Search

Hydrogen in β-Ga2O3 passivates shallow impurities and deep-level defects and can have a strong effect on conductivity. More than a dozen O–D vibrational lines have been reported for β-Ga2O3 treated with the heavy isotope of hydrogen, deuterium. To explain the large number of O–D centers that have been observed, the involvement of additional nearby defects and impurities has been proposed. A few O–H centers have been associated with specific impurities that were introduced intentionally during crystal growth. However, definitive assignments of O–H and O–D vibrational lines associated with important adventitious impurities, such as Si and Fe, have been difficult. A set of well-characterized Si-doped β-Ga2O3 epitaxial layers with different layer thicknesses has been deuterated and investigated by vibrational spectroscopy to provide new evidence for the assignment of a line at 2577 cm−1 to an OD–Si complex. The vibrational properties of several of the reported OD-impurity complexes are consistent with the existence of a family of defects with a V Ga 1 ic − D center at their core that is perturbed by a nearby impurity. [ABSTRACT FROM AUTHOR]

The low thermal conductivity of β-Ga2O3 is a significant concern for maximizing the potential of this ultra-wide bandgap semiconductor as a power switching device technology. Here, we report on the use of nanocrystalline diamond (NCD) deposited via microwave plasma enhanced chemical vapor deposition (MP-CVD) as a top-side, device-level thermal management solution on a lateral β-Ga2O3 transistor. NCD was grown via MP-CVD on β-(AlxGa1−x)2O3/β-Ga2O3 heterostructures prior to the gate formation of the field-effect transistor. A reduced growth temperature of 400 °C and a SiNx barrier layer were used to protect the oxide semiconductors from etching in the MP-CVD H2 plasma environment. Raman spectroscopy showed a highly sp3-bonded NCD film was obtained at 400 °C, with grain size of about 50–100 nm imaged via atomic force microscopy. The incorporation of the NCD heat-spreading layer resulted in a β-(AlxGa1−x)2O3/β-Ga2O3 heterostructure field-effect transistor showing a decrease in the total thermal resistance at the gate by 42%. The fabrication process, including the NCD etch in the gate region, will need to be improved to minimize the impact of these processes on important device characteristics (i.e., drain current, threshold voltage, and leakage current). [ABSTRACT FROM AUTHOR]

This work demonstrates direct, rapid 2D thermal mapping measurement capabilities of the ultrawide bandgap semiconductor channel of lateral β-(AlxGa1−x)2O3/Ga2O3 transistors without sample contamination, long acquisition times, or sophisticated thermometry such as developing deep-ultra-violet compatible thermoreflectance systems. The temperature rise in the channel of a β-(Al0.21Ga0.79)2O3/Ga2O3 heterostructure field-effect transistor (HFET) was mapped using thermoreflectance imaging at 470 nm. First, the thermoreflectance response of the HFET channel was measured using a monochromator, revealing a maximum of the reflectance change around 470–480 nm. Thermoreflectance calibrations were then performed at 470 nm (peak of the reflectance change) and yielded an average thermoreflectance coefficient of 1.06 ± 0.07 × 10−4 K−1. Subsequent measurements of the device (power densities of 0.15–1.47 W/mm and gate-source voltage of 0 V) enabled extraction of a device-level thermal resistance of 51.1 mm·K/W in the channel at the drain-side of the gate. High-resolution, in situ scanning thermal microscopy measurements of the channel temperature rise show good agreement with and further support the thermoreflectance measurements. Finally, the thermal profile across the entire device length (metal electrodes and semiconductor channel) and width was simultaneously measured using thermoreflectance imaging at 470 nm, and the peak temperature rise was measured in the channel at the drain-side of the gate electrode. [ABSTRACT FROM AUTHOR]

The effect of heteroepitaxial β-(AlxGa1−x)2O3 film thickness and Al content on surface morphology was characterized to experimentally determine the critical thickness limitations of the (010) β-(AlxGa1−x)2O3/Ga2O3 heterostructure. High-resolution x-ray diffraction was used to assess the strain state of the films; reciprocal space mapping (RSM) revealed that even cracked films were still fully strained. In cracked films, diffuse scattering was observed in RSMs, indicating lattice tilting. Cracking of the films was investigated using atomic force microscopy (AFM), x-ray topography (XRT), bright-field scanning transmission electron microscopy (BF-STEM), and high-resolution transmission electron microscopy. Using both AFM and XRT, the [001] direction was observed to be the most prevalent crack direction; however, cracks were also observed in the [100] direction. In uncracked regions of the films, XRT revealed the alignment of threading dislocations along the [001] direction. Cross-sectional imaging of the crack geometry and propagation was performed using BF-STEM, and it was observed that the cracks in the [001] direction extended through the thickness of the β-(AlxGa1−x)2O3 film (∼205 nm) and a further ∼100–200 nm into the β-Ga2O3 substrate. Experimental data for critical film thickness showed good agreement with previous theoretical calculations based on the Griffith criterion for crack propagation. [ABSTRACT FROM AUTHOR]

NiO/β-(AlxGa1−x)2O3/Ga2O3 heterojunction lateral geometry rectifiers with diameter 50–100 μm exhibited maximum reverse breakdown voltages >7 kV, showing the advantage of increasing the bandgap using the β-(AlxGa1−x)2O3 alloy. This Si-doped alloy layer was grown by metal organic chemical vapor deposition with an Al composition of ∼21%. On-state resistances were in the range of 50–2180 Ω cm2, leading to power figures-of-merit up to 0.72 MW cm−2. The forward turn-on voltage was in the range of 2.3–2.5 V, with maximum on/off ratios >700 when switching from 5 V forward to reverse biases up to −100 V. Transmission line measurements showed the specific contact resistance was 0.12 Ω cm2. The breakdown voltage is among the highest reported for any lateral geometry Ga2O3-based rectifier. [ABSTRACT FROM AUTHOR]

Halide vapor phase epitaxial (HVPE) Ga2O3 films were grown on c-plane sapphire and diamond substrates at temperatures up to 550 °C without the use of a barrier dielectric layer to protect the diamond surface. Corundum phase α-Ga2O3 was grown on the sapphire substrates, whereas the growth on diamond resulted in regions of nanocrystalline β-Ga2O3 (nc-β-Ga2O3) when oxygen was present in the HVPE reactor only during film growth. X-ray diffraction confirmed the growth of α-Ga2O3 on sapphire but failed to detect any β-Ga2O3 reflections from the films grown on diamond. These films were further characterized via Raman spectroscopy, which revealed the β-Ga2O3 phase of these films. Transmission electron microscopy demonstrated the nanocrystalline character of these films. From cathodoluminescence spectra, three emission bands, UVL′, UVL, and BL, were observed for both the α-Ga2O3/sapphire and nc-Ga2O3/diamond, and these bands were centered at approximately 3.7, 3.2, and 2.7 eV. [ABSTRACT FROM AUTHOR]

Activation of implanted donors into a highly-resistive, nitrogen-doped homoepitaxial β-Ga2O3 has been investigated. Nitrogen acceptors with the concentration of ∼1017 cm−3 were incorporated during epitaxial growth yielding low-doped (net donor concentration <1014 cm−3) films subsequently implanted with Si, Ge, and Sn. Upon Ohmic contact formation to the implanted regions, sheet resistance values of 314, 926, and 1676 Ω/sq were measured at room temperature for the Si-, Ge-, and Sn-implanted samples, respectively. Room temperature Hall measurements resulted in sheet carrier concentrations and Hall mobilities of 2.13 × 1014 /93, 8.58 × 1013/78, and 5.87 × 1013/63 cm2/(V s), respectively, for these three donor species. Secondary ion mass spectroscopy showed a volumetric dopant concentration of approximately 2 × 1019 cm−3 for the three species, resulting in carrier activation efficiencies of 64.7%, 40.3%, and 28.2% for Si, Ge, and Sn, respectively. Temperature-dependent Hall effect measurements ranging from 15 to 300 K showed a nearly constant carrier concentration in the Si-implanted sample, suggesting the formation of an impurity band indicative of degenerate doping. With a bulk carrier concentration of 1.3 × 1019 cm−3 for the Si implanted sample, a room temperature mobility of 93 cm2/(V s) is among the highest reported in Ga2O3 with a similar carrier concentration. The unimplanted Ga2O3:N regions remained highly resistive after the surrounding areas received implant and activation anneal. These results open the pathway for fabricating Ga2O3 devices through the selective n-type doping in highly resistive epitaxial Ga2O3. [ABSTRACT FROM AUTHOR]

β-Ga2O3 is an emerging ultra-wide bandgap semiconductor, holding a tremendous potential for power-switching devices for next-generation high power electronics. The performance of such devices strongly relies on the precise control of electrical properties of β-Ga2O3, which can be achieved by implantation of dopant ions. However, a detailed understanding of the impact of ion implantation on the structure of β-Ga2O3 remains elusive. Here, using aberration-corrected scanning transmission electron microscopy, we investigate the nature of structural damage in ion-implanted β-Ga2O3 and its recovery upon heat treatment with the atomic-scale spatial resolution. We reveal that upon Sn ion implantation, Ga2O3 films undergo a phase transformation from the monoclinic β-phase to the defective cubic spinel γ -phase, which contains high-density antiphase boundaries. Using the planar defect models proposed for the γ -Al2O3, which has the same space group as β-Ga2O3, and atomic-resolution microscopy images, we identify that the observed antiphase boundaries are the {100}1/4 ⟨110⟩ type in cubic structure. We show that post-implantation annealing at 1100 °C under the N2 atmosphere effectively recovers the β-phase; however, nano-sized voids retained within the β-phase structure and a γ -phase surface layer are identified as remanent damage. Our results offer an atomic-scale insight into the structural evolution of β-Ga2O3 under ion implantation and high-temperature annealing, which is key to the optimization of semiconductor processing conditions for relevant device design and the theoretical understanding of defect formation and phase stability. [ABSTRACT FROM AUTHOR]

This Review highlights basic and transition metal conducting and semiconducting oxides. We discuss their material and electronic properties with an emphasis on the crystal, electronic, and band structures. The goal of this Review is to present a current compilation of material properties and to summarize possible uses and advantages in device applications. We discuss Ga2O3, Al2O3, In2O3, SnO2, ZnO, CdO, NiO, CuO, and Sc2O3. We outline the crystal structure of the oxides, and we present lattice parameters of the stable phases and a discussion of the metastable polymorphs. We highlight electrical properties such as bandgap energy, carrier mobility, effective carrier masses, dielectric constants, and electrical breakdown field. Based on literature availability, we review the temperature dependence of properties such as bandgap energy and carrier mobility among the oxides. Infrared and Raman modes are presented and discussed for each oxide providing insight into the phonon properties. The phonon properties also provide an explanation as to why some of the oxide parameters experience limitations due to phonon scattering such as carrier mobility. Thermal properties of interest include the coefficient of thermal expansion, Debye temperature, thermal diffusivity, specific heat, and thermal conductivity. Anisotropy is evident in the non-cubic oxides, and its impact on bandgap energy, carrier mobility, thermal conductivity, coefficient of thermal expansion, phonon modes, and carrier effective mass is discussed. Alloys, such as AlGaO, InGaO, (AlxInyGa1−x−y)2O3, ZnGa2O4, ITO, and ScGaO, were included where relevant as they have the potential to allow for the improvement and alteration of certain properties. This Review provides a fundamental material perspective on the application space of semiconducting oxide-based devices in a variety of electronic and optoelectronic applications. [ABSTRACT FROM AUTHOR]

Fundamental research and development of ultra-wide bandgap (UWBG) semiconductor devices are under way to realize next-generation power conversion and wireless communication systems. Devices based on aluminum gallium nitride (AlxGa1−xN, x is the Al composition), β-phase gallium oxide (β-Ga2O3), and diamond give promise to the development of power switching devices and radio frequency power amplifiers with higher performance and efficiency than commercial wide bandgap semiconductor devices based on gallium nitride (GaN) and silicon carbide (SiC). However, one of the most critical challenges for the successful deployment of UWBG device technologies is to overcome adverse thermal effects that impact the device performance and reliability. Overheating of UWBG devices originates from the projected high power density operation and poor intrinsic thermal properties of AlxGa1−xN and β-Ga2O3. This Perspective delineates the need and process for the "electro-thermal co-design" of laterally configured UWBG electronic devices and provides a comprehensive review of current state-of-the-art thermal characterization methods, device thermal modeling practices, and both device- and package-level thermal management solutions. [ABSTRACT FROM AUTHOR]

Thin monoclinic Ga2O3 films were deposited on c-plane sapphire substrates by low pressure chemical vapor deposition. The thin films were synthesized using high purity metallic gallium (Ga) and oxygen gas (O2) as precursors. The effect of oxygen volume percentage on the growth rate of thin films was observed at two growth temperatures. Within the investigated growth window, a maximum growth rate of ∼2.9 μm/h was obtained for an oxygen volume percentage of 4.8% with a growth temperature at 800 °C. The film growth rate decreased as growth temperature increased when other growth parameters were kept the same. X-ray diffraction indicates that all films have the β-Ga2O3 structure with (−201) orientation, and those deposited with higher oxygen partial pressure are thicker and have improved crystalline quality. Polarized micro-Raman scattering is consistent with small grains of (−201) β-Ga2O3 having random in-plane orientations. The large variation of the relative intensities of overlapping emission bands contributing to the broad luminescence emission extending between 1.5 and 4.5 eV (∼825 and 275 nm) suggest that deposition conditions strongly affect different defect concentrations. Films deposited at 800 °C with a higher oxygen partial pressure yielded higher resistance, which may result from the incorporation of gallium vacancies, identified as a compensating point defect affecting the electrical conductivity of bulk monoclinic Ga2O3. [ABSTRACT FROM AUTHOR]

Heterojunction field-effect transistors based on the β-(AlxGa1−x)2O3/Ga2O3 heterostructure grown by ozone-assisted molecular beam epitaxy were demonstrated for the first time. Al composition ratios in the 14%–23% range were validated using x-ray diffraction on the three samples grown for this study. Electrochemical capacitance-voltage (ECV) measurements showed the presence of a charge sheet in the delta-doped (AlxGa1−x)2O3 barrier layer. Secondary ion mass spectroscopy and ECV measurements also revealed an unintentional Si peak at the (AlxGa1−x)2O3/Ga2O3 interface. Direct current (IDS-VGS) and transconductance (Gm-VGS) measurements demonstrated depletion-mode transistor operation as well as the presence of a parallel conduction channel. A one-dimensional Poisson model suggested that dopant redistribution in the delta-doped region could cause a secondary channel to form in the barrier in addition to the primary channel near the (AlxGa1−x)2O3/Ga2O3 interface under certain conditions met in these samples. Fabricated devices on sample A did not exhibit breakdown up to the measurement limit of 1100 V, with stability after ten cycles. A maximum output drain current density of 22 mA/mm was measured on sample B. Room temperature Hall measurements yielded a sheet carrier density of 1.12 × 1013 cm−2 with corresponding Hall mobility of 95 cm2/V s in sample C. [ABSTRACT FROM AUTHOR]

The development of high thermal conductivity thin film materials for the thermal management of electronics requires accurate and precise methods for characterizing heat spreading capability, namely, in-plane thermal conductivity. However, due to the complex nature of thin film thermal property measurements, resolving the in-plane thermal conductivity of high thermal conductivity anisotropic thin films with high accuracy is particularly challenging. Capable transient techniques exist; however, they usually measure thermal diffusivity and require heat capacity and density to deduce thermal conductivity. Here, we present an explicit uncertainty analysis framework for accurately resolving in-plane thermal conductivity via two independent steady-state thermometry techniques: particle-assisted Raman thermometry and electrical resistance thermometry. Additionally, we establish error-based criteria to determine the limiting experimental conditions that permit the simplifying assumption of one-dimensional thermal conduction to further reduce thermal analysis. We demonstrate the accuracy and precision (<5% uncertainty) of both steady-state techniques through in-plane thermal conductivity measurements of anisotropic nanocrystalline diamond thin films. [ABSTRACT FROM AUTHOR]

The design of β-Ga2O3-based modulation-doped field effect transistors is discussed with a focus on the role of self-heating and resultant modification of the electron mobility profile. Temperature- and doping-dependent model of the electron mobility as well as temperature- and orientation-dependent approximations of the thermal conductivity of β-Ga2O3 are presented. A decrease in drain current was attributed to a position-dependent mobility reduction caused by a coupled self-heating mechanism and a high electric-field mobility reduction mechanism. A simple thermal management solution is presented where heat is extracted through the source contact metal. Additionally, it is shown that an undesired secondary channel can form at the modulation-doped layer that is distinguished by an inflection in the transconductance curve. [ABSTRACT FROM AUTHOR]

One of the major challenges in β-Ga2O3-based high power and high frequency devices is anticipated to be related to the low thermal conductivity of the material which is on the order of 10–30 W/m K. The use of diamond (thermal conductivity ∼2000 W/m K) as a substrate can be one effective approach for achieving better thermal management in β-Ga2O3-based devices. In this work, low pressure chemical vapor deposition was used to grow β-Ga2O3 films on (100) oriented, single-crystalline diamond substrates. A two-step growth technique was employed to avoid the oxidation of the diamond surface at high temperatures. From x-ray diffraction measurements, the β-Ga2O3 films grew along the ⟨ − 201 ⟩ crystalline axis with the β-Ga2O3 (002) planes rotated by ±24.3–27° with respect to the diamond (111) planes. High-magnification scanning transmission electron microscopy imaging revealed an abrupt β-Ga2O3/diamond interface without any voids which is essential for the high rate of heat transfer across the interface. N-type electrical conductivity was measured in a Si-doped β-Ga2O3 film with 1.4 × 1019 cm−3 electron concentration and ∼3 cm2/V s electron mobility. This work demonstrates the feasibility of heteroepitaxy of β-Ga2O3 films on diamond substrates for potential device design and device fabrication with efficient thermal management. [ABSTRACT FROM AUTHOR]

Recent breakthroughs in bulk crystal growth of the thermodynamically stable beta phase of gallium oxide (β-Ga2O3) have led to the commercialization of large-area β-Ga2O3 substrates with subsequent epitaxy on (010) substrates producing high-quality films. Still, metalorganic chemical vapor deposition, molecular beam epitaxy, and processing of the (010) β-Ga2O3 surface are known to form subnanometer-scale facets along the [001] direction as well as larger ridges with features perpendicular to the [001] direction. A density function theory calculation of the (010) surface shows an ordering of the surface as a subnanometer-scale feature along the [001] direction. Additionally, the general crystal structure of β-Ga2O3 is presented, and recommendations are presented for standardizing (010) substrates to account for and control the larger-scale ridge formation. [ABSTRACT FROM AUTHOR]

Tuning the optical, electronic, and long-wavelength properties of group-III nitride alloys can be achieved by alloying AlN with ScN. We report here on the infrared dielectric functions determined from spectroscopic ellipsometry of (0001) wurtzite ScxAl1−xN with compositions of 0 ≤ x ≤ 0.20 grown by molecular beam epitaxy on c-plane sapphire substrates. We also report the optical phonons and their parameters determined in our analysis and compare with those in the previous literature. We find that all phonons shift to a lower wavenumber as a function of scandium incorporation, and we also see evidence of a decrease in crystal quality. Further, we report the high frequency and static dielectric constants and the Born effective charge as well as their evolution with the scandium content. [ABSTRACT FROM AUTHOR]

The first step of a multi-cycle rapid thermal annealing process was systematically studied. The surface, structure, and optical properties of Mg implanted GaN thin films annealed at temperatures ranging from 900 to 1200 °C were investigated by Raman spectroscopy, photoluminescence, UV-visible spectroscopy, atomic force microscopy, and Nomarski microscopy. The GaN thin films are capped with two layers of in-situ metal organic chemical vapor deposition -grown AlN and annealed in 24 bar of N2 overpressure to avoid GaN decomposition. The crystal quality of the GaN improves with increasing annealing temperature as confirmed by UV-visible spectroscopy and the full widths at half maximums of the E2 and A1 (LO) Raman modes. The crystal quality of films annealed above 1100 °C exceeds the quality of the as-grown films. At 1200 °C, Mg is optically activated, which is determined by photoluminescence measurements. However, at 1200 °C, the GaN begins to decompose as evidenced by pit formation on the surface of the samples. Therefore, it was determined that the optimal temperature for the first step in a multi-cycle rapid thermal anneal process should be conducted at 1150 °C due to crystal quality and surface morphology considerations. [ABSTRACT FROM AUTHOR]

Valence and conduction band offsets of atomic layer deposition (ALD) Al2O3 deposited on bulk AlN crystals were determined using x-ray photoelectron spectroscopy to be ΔEV = 0.75 eV and ΔEC = −1.45 eV, with a measured energy gap of the Al2O3 film of 6.9 eV. In addition, crystalline AlN deposited by atomic layer epitaxy on sapphire was evaluated, resulting in a valence band offset of ΔEV = −0.75 eV and a conduction band offset of ΔEC = 3.25 eV due to the wider bandgap of the crystalline Al2O3 substrate compared to amorphous ALD Al2O3. Both heterojunctions exhibited type-II behavior and similar valence band offsets. [ABSTRACT FROM AUTHOR]

Ion implantation-induced effects were studied in Ge implanted β-Ga2O3 with the fluence and energy of 3 × 1013 cm−2/60 keV, 5 × 1013 cm−2/100 keV, and 7 × 1013 cm−2/200 keV using analytical electron microscopy via scanning/transmission electron microscopy, electron energy loss spectroscopy, and precession electron diffraction via TopSpin. Imaging shows an isolated band of damage after Ge implantation, which extends ∼130 nm from the sample surface and corresponds to the projected range of the ions. Electron diffraction demonstrates that the entirety of the damage band is the κ phase, indicating an implantation-induced phase transition from β to κ-Ga2O3. Post-implantation annealing at 1150 °C for 60 s under the O2 atmosphere led to a back transformation of κ to β; however, an ∼17 nm damage zone remained at the sample surface. Despite the back transformation from κ to β with annealing, O K-edge spectra show changes in the fine structure between the pristine, implanted, and implanted-annealed samples, and topspin strain analysis shows a change in strain between the two samples. These data indicate differences in the electronic/chemical structure, where the change of the oxygen environment extended beyond the implantation zone (∼130 nm) due to the diffusion of Ge into the bulk material, which, in turn, causes a tensile strain of 0.5%. This work provides a foundation for understanding of the effects of ion implantation on defect/phase evolution in β-Ga2O3 and the related recovery mechanism, opening a window toward building a reliable device for targeted applications. [ABSTRACT FROM AUTHOR]

Gallium oxide (Ga2O3) has attracted great attention for electronic device applications due to its ultra-wide bandgap, high breakdown electric field, and large-area affordable substrates grown from the melt. However, its thermal conductivity is significantly lower than that of other wide bandgap semiconductors such as SiC, AlN, and GaN, which will impact its ability to be used in high power density applications. Thermal management in Ga2O3 electronics will be the key for device reliability, especially for high power and high frequency devices. Similar to the method of cooling GaN-based high electron mobility transistors by integrating it with high thermal conductivity diamond substrates, this work studies the possibility of heterogeneous integration of Ga2O3 with diamond for the thermal management of Ga2O3 devices. In this work, Ga2O3 was deposited onto single crystal diamond substrates by atomic layer deposition (ALD), and the thermal properties of ALD-Ga2O3 thin films and Ga2O3–diamond interfaces with different interface pretreatments were measured by Time-domain Thermoreflectance. We observed a very low thermal conductivity of these Ga2O3 thin films (about 1.5 W/m K) due to the extensive phonon grain boundary scattering resulting from the nanocrystalline nature of the Ga2O3 film. However, the measured thermal boundary conductance (TBC) of the Ga2O3–diamond interfaces is about ten times larger than that of the van der Waals bonded Ga2O3–diamond interfaces, which indicates the significant impact of interface bonding on TBC. Furthermore, the TBC of the Ga-rich and O-rich Ga2O3–diamond interfaces is about 20% smaller than that of the clean interface, indicating that interface chemistry affects the interfacial thermal transport. Overall, this study shows that a high TBC can be obtained from strong interfacial bonds across Ga2O3–diamond interfaces, providing a promising route to improving the heat dissipation from Ga2O3 devices with lateral architectures. [ABSTRACT FROM AUTHOR]

Because of its ultra-wide bandgap, high breakdown electric field, and large-area affordable substrates grown from the melt, β-Ga2O3 has attracted great attention recently for potential applications of power electronics. However, its thermal conductivity is significantly lower than those of other wide bandgap semiconductors, such as AlN, SiC, GaN, and diamond. To ensure reliable operation with minimal self-heating at high power, proper thermal management is even more essential for Ga2O3 devices. Similar to the past approaches aiming to alleviate self-heating in GaN high electron mobility transistors, a possible solution has been to integrate thin Ga2O3 membranes with diamond to fabricate Ga2O3-on-diamond lateral metal-semiconductor field-effect transistor or metal-oxide-semiconductor field-effect transistor devices by taking advantage of the ultra-high thermal conductivity of diamond. Even though the thermal boundary conductance (TBC) between wide bandgap semiconductor devices and a diamond substrate is of primary importance for heat dissipation in these devices, fundamental understanding of the Ga2O3-diamond thermal interface is still missing. In this work, we study the thermal transport across the interfaces of Ga2O3 exfoliated onto a single crystal diamond. The van der Waals bonded Ga2O3-diamond TBC is measured to be 17 −1.7/+2.0 MW/m2 K, which is comparable to the TBC of several physical-vapor-deposited metals on diamond. A Landauer approach is used to help understand phonon transport across a perfect Ga2O3-diamond interface, which in turn sheds light on the possible TBC one could achieve with an optimized interface. A reduced thermal conductivity of the Ga2O3 nano-membrane is also observed due to additional phonon-membrane boundary scattering. The impact of the Ga2O3–substrate TBC and substrate thermal conductivity on the thermal performance of a power device is modeled and discussed. Without loss of generality, this study is not only important for Ga2O3 power electronics applications which would not be realistic without a thermal management solution but also for the fundamental thermal science of heat transport across van der Waals bonded interfaces. [ABSTRACT FROM AUTHOR]

The coefficients of thermal expansion (CTEs) of single crystalline, monoclinic β-Ga2O3 were determined by employing high-resolution X-ray diffraction measurements. This work reports the CTE measurements on a single crystalline β-Ga2O3 substrate. The CTE values along the "a," "b," and "c" axes are 3.77 × 10−6 °C−1, 7.80 × 10−6 °C−1, and 6.34 × 10−6 °C−1, respectively, and the CTE of the angle β (the angle between the "a" and "c" axes) is determined to be 1.31 × 10−4 ° K−1. All CTE values reported here are linear under the temperature regime between room temperature and 1000 °C. All measurements were performed in a controlled nitrogen gas environment, and no surface degradation was observed after these measurements. Thermal strain calculations with different material combinations involving β-Ga2O3 are also presented relevant to both epitaxial and wafer bonding applications for Si, InP, 3C–SiC, 6H–SiC, GaN, and sapphire. [ABSTRACT FROM AUTHOR]

Threading and basal dislocations were observed and their Burgers vectors ( b → ) were analyzed in 20 µm thick halide vapor phase homoepitaxially grown beta-gallium oxide (β−Ga2O3) films using 15 keV monochromatic synchrotron X-ray topography with symmetric reflection (004) and two asymmetric reflections (205) and (115) in back-reflection and grazing incidence angle geometries, respectively. In a 1 × 1.5 cm2 sample, threading screw dislocations with b → = 001 were observed with a density of 30 cm−2, whereas a single threading edge dislocation with b → = 100 was observed. Basal dislocations with b → = 1 2 112 were observed with a density of ∼20 cm−2, and a single basal dislocation with b → = 010 was observed. Rocking curve mapping of the three reflections was also performed on the entire sample with the same setup and a high resolution x-ray camera to obtain the full width at half maximum (FWHM), strain, and curvature maps in two almost orthogonal directions. The epilayer demonstrated excellent crystalline quality with a median FWHM of 8.2 arc sec in the (004) reflection and a very low median strain of ∼|8 × 10−5| obtained from both sample directions. The median radius of curvature was ∼−100 m along the [100] direction and ∼280 m along the [010] sample axis, indicating very low lattice plane curvature that enables high manufacturability and reliability of devices. [ABSTRACT FROM AUTHOR]

Semi-insulating halide vapor phase epitaxial β-Ga2O3 films without intentional dopants introduced during growth are demonstrated. The sheet resistance measured in the 340–480 K range yielded 268–134 kΩ/◻ and an activation energy of 0.81 eV. Room temperature capacitance-voltage measurements at 1 MHz showed evidence of an ultra-low free carrier concentration n-type film with a free carrier concentration near flatband (VFB ∼ 4.4 V) estimated to be <1014 cm−3, resulting in a high breakdown voltage of 2380 V (3.18 MV/cm) measured on a lateral diode without field termination. Secondary ion mass spectroscopy did not reveal Fe compensating species; however, an average Si concentration of about 5 × 1015 cm−3 and an N concentration of about 2 × 1017 cm−3 were detected, suggesting that N acceptors compensated Si donors to result in a nearly intrinsic β-Ga2O3 film. Photoionization spectroscopy suggested the presence of a deep acceptor-like level located at Ec −0.23 eV. [ABSTRACT FROM AUTHOR]

The electrical quality of HfO2 dielectrics grown by thermal atomic layer deposition at 175 °C on n-type (201) β-Ga2O3 has been studied through capacitance- and current-voltage measurements on metal-oxide-semiconductor capacitors. These capacitors exhibited excellent electrical characteristics, including dual-sweep capacitance-voltage curves with low hysteresis and stretch-out and a frequency-stable dielectric constant of k ~14 when measured between 10 kHz and 1MHz. The C-V curves exhibited a uniform and repeatable +1.05V shift relative to the ideal case when swept from 3.5 to ~5V, yielding positively measured flatband (+2.15 V) and threshold (+1.05 V) voltages that may be useful for normally off n-channel Ga2O3 devices. Using the Terman method, an average interface trap density of 1.3 x 1011 cm-2eV-1 was obtained between 0.2 and 0.6 eV below the conduction band edge. The forward bias current-voltage characteristic was successfully fitted to the Fowler-Nordheim tunneling model at a field strength of 5MV/cm, allowing an extraction of a 1.3 eV conduction band offset between HfO2 and Ga2O3, which matches the value previously determined from x-ray photoelectron spectroscopy. However, a temperature dependence in the leakage current was observed. These results suggest that HfO2 is an appealing dielectric for Ga2O3 device applications. [ABSTRACT FROM AUTHOR]

The electrical quality of HfO2 dielectrics grown by thermal atomic layer deposition at 175 °C on n-type (201) β-Ga2O3 has been studied through capacitance- and current-voltage measurements on metal-oxide-semiconductor capacitors. These capacitors exhibited excellent electrical characteristics, including dual-sweep capacitance-voltage curves with low hysteresis and stretch-out and a frequency-stable dielectric constant of k ~14 when measured between 10 kHz and 1MHz. The C-V curves exhibited a uniform and repeatable +1.05V shift relative to the ideal case when swept from 3.5 to ~5V, yielding positively measured flatband (+2.15 V) and threshold (+1.05 V) voltages that may be useful for normally off n-channel Ga2O3 devices. Using the Terman method, an average interface trap density of 1.3 x 1011 cm-2eV-1 was obtained between 0.2 and 0.6 eV below the conduction band edge. The forward bias current-voltage characteristic was successfully fitted to the Fowler-Nordheim tunneling model at a field strength of 5MV/cm, allowing an extraction of a 1.3 eV conduction band offset between HfO2 and Ga2O3, which matches the value previously determined from x-ray photoelectron spectroscopy. However, a temperature dependence in the leakage current was observed. These results suggest that HfO2 is an appealing dielectric for Ga2O3 device applications. [ABSTRACT FROM AUTHOR]

This paper presents the heteroepitaxial growth of ultrawide bandgap β-Ga2O3 thin films on c-plane sapphire substrates by low pressure chemical vapor deposition. N-type conductivity in silicon (Si)-doped β-Ga2O3 films grown on sapphire substrate is demonstrated. The thin films were synthesized using high purity metallic gallium (Ga) and oxygen (O2) as precursors. The morphology, crystal quality, and properties of the as-grown thin films were characterized and analyzed by field emission scanning electron microscopy, X-ray diffraction, electron backscatter diffraction, photoluminescence and optical, photoluminescence excitation spectroscopy, and temperature dependent van der Pauw/Hall measurement. The optical bandgap is ∼4.76 eV, and room temperature electron mobility of 42.35 cm²/V s was measured for a Si-doped heteroepitaxial β-Ga2O3 film with a doping concentration of 1.32×1018 cm-3. [ABSTRACT FROM AUTHOR]

This paper presents the homoepitaxial growth of phase pure (010) β-Ga2O3 thin films on (010) β-Ga2O3 substrate by low pressure chemical vapor deposition. The effects of growth temperature on the surface morphology and crystal quality of the thin films were systematically investigated. The thin films were synthesized using high purity metallic gallium (Ga) and oxygen (O2) as precursors for gallium and oxygen, respectively. The surface morphology and structural properties of the thin films were characterized by atomic force microscopy, X-ray diffraction, and high resolution transmission electron microscopy. Material characterization indicates the growth temperature played an important role in controlling both surface morphology and crystal quality of the β-Ga2O3 thin films. The smallest root-mean-square surface roughness of ~7 nm was for thin films grown at a temperature of 950 °C, whereas the highest growth rate (~1.3 lm/h) with a fixed oxygen flow rate was obtained for the epitaxial layers grown at 850 °C. [ABSTRACT FROM AUTHOR]

Heterojunctions of p+ B-doped nanocrystalline diamond (NCD) to n- 4H-SiC were studied by electrical and cathodoluminescence (CL) methods. Current rectification at 30 °C had a curvature coefficient γ0 of 42.1 V-1 at zero bias, γmax of 105.35 V-1 at 0.2 V, and a reverse current of <10 nA/cm2. The NCD sheet resistance decreased from 4.1×1011 to 403.56 Ω/sq. as the carrier density Ns was increased from 3.5×105 to 1.5×1016 cm-2 by B2H6 doping. The 348 cm2/V-s mobility of the B-free NCD films was comparable to that of single crystal diamond. CL data revealed traps 0.6-0.8 eV from the NCD EV edge. [ABSTRACT FROM AUTHOR]

A heterojunction between thin films of nanocrystalline diamond (NCD) and 4H-SiC has been developed. Undoped and B-doped NCDs were deposited on both n- and p- SiC epilayers. I-V measurements on p+ NCD/n- SiC indicated Schottky rectifying behavior with a turn-on voltage of around 0.2 V. The current increased over eight orders of magnitude with an ideality factor of 1.17 at 30 °C. Ideal energy-band diagrams suggested a possible conduction mechanism for electron transport from the SiC conduction band to either the valence band or acceptor level of the NCD film. Applications as an UV semitransparent electrical contact to 4H-SiC are discussed. [ABSTRACT FROM AUTHOR]

Gallium oxide (Ga2O3) is emerging as a viable candidate for certain classes of power electronics, solar blind UV photodetectors, solar cells, and sensors with capabilities beyond existing technologies due to its large bandgap. It is usually reported that there are five different polymorphs of Ga2O3, namely, the monoclinic (β-Ga2O3), rhombohedral (α), defective spinel (γ), cubic (δ), or orthorhombic (ε) structures. Of these, the β-polymorph is the stable form under normal conditions and has been the most widely studied and utilized. Since melt growth techniques can be used to grow bulk crystals of β-GaO3, the cost of producing larger area, uniform substrates is potentially lower compared to the vapor growth techniques used to manufacture bulk crystals of GaN and SiC. The performance of technologically important high voltage rectifiers and enhancement-mode Metal-Oxide Field Effect Transistors benefit from the larger critical electric field of β-Ga2O3 relative to either SiC or GaN. However, the absence of clear demonstrations of p-type doping in Ga2O3, which may be a fundamental issue resulting from the band structure, makes it very difficult to simultaneously achieve low turn-on voltages and ultra-high breakdown. The purpose of this review is to summarize recent advances in the growth, processing, and device performance of the most widely studied polymorph, β-Ga2O3. The role of defects and impurities on the transport and optical properties of bulk, epitaxial, and nanostructures material, the difficulty in p-type doping, and the development of processing techniques like etching, contact formation, dielectrics for gate formation, and passivation are discussed. Areas where continued development is needed to fully exploit the properties of Ga2O3 are identified. [ABSTRACT FROM AUTHOR]

β-Ga2O3 is an emerging ultra-wide bandgap semiconductor, holding a tremendous potential for power-switching devices for next-generation high power electronics. The performance of such devices strongly relies on the precise control of electrical properties of β-Ga2O3, which can be achieved by implantation of dopant ions. However, a detailed understanding of the impact of ion implantation on the structure of β-Ga2O3 remains elusive. Here, using aberration-corrected scanning transmission electron microscopy, we investigate the nature of structural damage in ion-implanted β-Ga2O3 and its recovery upon heat treatment with the atomic-scale spatial resolution. We reveal that upon Sn ion implantation, Ga2O3 films undergo a phase transformation from the monoclinic β-phase to the defective cubic spinel γ -phase, which contains high-density antiphase boundaries. Using the planar defect models proposed for the γ -Al2O3, which has the same space group as β-Ga2O3, and atomic-resolution microscopy images, we identify that the observed antiphase boundaries are the {100}1/4 ⟨110⟩ type in cubic structure. We show that post-implantation annealing at 1100 °C under the N2 atmosphere effectively recovers the β-phase; however, nano-sized voids retained within the β-phase structure and a γ -phase surface layer are identified as remanent damage. Our results offer an atomic-scale insight into the structural evolution of β-Ga2O3 under ion implantation and high-temperature annealing, which is key to the optimization of semiconductor processing conditions for relevant device design and the theoretical understanding of defect formation and phase stability. [ABSTRACT FROM AUTHOR]