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The article offers information on the International Conference on Consumer Electronics in Las Vegas, Nevada in January 2007 in which home networks issues will be discussed.

Reports on the 2004 Symposium on VLSI Technology and the accompanying VLSI Circuits Symposium to be held on the week of June 15 in Honolulu, Hawaii. Taiwan Semiconductor Manufacturing Co.'s plan to discuss the reliability concerns of using relatively porous low-k dielectrics with a k-value of 2.2; Shinichi Takagi's consideration of presenting work from Japan's government-supported MIRAI project that combines the advantages of silicon germanium.

Provides information on the call for papers of the organizers of the 10th annual International HDL Conference. Mission of the conference; Requirements for the technical papers.

Offers a look at research papers on how programmable logic could be used to create data encryption schemes, presented during the field programmable gate arrays (FPGA) 2000 conference in California. Details on the paper presented by Worcester Polytechnic Institute professor Christof Paar and graduate student Adam Elbirt; Overview of a research presented by Hea Joung Kim of University of California in Los Angeles.

The article focuses on TechInsights' issuance of a call for papers for its "MEMS in the Real World" symposium, which will be held in Boston, Massachusetts on October 27, 2008. The event's subtitle "MEMS-Enabled Systems Solutions" defines the unique role the symposium plays in the industry. The MEMS seminars have looked at a sensor or actuator in isolation.

This article reports that ultrathin displays and e-paper took center stage at the Americas Display Engineering and Applications Conference in Portland, Oregon, with researchers reporting progress and predicting a 2006 deployment. Nick Colaneri, associate director of the Flexible Display Center at Arizona State University in Tempe, Florida, outlined progress at that Army-funded center for the process development and pilot production of flexible backplanes and displays. The target technology is organic pentacene transistors that can be fabricated at a cool 90 degrees C, as well as other low-temperature formulations, for which the team uses in-house electrophoretic front-plane lamination. Conference goers also heard of advances in LCD technology and in military-grade head-mounted displays.

Reports on the digital signal processing (DSP) technologies that will be demonstrated at the 1999 DSP World Conference. Some cores selected for the Industry Technology Forum (ITF) focus on specific applications; Information on Merlin multiprocessor system from Sky Computers; Compiler for the Matlab high-level simulation tool from The MathWorks from BOPS Incorporated.

Announces the National Association of Broadcasters' (NAB) 1994 show on March 20-24, 1994. Solicitation of papers to the NAB Multimedia World Conference, NAB HDTV World Conference or the Broadcast Engineering Conference; Contact information.

Reports that Institute of Electrical and Electronic Engineers (IEEE-USA) is seeking papers covering retention and development of engineers for its 10th Biennial Conference. Date of the conference.

The article offers information on the Design Automation Conference which will be held on June 4-8, 2007 in San Diego, California.

States that the National Fluid Power Association in the U.S. calls for paper for the 2003 Industry/Educator Summit to be held on October 24-25, 2003. Theme; Contact numbers.

Previews the 1996 IEEE Solid-State Circuits Conference (ISSCC) to be held in San Francisco, California from February 8 through the 10th. Companies and their planned introductions including Hewlett-Packard, Digital and Cyrix; Dynamic random access memories (DRAM) to be released by Samsung and Mitsubishi; Informational sessions on memory to be held; Other details.

Information about several papers discussed at a conference sponsored by the International Solid State Circuits on electronics is presented. Topics include the development of microchip, wireless silicon monitor, and a device that measures waveforms. The symposium featured several engineers and researchers including Arto Nurmikko, Chris Van Hoof, and Albrecht Rothermel.

Focuses on the planned events for the Communications Design Conference from September 12 to October 02, 2003 held in San Jose, California. Participation of Intel Corp.'s vice president Eric Mentzer as keynote speaker; Discussion of wireless industry trends and the ethernet's role in metropolitan transport; Offer of in-depth tutorials; Presentation of workshops and papers; Wireless and individual focus.

Previews the European Solid-State Device Research Conference (ESSDERC) in Bordeaux, France. Argument to be made by researchers from IBM Microelectronics regarding the silicon-germanium technology in a BiCMOS process; Technology applications to be announced by SiGe company; Implication of IBM's ESSDERC paper.

The article discusses the papers presented at the International Solid-State Circuits Conference (ISSCC) held in February 2009 at the San Francisco Marriott hotel in California. One of the papers considers the introduction of Intel Corp.'s Nehalem-EX server CPU, a 2.3 billion-transistor member of its 45-nm Nehalem family. Meanwhile, another paper shows the technique described by Hideaki Saito, a principal researcher at NEC Corp., for stacking a memory chip using direct aluminum-to-copper links.

The article reports on the outcome of the Fourth Annual National Citizen Science Conference of the Society for Amateur Scientists in late August 2006. Essentially all of the attendees presented papers. Members tend to be folks who find out how the world works through experiments using equipment ranging from cardboard and tape to state-of-the-art gear, but with utmost dedication. Bill Appleby chose to find out how fabric similar to that on the Hindenburg zeppelin burns when ignited. He discovered that uncoated cotton burned faster than any of several coated versions

The article describes the use of post-silicon fixes with combined design optimizations to avoid integrated circuit yield loss, according to Ankur Srivastava, assistant professor of electrical and computer engineering. The approach was described in Srivastava's paper entitled "Variability-Driven Formulation for Simultaneous Gate Sizing and Post-Silicon Tunability Allocation," which received the best paper award at the International Symposium on Physical Design in Texas.

Information about several papers discussed at the International Symposium on Physical Design held in April 2006 in San Jose, California is presented. New chip design at 65 nanometers where temperature, voltage and process variations have dramatic impact on chip timing, manufacturability and yield were offered during the symposium. It also featured several authors from the University of California in Los Angeles and International Business Machine Research who received ISPD 2006 Best Paper Award.

Information about several papers discussed at a symposium on field programmable gate arrays (FPGA) synthesis in Monterey, California is presented. A computer-aided design researcher will show that current synthesis tools may produce circuits that are 70 to 500 times larger than the known optimal solutions in synthetic benchmarks. Another speaker will present a paper entitled "Optimality Study of Logic Synthesis for LUT-based FPGA."

Reports on 65-nanometer technology demonstrations and papers that will be presented at the 2003 VLSI Technology Symposium in June 10-12, 2003, in Kyoto, Japan. Toshiba-Sony paper describing an embedded SRAM technology at 65-nm line widths that achieves a cell size of 0.56 square micron; Motorola-Philips-ST team's presentation of its 65-nm complementary metal oxide semiconductors integration strategy.

The article presents information on the winners of the competition that was organized by the Titanium Development Association, Dayton, Ohio. The winners were announced at an awards luncheon in October during the 1990 international Conference on "Titanium Products and Applications" in Lake Buena Vista, Florida. The top three winners of the competition were; a titanium crucible for casting uranium, titanium components for paper processing, and a new denture base made from titanium. The titanium crucible for melting and casting of uranium and its alloys takes the place of ceramic crucibles, which often crack during use in vacuum induction furnaces.

Information about several papers discussed at the Car Training Institute (CTI) Symposium on Automotive Transmissions that was held at Detroit, Michigan from May 6-8, 2008 is presented. Topics include the growing role of advanced transmission technologies in the future and General Motors Corp. (GM) has presented information on its six-speed transaxles for the global market. It also features the new eight-speed planetary design from ZF GmbH and a nine-speed from Tata Motors Ltd.

The article presents abstracts of papers selected and recommended by editors of "EE Times" periodical. Papers include "Doing the DAC Thing" about the Design Automation Conference, "Bunched Nanotubes Are Good Conductors," and "Sony Launches More 1080-Progressive Displays" about high definition television sets.

The article reports on the two technical papers presented at the recent International Interconnects Technology Conference in San Francisco, California. The papers indicated the semiconductor researchers' power-saving techniques as they scale chips to smaller sizes. Researchers from Intel Corp. showed direction on how to optimize repeater and logic transistor technologies, as well as improving repeater insertion methods and applying three-dimensional integration. Another paper from Georgia Institute of Technology suggested the use of carbon nanotubes to address some of the challenges of gigascale-integration interconnects.

Reports on papers presented by researchers at the first International Conference on Hardware/Software Co-design and System Synthesis. Details of a paper delivered by JoAnn Paul on hardware design languages for system-on-chip design; Offis institute researchers' proposal of an extended SystemC synthesis subset; System for Early Analysis of SoCs methodology for front-end design and analysis.

Reports on papers covering a broad range of topics due for presentation at the 2003 International Electronic Devices Meeting from December 8 to 10 in Washington. Paper featuring pentacene-based thin-film transistors (TFT) that can be used for disposable electronics; Making of TFTs on plastic, using a plasma vapor deposition process; Creation of a sheet that provides a sense of touch for robots; Silicon nanopores for DNA detection.

Focuses on the presentation of ferro-electric memories at the International Electron Devices Meeting in San Francisco, California. Overview of the research paper from Texas Instruments, Agilent Technologies and Ramtron International; Description of volt embedded-Ferrous random access memory technology; Details of the paper of Fujitsu.

The article offers world news briefs related to semiconductor industry. The annual Bluetooth Developers Conference has displayed more than 6-7 million Bluetooth transceiver integrated circuits (ICs) despite the reduction of the participants attendance. Jan Johanson of Anoto has introduced the combined Bluetooth pen-and-paper for paper notebook and Bluetooth-enabled computer. Microsoft Corp. plans to support IEEE 802.11b radio networks in its XP operating systems.

Reports that organizers of the International Solid-State Circuits Conference are trying to understand why papers from universities and companies in Taiwan were eliminated from the conference for a fifth straight year. Total number of papers Taiwan submitted in 2001; How Nicky Lu of Etron Technologies hopes to remedy the problem; Symposium that has seen similar problems with Taiwanese submissions.

Focuses on the papers presented during the 2000 International Solid-State Circuits Conference concerning architectures that are compatible with conventional silicon processes. Details on the paper presented by Kazuo Nakazato, chief researcher at Hitachi Cambridge Laboratories; Applicability of a vertical replacement gate to scalable complementary metal oxide semiconductor logic.

Information on the papers discussed at the International Solid-State Circuits Conference is presented. Topics include the microprocessor design which could be utilized to power the supercomputer, the 5.2 GHz mainframe processor of IBM Corp., and the server chips of Intel Corp. Moreover, the conference featured various electronic companies which offer new chips and processors like Advanced Micro Devices Inc. (AMD) and Dawning Information Industry Ltd.

Information about several papers discussed at LSI Logic conference sponsored by LSI Corp. on the firm's role in the global industry held in Mountainview, California in 2010 is presented. Topics include the corporate history of LSI Logic, the recognition of the firm as the first fabless semiconductor firms, and the absorption of Toshiba's complementary metal oxide semiconductors (CMOS) process technology lock. The conference featured several LSI Corp.'s employees including Ven Lee.

Information about several papers discussed at the Society for Information Display conference is presented. Topics include the touch technologies and the future of human-machine interactivity for a diverse set of computer application. The conference featured several display experts and researchers including Bill Buxton, principal researcher at Microsoft Research, Steve Sedaker, director of Wacom's UI Solutions division, and Jennifer Colgrove, director of display technologies at DisplaySearch.

Information about several papers discussed at the annual conference of Interuniversity Microelectronics Center VZW (IMEC) is presented. Topics include the expansion of the 300 millimeter wafer clean room for the installment ASML NXE 3100 EUV lithography system and the supercomputer lab partnership with Intel Corp. The conference featured several researchers in Belgium with a speech from the IMEC president Luc Van den Hove and Leuven Mayor Louis Tobback during the fab dedication.

The article highlights the Society for Information Display conference held in summer 2008. Kent Displays Inc. displayed a cell phone with a face that incorporates one big, irregularly shaped pixel. E Ink Corp. demonstrated a Hitachi Mobile cell phone with a dot-matrix electrophoretic display e-skin. Bridgestone Corp. exhibited flexible e-paper displays based on its home grown electronic liquid powder material and quick response liquid powder displays.

Information about several papers discusses at a symposium on the cloud-based services is presented. Topics include security on the enterprise-controlled repositories and networks, vendor lock-in and standards, regulatory and legal compliance, reliability and long-term vendor commitment. The symposium featured several executives including Ross Piper, Richard Soley and Mary Sobiechowski.

Information about several papers discussed at the International Solid State Circuits Conference is presented. Topics include the production of dynamic random access memory and the introduction of flash memory. The conference featured several engineers including Cliff Smith, Giulio Casagrande, and Masao Fukuma.

Information about several papers discussed at the Advanced Telecommunications Computing Architecture summit held in Santa Clara, California in October 2007 is presented. It presents new initiatives which aimed to solicit more telecommunication original equipment manufacturer's to open standards. It also features various open telecommunication standards from telecommunication industry like Motorola Inc. Moreover, it features notable people including Brian Carr and Bart Stuck.

Information about several papers discussed at a forum the role of chipmaker Intel Corp. in the computer world is presented. The chipmaker organized its first Intel Development Forum to show the world its leadership in mobile and computing world. The forum featured several notable people including Anand Chandrasekher, Jim McGregor and Brian Tucker.

Information on the discussion of designs for biomedical devices at the International Solid-State Circuits Conference in San Francisco, California is presented. German researchers presented an artificial silicon retina consisting of 232 electrodes, that will be implanted in few patients in 2007 by Intelligent Medical Implants AG, one of the co-developers. Maurits Ortmanns, an assistant professor who discussed the paper, revealed that patients with the implant will have real visual reception.

The article reports that Rambus Inc. will reveal a technique for delivering Input/Output with power rates of 2.2 milli-watts per gigabit per second, at the 2007 International Solid-State Circuits Conference in San Francisco, California. In its prepared paper, Rambus Inc. will describe a 6-Gbit/second serializer/deserializer transceiver at 2.2 mW/Gbit/s in 90-nanometer process technology. The company believes that the technology would achieve power reduction and would deliver high performance.

Information about the paper discussed at the Bacus Photomask Technology Symposium on design-for-manufacturability (DFM) technology is presented. The speakers, including Artur Balasinski and Fedur Pikus, have discussed the complexity of DFM. They suggest the use of standardized layout elements, library cells or DFM methodology to simplify and improve the DFM.

Information about the Field Programmable Gate Arrays (FPGA) 2006 symposium in Monterey, California is presented. The Xilinx paper, presented by researcher Tim Tuan, described a research project in which Xilinx built a low-power architecture based on the company's Spartan 3 fabric. Dynamic power was on average 12 times worse for the Stratix FPGA over the range of benchmarks.

The article highlights IBM Corp.'s (IC) emphasis on electronic frequency as presented at the 2006 International Solid-State Circuits conference in San Francisco, California. IC design engineers delivered three papers that described the pending Power6 microprocessor, aimed at the company's own pSeries servers. The 65-nanometer Power6 will be launched in the four- to five-gigahertz range when servers begin shipping in 2007.

The article reports that papers and panels at the recent International Interconnect Technology Conference here showed growing fissures in the once-solid compact between the back-end-of-line (BEOL) process engineers who create the interconnect stacks in ICs and the chip designers who use them. In the past, as interconnect geometries have shrunk, process engineers have selected new materials and invented techniques to ensure chip designers would have viable metal resistance and inter metal capacitance with which to do their work. But beginning at the 65-nanometer node, BEOL engineers are retreating as the interconnect integration task goes from hard to Herculean.

This article presents information on 2003 International Electron Devices Meeting. Faced with a series of the impactful choices that must be made over the next few months, technologists at the meeting considered how to move past planar bulk to what is now being called silicon plus. At the meeting, few companies said exactly what those decisions would be, either for the 65-nanometer node, moving to early manufacturing in about two years or the 45-nanometer node, expected in late 2007. The dozen papers on strained silicon presented over the three-day conference, the meeting traveled two paths. The first is waxial or global strain, induced by depositing a graded silicon germanium layer across the entire wafer and uniaxial strain, induced locally by process optimizations.

Provides information on the 50th International Solid-State Circuits Conference that will be held on February 10, 2003 in San Francisco, California. Theme of the keynote speech that will be delivered by Gordon Moore, chairman emeritus of Intel Corp.; Paper sessions; Panels; Workshops.

Reports on the holding of the 48th International Electron Devices Meeting in San Francisco, California, from December 8-11, 2002. Topics of the opening papers session; Product introductions.

Discusses the papers presented at the 2001 VLSI Technology Symposium in Kyoto, Japan that centered on ways to introduce new gate insulators while limiting boron penetration in the channel. Work of Albert Lin of Taiwan-based National Chiao Tung University; Importance of gate oxide formation; Why companies are considering a metal, rather than polysilicon, for gate electrode.