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In this paper, the requirements of device cross section and aspect ratio (AR) are examined to facilitate steep switching in heavily doped 3-D multiple gate junctionless (JL) transistors. It is shown through well-calibrated simulations and physical insights that the sharp OFF-to- ON switching action is predominantly governed by the area of cross section (${A} _{\textsf {cross}}$) instead of the gate length. A 3-D JL architecture preferably oriented toward a planar topology, i.e., with wider fin and low AR, is conducive for steep switching as a greater bulk area is available for impact ionization. On the contrary, narrow vertical architectures with AR > 1 suppress ${A} _{\textsf {cross}}$ in the bulk and are less likely to support the steep current transition. Steep switching specific scaling methodology is showcased to attain a sharp increase in drain current with a sub-60 mV/decade swing in a tri-gate JL transistor along with an associated negative value of total gate capacitance. [ABSTRACT FROM AUTHOR]

The figure of merit (FOM) of a semiconductor device represents an important quality as it pertains to its performance limits and is often used to drive the technology development in a specific direction. Comparing the performances of switching power MOSFETs using their FOMs has become ubiquitous practice in power semiconductor and power electronics industries. In this paper, a critical review of the proposed power MOSFET FOMs is presented, and key limitations are discussed. It is shown that the quality factor ${Q}_{F2}={(}{\lambda {E}_{c}}/{R_{ \mathrm{\scriptscriptstyle ON},\textsf {sp}}}{)}$ along with ${Q}_{G}$ and ${T}_{j\textsf {max}}$ may be used to guide the development of future generations of power semiconductor device technologies for power electronics switching applications, where $\lambda $ and ${E}_{c}$ are the thermal conductivity and critical electric field strength for the avalanche breakdown of the semiconductor material, respectively, ${R}_{ \mathrm{\scriptscriptstyle ON},\textsf {sp}}$ is the specific on-state electrical resistance, ${Q}_{G}$ is the gate charge, and ${T}_{j\textsf {max}}$ is the maximum junction temperature of the semiconductor power device, respectively. [ABSTRACT FROM AUTHOR]

A comprehensive study on the dielectric modulated (DM) drift region for power devices is presented in this paper. The performance of this drift region structure is theoretically analyzed and compared with other two structures: conventional and superjunction. In this paper, a study is focused on switching performance. The C – V relationships during switching are analytically derived, and the depletion widths predicted by the proposed analytical model agree well with simulation in a wide reverse bias region. The switching energy loss is evaluated based on the analytical model and its accuracy is verified by 2-D simulations. An effective depletion charge QD is defined as E\mathrm {loss} / breakdown voltage (BV), from which a figure of merit (FOM) of R\mathrm{\scriptscriptstyle ON,\mathrm {sp}}{}^\ast QD is proposed to compare the performances of these different drift region structures, considering both the conduction and switching losses. The discussions in part I on Si and silicon carbide device structures are extended in part II to include FOMs. It is found that the DM drift region structures show better R\mathrm{\scriptscriptstyle ON,\mathrm {sp}} -BV tradeoffs compared with the conventional structures, but slighter inferior FOMs. However, DM structures are still attractive for applications, where switching loss is less critical than the conduction loss, such as low frequency or soft switching. [ABSTRACT FROM PUBLISHER]

The modular multilevel converter (MMC) is the most promising converter topology for medium- and high-power applications. One of the main concerns in the operation of the MMC, particularly for high-power applications, is its efficiency, which should be maximized. Silicon Carbide (SiC)-based devices have the potential to provide significant efficiency improvement compared with silicon devices. However, the possibility and impact of using SiC-based devices instead of silicon devices for high-power conversion have not been thoroughly explored. This paper reports on the results obtained from a detailed study to evaluate the performance of MMCs based on medium-voltage SiC MOSFETs and diodes with hybrid MMCs that employ silicon IGBTs and SiC diodes. The results are based on detailed circuit simulations that use simple physics-based circuit models. The study suggests the potential for significant efficiency gain for MMCs based on SiC power devices. [ABSTRACT FROM AUTHOR]

This paper presents, for the first time, the study of the application of a lateral diffused metal–oxide–semiconductor field-effect transistor (LDMOSFET) in a common-gate configuration to radio-frequency (RF) transmit/receive (T/R) switching circuits. A single-pole double-throw (SPDT) 900-MHz T/R switch is implemented using 0.25-\mu\m LDMOSFET foundry technology. Measured results show that our switching circuit can achieve a low insertion loss of 0.82 dB and a high power handling capability of 27 dBm. This result is promising in integrating power management integrated circuits, RF power amplifiers, and switching circuits in a single chip, based on LDMOSFET technology, to realize an RF transmit front-end system-on-chip solution. [ABSTRACT FROM AUTHOR]