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This report discusses the design and demonstration of β -(Al0.17Ga0.83)2O3/Ga2O3 modulation doped heterostructures to achieve high sheet charge density. The use of a thin spacer layer between the Si delta-doping and the heterojunction interface was investigated in a β -(AlGa)2O3/Ga2O3 modulation doped structure. It is shown that this strategy enables a higher two-dimensional electron gas (2DEG) sheet charge density up to 4.7 × 1012 cm−2 with an effective mobility of 150 cm2/V s. The presence of a degenerate 2DEG channel was confirmed by the measurement of a low temperature effective mobility of 375 cm2/V s and the lack of carrier freeze out from low temperature capacitance voltage measurements. The electron density of 4.7 × 1012 cm−2 is the highest reported 2DEG density obtained without parallel conducting channels in a β -(AlxGa(1−x))2O3/Ga2O3 heterostructure system. [ABSTRACT FROM AUTHOR]

We introduce a deep-recessed gate architecture in β-Ga2O3 delta-doped field-effect transistors (FETs) for improvement in dispersion and breakdown properties. The device design incorporates an unintentionally doped (UID) β-Ga2O3 layer as the passivation dielectric. To fabricate the device, the deep-recess geometry was developed using BCl3 plasma-based etching at ~5 W reactive ion etching (RIE) power to ensure minimal plasma damage. Etch damage incurred with plasma etching was mitigated by annealing in vacuum at temperatures above 600 °C. A gate-connected field-plate edge termination was implemented for efficient field management. Negligible surface dispersion with lower knee walkout at high VDS, and better breakdown characteristics compared to their unpassivated counterparts were achieved. A three-terminal OFF-state breakdown voltage of 315 V, corresponding to an average breakdown field of 2.3 MV/cm was measured. The device breakdown was limited by the field-plate/passivation edge and presents scope for further improvement. This demonstration of epitaxially passivated FET is a significant step for β-Ga2O3 technology since the structure simultaneously provides control of surface-related dispersion and excellent field management. [ABSTRACT FROM AUTHOR]

Wide and ultrawide bandgap semiconductors can provide excellent performance due to their high energy bandgap, which leads to breakdown electric fields that are more than an order of magnitude higher than conventional silicon electronics. In materials where p-type doping is not available, achieving this high breakdown field in a vertical diode or transistor is very challenging. We propose and demonstrate the use of dielectric heterojunctions that use extreme permittivity materials to achieve a high breakdown field in a unipolar device. We demonstrate the integration of a high permittivity material BaTiO3 with n-type β-Ga2O3 to enable a 5.7 MV/cm average electric field and a 7 MV/cm peak electric field at the device edge while maintaining forward conduction with relatively low on-resistance and voltage loss. The proposed dielectric heterojunction could enable improved design strategies to achieve theoretical device performance limits in wide and ultrawide bandgap semiconductors where bipolar doping is challenging. [ABSTRACT FROM AUTHOR]

Two buffer traps at EC-0.7 eV and EC-0.8 eV have been individually identified as causing threshold voltage and on-resistance instabilities in β-Ga2O3 Si ∂ -doped transistors grown by plasma-assisted molecular beam epitaxy (PAMBE) on semi-insulating Fe doped β-Ga2O3 substrates. The instabilities are characterized using double-pulsed current-voltage and isothermal constant drain current deep level transient spectroscopy. The defect spectra are compared between transistors grown using two different unintentionally doped buffer layer thicknesses of 100 nm and 600 nm. The EC-0.8 eV trap was not seen using the thicker buffer and is shown to correlate with the presence of residual Fe in thePAMBE buffer layer. The EC-0.7 eV trap was unchanged in concentration and is revealed as the dominating source of the threshold voltage instability. This trap is consistent with the characteristics of a previously reported intrinsic point defect [Ingebrigtsen et al., APL Mater. 7, 022510 (2019)]. The EC-0.7 eV trap is responsible for ∼70% of the total threshold voltage shift in the 100 nm thick buffer transistor and 100% in the 600 nm thick buffer transistor, which indicates growth optimization is needed to improve β-Ga2O3 transistor stability. [ABSTRACT FROM AUTHOR]

We report on the origin of high Si flux observed during the use of Si as a doping source in plasma assisted MBE growth of β -Ga2O3. We show on the basis of secondary ion mass spectroscopy analysis that Si flux is not limited by the vapor pressure of Si but by the formation of volatile SiO. The low sublimation energy of SiO leads to a weak dependence of the SiO flux of Si cell temperature and a strong dependence on the background oxygen pressure. Extended exposure to activated oxygen results in reduction of SiO flux due to the formation of SiO2 on the Si surface. The work reported provides key understanding for incorporating Si into future oxide-based semiconductor heterostructure and device MBE growth. [ABSTRACT FROM AUTHOR]

III-Nitride light emitting diodes (LEDs) are widely used in a range of high efficiency lighting and display applications, which has enabled significant energy savings in the last decade. Despite the wide application of GaN LEDs, transport mechanisms across InGaN/GaN heterostructures in these devices are not well explained. Fixed polarization sheet charges at InGaN/GaN interfaces lead to large interface dipole charges, which create large potential barriers to overcome. One-dimensional models for transport across such heterostructures predict turn-on voltages that are significantly higher than that found in real devices. As a result, conventional models for transport cannot predict the performance of new designs such as for longer wavelength LEDs or for multi-quantum well LEDs. In this work, we show that incorporating low and high indium compositions within quantum wells at the submicrometer scale can provide an accurate prediction of the characteristics of GaN/InGaN light emitting diodes. [ABSTRACT FROM AUTHOR]

We report on the high-field transport characteristics and saturation velocity in a modulation-doped $\beta $ -(AlxGa1–x)2O3/Ga2O3 heterostructure. The formation of a 2-D electron gas (2DEG) in the modulation-doped structure was confirmed from the Hall measurements, and the 2DEG channel mobility increased from 143 cm $^{2}/\text{V}\cdot \text{s}$ at room temperature to 1520 cm $^{2}/\text{V}\cdot \text{s}$ at 50 K. The high electron mobility at 50 K made it feasible to achieve velocity saturation inside the channel. The saturation velocity was estimated based on both pulsed current–voltage measurements and small-signal radio frequency (RF) measurements. The measured velocity–field profile suggested a saturation velocity above $1.1\times 10^{7}$ cm/s at 50 K. The small-signal RF characteristics were measured for the fabricated modulation-doped field-effect transistors with a Pt-based Schottky contact. The current gain cutoff frequency ($\text{f}_{\text {t}}$) and maximum oscillation frequency ($\text{f}_{\text {max}}$) showed significant increases from 4.0/11.8 GHz at room temperature to 17.4/40.8 GHz at 50 K for the device with gate length of $\text{L}_{{\textsf {G}}} = 0.61\,\,\mu \text{m}$. The analysis of the low temperature $\text{f}_{\text {t}}$ based on device simulations indicated a peak velocity of $1.2\times 10^{7}$ cm/s. The three-terminal off-state breakdown measurement further suggested an average breakdown field of 3.22 MV/cm. The high saturation velocity and high breakdown field in $\beta $ -Ga2O3 make it a promising candidate for high-power and high-frequency device applications. [ABSTRACT FROM AUTHOR]

The design and modeling of dielectric superjunction transistors using combinations of ultrahigh permittivity materials and high-mobility materials are described. We show that placing high dielectric permittivity materials in the gate–drain depletion region can reduce electric field variations by screening the field due to depleted charges. This enables simultaneously high sheet charge density and breakdown voltage for scaled field-effect transistors. Using detailed 2-D device simulation of dc and high frequency characteristics, we show that extreme dielectric constant engineering provides unique opportunities for transistor design and has the potential to perform better than state-of-the-art millimeter-wave and terahertz frequency transistors. [ABSTRACT FROM AUTHOR]

We report on the effect of iron (Fe)-doped semi-insulating buffers on the electron transport and DC-RF dispersion in Si delta (δ)-doped β-Ga2O3 metal-semiconductor field effect transistors. The effect of the distance between the 2-dimensional electron gas and the Fe-doped region was investigated, and Fe doping in the buffer was found to have a significant effect on the transport properties. It was found that buffers thicker than 600 nm can enable better transport and dispersion properties for field effect transistors, while maintaining relatively low parasitic buffer leakage. This work can provide guidance for the use of Fe-doped insulating buffers for future Ga2O3 based electronics. [ABSTRACT FROM AUTHOR]

We demonstrate field emission characteristics of β-Ga2O3 nano-pillar arrays fabricated using a damage-free etching technique. The technique utilizes Ga flux in an ultra-high vacuum environment (molecular beam epitaxy) to form high aspect ratio Ga2O3 nano-pillars with atomic-scale etching precision. Electrically conductive Ga2O3 nano-pillars with uniform widths of ∼200–300 nm were realized without the use of e-beam lithography. Furthermore, field emission characteristics on the nano-pillars displayed an emission current of 19 nA per tip at an electric field of 385 kV/cm. The field emission characteristics were modeled using the Murphy–Good model, and the measurements were validated with a field emission orthodoxy test. [ABSTRACT FROM AUTHOR]

A new record‐high room‐temperature electron Hall mobility (μRT = 194 cm2 V−1 s−1 at n ≈ 8 × 1015 cm−3) for β‐Ga2O3 is demonstrated in the unintentionally doped thin film grown on (010) semi‐insulating substrate via metal‐organic chemical vapor deposition (MOCVD). A peak electron mobility of ≈9500 cm2 V−1 s−1 is achieved at 45 K. Further investigation on the transport properties indicates the existence of sheet charges near the epilayer/substrate interface. Si is identified as the primary contributor to the background carrier in both the epilayer and the interface, originating from both surface contamination and growth environment. The pregrowth hydrofluoric acid cleaning of the substrate leads to an obvious decrease in Si impurity both at the interface and in the epilayer. In addition, the effect of the MOCVD growth condition, particularly the chamber pressure, on the Si impurity incorporation is studied. A positive correlation between the background charge concentration and the MOCVD growth pressure is confirmed. It is noteworthy that in a β‐Ga2O3 film with very low bulk charge concentration, even a reduced sheet charge density plays an important role in the charge transport properties. [ABSTRACT FROM AUTHOR]

A 2-D electrothermal model of delta-doped beta-gallium oxide (β-Ga2O3) metal–semiconductor field-effect transistor (MESFET) is developed by using TCAD Sentaurus to investigate its electrical and thermal characteristics. The temperature and electric field-dependent electron mobility model is incorporated to predict I–V characteristics of the FET, which are in good agreement with the measured I–V characteristics. We investigated the effect of bias voltages on an electric field, a current path, a volumetric heat generation profile, and a peak temperature at a given total heat dissipation. The peak temperature is observed to be significantly different at the same power dissipation but different bias conditions, e.g., the peak temperature is ~9 K higher when the drain-to-source voltage (Vds) = 25 V and the gate-to-source voltage (Vgs) = −6 V compared with Vds = 8.3 V and Vgs = 2 V at the total power dissipation of 1.16 W/mm. This difference is attributed to the change in the electron Joule heating profile with the applied bias voltage. The effects of the location of the delta-doping layer, the gate–drain spacing, and the source–drain spacing are investigated to guide a future device fabrication. The variation in these parameters mainly affects electrical characteristics such as ON-resistance, saturation current, threshold voltage, and so on. The thermal characteristics, such as peak temperature, temperature profile, and so on, are not significantly affected at a low-power dissipation. [ABSTRACT FROM AUTHOR]

In this work, we demonstrate modulation-doped β-(AlxGa1-x)2O3/Ga2O3 double heterostructure field effect transistors. The maximum sheet carrier density for a two-dimensional electron gas (2DEG) in a β-(AlxGa1-x)2O3/Ga2O3 heterostructure is limited by the conduction band offset and parasitic channel formation in the barrier layer. We demonstrate a double heterostructure to realize a β-(AlxGa1-x)2O3/Ga2O3/(AlxGa1-x)2O3 quantum well, where electrons can be transferred from below and above the β-Ga2O3 quantum well. The confined 2DEG charge density of 3.85 × 1012 cm−2 was estimated from the low-temperature Hall measurement, which is higher than that achievable in a single heterostructure. Hall mobilities of 1775 cm2/V·s at 40 K and 123 cm2/V·s at room temperature were measured. Modulation-doped double heterostructure field effect transistors showed a maximum drain current of IDS = 257 mA/mm, a peak transconductance (gm) of 39 mS/mm, and a pinch-off voltage of −7.0 V at room temperature. The three-terminal off-state breakdown measurement on the device with a gate-drain spacing (LGD) of 1.55 μm showed a breakdown voltage of 428 V, corresponding to an average breakdown field of 2.8 MV/cm. The breakdown measurement on the device with a scaled gate-drain spacing of 196 nm indicated an average breakdown field of 3.2 MV/cm. The demonstrated modulation-doped β-(AlxGa1-x)2O3/Ga2O3 double heterostructure field effect transistor could act as a promising candidate for high power and high frequency device applications. [ABSTRACT FROM AUTHOR]

In this work, we demonstrate a high mobility two-dimensional electron gas (2DEG) formed at the β-(AlxGa1-x)2O3/Ga2O3 interface through modulation doping. Shubnikov-de Haas (SdH) oscillations were observed in the modulation-doped β-(AlxGa1-x)2O3/Ga2O3 structure, indicating a high-quality electron channel formed at the heterojunction interface. The formation of the 2DEG channel was further confirmed by the weak temperature dependence of the carrier density, and the peak low temperature mobility was found to be 2790 cm2/Vs, which is significantly higher than that achieved in bulk-doped Beta-phase Gallium Oxide (β-Ga2O3). The observed SdH oscillations allowed for the extraction of the electron effective mass in the (010) plane to be 0.313 ± 0.015 m0 and the quantum scattering time to be 0.33 ps at 3.5 K. The demonstrated modulation-doped β-(AlxGa1-x)2O3/Ga2O3 structure lays the foundation for future exploration of quantum physical phenomena and semiconductor device technologies based on the β-Ga2O3 material system. [ABSTRACT FROM AUTHOR]

In situ etching using Ga flux in an ultra-high vacuum environment like molecular beam epitaxy is introduced as a method to make high aspect ratio three-dimensional (3D) structures in β -Ga2O3. Etching of β -Ga2O3 due to excess Ga adatoms on the epilayer surface had been viewed as non-ideal for epitaxial growth especially since it results in plateauing and lowering of the growth rate. In this study, we use this well-known reaction from epitaxial growth to intentionally etch β -Ga2O3. We demonstrate etch rate ranging from 2.9 to 30 nm/min with the highest reported etch rate being only limited by the highest Ga flux used. Patterned in situ etching is also demonstrated and used to study the effect of fin orientation on the sidewall profiles and dopant (Si) segregation on the etched surface. Using in situ Ga etching, we also demonstrate 150 nm wide fins and 200 nm wide nanopillars with high aspect ratio. This etching method could enable future development of highly scaled vertical and lateral 3D devices in β -Ga2O3. [ABSTRACT FROM AUTHOR]

The performance of ultra-wide bandgap semiconductors like β-Ga2O3 is critically dependent on achieving high average electric fields within the active region of the device. In this article, we show that dielectrics like BaTiO3 with extremely high dielectric constant can provide an efficient field management strategy by improving the uniformity of electric field profile within the gate–drain region of lateral field-effect transistors. Using this strategy, we achieved high average breakdown field of 1.5 and 4 MV/cm at gate–drain spacing (Lgd) of 6 and 0.5~μm, respectively in β-Ga2O3, at a high channel sheet charge density of 1.6 × 1013 cm−2. The high channel charge density along with the high breakdown field enabled a record power figure of merit (Vbr2/RON) of 376 MW/cm2 at a gate–drain spacing of 3~μm. [ABSTRACT FROM AUTHOR]

Ultra-wide bandgap β-gallium oxide (Ga2O3) devices are of considerable interest with potential applications in both power electronics and radio frequency devices. However, current Ga2O3 device technologies are limited by the material's low intrinsic electron mobility and thermal conductivity. The former problem can be addressed by employing modulation-doped β-(AlxGa1−x)2O3/Ga2O3 heterostructures in the device architecture. In this work, (AlxGa1−x)2O3/Ga2O3 modulation-doped field effect transistors (MODFETs) have been investigated from a thermal perspective. Thermoreflectance thermal imaging was used to characterize the self-heating of the MODFETs. The (Al0.18Ga0.82)2O3 thermal conductivity (3.1–3.6 W/mK) was determined using a frequency domain thermoreflectance technique. Electro-thermal modeling was used to discern the effect of design parameters such as substrate orientation and channel length on the device self-heating behavior. Various thermal management schemes were evaluated using the electro-thermal device model. From an electro-thermal co-design perspective, the improvement in electrical performance followed by the mitigation of self-heating was also studied. For example, by employing a Ga2O3-on-SiC composite wafer, which was fabricated in this work, a 50% increase in power handling capability can be achieved as compared to a homoepitaxial device. Furthermore, flip-chip heterointegration and double-sided cooling approaches can lead to more than 2× improvement in the power handling capability. Using an augmented double-sided cooling design that includes nanocrystalline diamond passivation, a 5× improvement in the power handling capability can be accomplished, indicating the potential of the technology upon implementation of a suitable thermal management scheme. [ABSTRACT FROM AUTHOR]

In this Letter, we demonstrate a Pt/BaTiO3/Al0.58Ga0.42N lateral heterojunction diode with enhanced breakdown characteristics. By using BaTiO3, a high-k material, as a dielectric material between the anode and semiconductor, the peak electric field at the anode edge near the cathode was significantly reduced and an average breakdown field exceeding 8 MV/cm was achieved for devices with an anode to cathode spacing of <0.2 μm. In contrast, Pt/Al0.58Ga0.42N control Schottky diodes displayed an average breakdown field of ∼4 MV/cm for devices with similar dimensions. The use of a high-k dielectric can more effectively utilize the high breakdown fields in ultra-wide bandgap materials by proper management of the electric field. This demonstration thus provides a framework to realize ultra-scaled lateral devices with improved breakdown characteristics. [ABSTRACT FROM AUTHOR]

BaSnO3, a high mobility perovskite oxide, is an attractive material for oxide-based electronic devices. However, in addition to low-field mobility, high-field transport properties such as the saturation velocity of carriers play a major role in determining the device performance. We report on the experimental measurement of the electron saturation velocity in La-doped BaSnO3 thin films for a range of doping densities. The predicted saturation velocities based on a simple LO-phonon emission mode, using an effective LO phonon energy of 120 meV show good agreement with the measurements of velocity saturation in La-doped BaSnO3 films. Density-dependent saturation velocity in the range of 1.8 × 107 cm/s reducing to 2 × 106 cm/s is predicted for δ-doped BaSnO3 channels with carrier densities ranging from 1013 cm−2 to 2 × 1014 cm−2, respectively. These results are expected to aid the informed design of BaSnO3 as an active material for high-charge density electronic transistors. [ABSTRACT FROM AUTHOR]

• New approach to make ohmic contacts to high Al-content AlGaN channel HFETs. • First demonstration of All-MOCVD grown AlGaN channel HFETs with a graded contact layer. • Demonstration of lowest contact resistance on AlGaN channel HFETs with Al composition above 50%. We report a gate recessed Al 0.7 Ga 0.3 N/Al 0.5 Ga 0.5 N heterostructure field effect transistor (HFET) with a graded contact cap layer grown by metal organic chemical vapor deposition (MOCVD) on AlN/Sapphire substrate. A low specific contact resistivity ρ c of 2.1 × 10−5 Ω·cm2 is demonstrated with current injection from the top of the Al 0.7 Ga 0.3 N barrier to the Al 0.5 Ga 0.5 N channel. The device with a gate length of 160 nm exhibits a drain current density at gate shorted to source (I D,SS) of 420 mA/mm, a cutoff frequency f T of 20 GHz, and a maximum oscillation frequency (f max) of 40 GHz. The same device has a three terminal off-state gate-to-drain breakdown voltage of 170 V, corresponding to an average breakdown field (F BR) of 2.8 MV/cm between the gate and drain, due to drain induced barrier lowering effect. Devices with a gate length of 1 µm demonstrate a gate to drain breakdown voltage of 195 V or an average breakdown field of 3.9 MV/cm. This work provides a way to make ohmic contacts to Al-rich AlGaN channel heterojunction transistors for high power and high frequency applications. [ABSTRACT FROM AUTHOR]