59 results on '"Yilong Hao"'
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2. A Gas Medium Approach To Sensitivity Improvement Of MEMS-Based Thermal Acoustic Particle Velocity Sensors.
3. Toward Reliable Extraction of the Properties of Border Traps in Lateral GaN Power MOSFET with a Distributed Network Model.
4. A method for real-time measurement of seismic isolation rubber bearing based on embedded MEMS pressure sensors.
5. High-Performance Quasi-Vertical GaN Schottky Barrier Diode on Silicon Substrate with a Low Dislocation Density Drift Layer.
6. Anemometer for detection of very low speed air flow with three-dimensional directionality.
7. Design of an ultra-low pressure sensor based on the growth of graphene on silicon dioxide surface.
8. Design and simulation of MEMS thermal and vibration isolator based on PDMS beam arrays.
9. Design of a graphene capacitive pressure sensor for ultra-low pressure detection.
10. Design and simulation of corrugated diaphragm applied to the MEMS fiber optic pressure sensor.
11. Second order design of multiclass kernel machines.
12. Design and simulation of micro-platform for MEMS devices applied in shock environment.
13. Silicon-silicon anodic bonding process with embedded glass.
14. High temperature pressure sensor using a thermostable electrode.
15. A SOI sandwich differential capacitance accelerometer with low-stress package.
16. Improvement of transient response for drive loop of microgyroscope using 2-DOF PID controller.
17. Design of a novel low cross-axis sensitivity micro-gravity sandwich capacitance accelerometer.
18. Design and fabrication of a mems capacitive accelerometer based on double-device-layers SOI wafer.
19. Parylene-coated NMOSFET-embedded cantilevers for surface stress sensing in liquid environment.
20. A surface micromachining process utilizing dual metal sacrificial layer for fabrication of RF MEMS switch.
21. Fabrication of complicated three dimensional structures utilizing multi-stack bonding.
22. Programmable readout circuit for capacitive accelerometer
23. Dualfunctional MEMS optical device with compound electrostatic actuators for compact and flexible photonic networks.
24. Current collapse, memory effect free GaN HEMT.
25. Enhanced device performance of AlGaN/GaN HEMTs using thermal oxidation of electron-beam deposited aluminum for gate oxide.
26. Evidence of mobile holes on GaN HFET barrier layer surface - root cause of high power transistoramplifier current collapse.
27. Novel structural Ti/Al-based ohmic contacts on AlGaN/GaN heterostructures.
28. A study of advanced modeling methodology of CMOS-compatible RF-MEMS devices for integrated circuit design.
29. A Bulk Micromachined Si-on-glass Tunneling Accelerometer with Out-of-plane Sensing Capability.
30. 3D Nanohelix Fabrication and 3D Nanometer Assembly by Focused Ion Beam Stress-Introducing Technique.
31. A novel out-of-plane MEMS tunneling accelerometer with excellent low frequency resolution.
32. A Flip-chip Assembled Microplatform for Hybrid MEMS.
33. A Bulk Micromachined Distributed Digital Microwave Phase Shifter with Butterfly Multilayer Bridges and MAM Capacitors.
34. Simulation of profile evolution in etching-polymerization alternation in DRIE of silicon with SF6/C4F8.
35. Laterally capacity sensed accelerometer fabricated with the anodic bonding and the high aspect ratio etching.
36. Design and fabrication for inertial micro sensors.
37. Multiple Ti/Al stacks induced thermal stability enhancement in Ti/Al/Ni/Au Ohmic contact on AlGaN/GaN heterostructure.
38. Modeling of Nano-resonator Testing System by Lumped Parameter Method.
39. Design and analysis of a bulk micromachined distributed digital microwave phase shifter on glass substrate.
40. Analysis on the CTLM and LTLM applicability for GaN HEMTs structure alloyed ohmic contact resistance evaluation.
41. A bulk micromachined lateral axis gyroscope with vertical sensing comb capacitors.
42. Measurement technique of in-plane motion for MEMS based on blur image synthesis.
43. An improved electrostatically-driven micro torsion mirror fabricated by silicon micromachining for optical switching devices.
44. Measurement technique of in-plane motion for MEMS based on block matching.
45. Electroless copper plating on silicon surface for MEMS.
46. Torsion-mirror actuators with compound electrostatic driving structures.
47. Silicon-based MEMS process and standardization.
48. Design and fabrication of a torsional z-axis capacitive accelerometer with novel comb capacitor.
49. Combination of MEMS processing and electroless copper plating for a novel RF inductor.
50. 3D simulation of profile evolution in silicon DRIE.
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