ni/Au and Pt/Au, we demonstrated that this EL phenomenon is a "universal" property of metal-AlGaN/GaN Schottky diodes. Since this light-emitting Schottky diode shares the same active structure and fabrication processes as the AlGaN/GaN high electron mobility transistors, straight-forward and seamless integration of photonic and electronic functional devices has been demonstrated on doping-free III-nitride heterostructures. Using a semitransparent Schottky drain electrode, an AlGaN/GaN high electron mobility light-emitting transistor is demonstrated. [ABSTRACT FROM AUTHOR]

A high electron mobility transistor (HEMT)-compatible power lateral field-effect rectifier (L-FER) with low turn-on voltage is demonstrated using the same fabrication process as that for normally off AlGaN/GaN HEMT, providing a low-cost solution for GaN power integrated circuits. The power rectifier features a Schottky-gate-controlled two-dimensional electron gas channel between the cathode and anode. By tying up the Schottky gate and anode together, the forward turn-on voltage of the rectifier is determined by the threshold voltage of the channel instead of the Schottky barrier. The L-FER with a drift length of 10 μm features a forward turn-on voltage of 0.63 V at a current density of 100 A/cm2. This device also exhibits a reverse breakdown voltage (BV) of 390 V at a current level of 1 mA/mm and a specific on resistance (RON,sp) of 1.4 mΩ cm2, yielding a figure of merit (BV2/RON,sp) of 108 MW/cm2. The excellent device performance, coupled with the lateral device structure and process compatibility with AlGaN/GaN HEMT, make the proposed L-FER a promising candidate for GaN power integrated circuits. [ABSTRACT FROM AUTHOR]