Search

ESD robustness for self-protected advanced Silicon photonic components integrated into optical interposers is reported, including industry-first CDM data. HBM performance in reverse bias polarity is shown to be the limiting factor and is correlated to the optical component width. The Ge-EAM modulator with heater is found to be the weakest element CDM-wise.

Sensory-perceptual difficulties are a common characteristic in Autism Spectrum Disorders (ASD). Studies in children with ASD describe an array of challenging behaviors regarding sensory simulation. Parents, special educators, and therapists are often witnessing these behaviors throughout the day. This study aimed to use an Augmented Reality (AR) system for the simulation of the sensory overload that children with ASD experience. A total of seventy (N=70) parents, special educators, and therapists of children with ASD responded to researchers’ invitation for this study. Researchers held individual sessions with each participant who wore a head-mounted AR device (Magic Leap OneTM). Six visual and two auditory stimuli were individually and consecutively administered via the AR device. Participants experienced autism-like sensory overload under controlled conditions. Their acceptance and experience of the AR device were measured with the use of three online questionnaires (Temple Presence Inventory, TPI; Simulator Sickness Questionnaire, SSQ; Technology Acceptance Model, TAM). An open-ended question was also administered to measure the overall AR experience. In regard to the study’s findings for participants’ experience, the results from the TPI (Cronbach's Alpha = .84) suggested that the AR system offered a convincing blended environment. Also, low scores in SSQ indicated that the use of the AR system was comfortable. The results from the TAM showed in their majority high internal consistency (> .70) and high mean scores. This indicated that the participants accepted the AR system. In the open-ended question, participants reported overall satisfaction from their experience with the AR system. The study’s findings suggested that the AR device enabled participants to experience a sensory overload similar to the one child with ASD report. Participants’ experience was deemed to be convincing, comfortable, and user-friendly. The results of this study are encouraging and highlight the potential of AR in autism research. Future studies are needed to incorporate richer and more interactive AR simulations for authentic real-life experiences.

This paper presents data about learners' preferences, background and learning behavior in “Introduction to programming with Python” MOOC, offered in Autumn 2017. After the 6-week duration of the course, data collected through questionnaire and the MOOC's platform log files. The results showed that learners taking part in such MOOCs hold at least a Bachelor's or a Master's degree, and their age is between 26 and 45. The course's certificate acts as a motivational factor for learners to finish the course, and also as participation in activities forecast. It has also been observed that the most prominent reason for learners to participate in the MOOC was their current or future working career development.

session: Monolithic 3D 3; International audience; In this study we investigate the effect of some of the steps during a low temperature gate stack process flow, necessary for 3D sequential integration. These are: the nitridation of the high-k layer, the post nitridation annealing temperature and finally, the back end forming gas. Using Time Dependent Defect Spectroscopy, we could evaluate the impact of pre-existing traps on the quality of the gate stack (t 0 reliability) which shows no major differences between the splits, since they all have a low temperature dopant activation process. However, by applying Negative Bias Temperature Instability measurements, we observe that with the split of N 2 /H 2 nitridation, we have the best compromise of a small Equivalent Oxide Thickness and a low degradation. At the same time we see no difference at the stress impact between the two Post Nitridation Anneal temperatures. In that way we are able to move to lower temperatures. Finally, using the Deuterium as a back end forming gas we can have a set of guidelines, for some of the major process steps, to achieve high performance and low degradation, necessary for future scaling.

This work provides breakthroughs in key technological modules for high performance and reliable 3D Sequential Integration with intermediate BEOL (iBEOL) in-between tiers. We demonstrate that (i) a high-quality solid phase epitaxy process is possible at 500°C, (ii) TiN native oxide removal prior to poly deposition leads to an improvement in gate stack reliability below 525°C and (iii) state-of-the-art SiOCH ULK in iBEOL is reliable up to 550°C 5h with W metal lines. A process integration is thus proposed to match the process windows of bottom layers (bottom FET and iBEOL) stability and top devices performance and reliability, opening perspectives for a wide range of applications and technologies using 3D Sequential Integration.