20 results on '"Feng, Chan"'
Search Results
2. Adaptive Estimation of Joint RF Impairments and Envelope Nonlinear Parameters with Instrument Platform Verification
3. SDR measurement platform design for FMCW RADAR performance verification
4. A Robust Feature-Based Image Watermarking Scheme
5. A study on the 3DIC interconnection using thermal compression bond with non conductive paste process
6. Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections
7. Three dimensional interconnects with through silicon vias and electroplating solder microbumps
8. A study of thin wafer handling in 3D-IC applications
9. Sub-modeling technique for thermo-mechanical simulation of solder microbumps assembly in 3D chip stacking
10. Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
11. Absorbing properties of frequency selective surface with random distributed resistance patches
12. Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections.
13. Three dimensional interconnects with through silicon vias and electroplating solder microbumps.
14. Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps.
15. Sub-modeling technique for thermo-mechanical simulation of solder microbumps assembly in 3D chip stacking.
16. A study on the 3DIC interconnection using thermal compression bond with non conductive paste process.
17. Reliability of thermal compression bond combine with non conductive paste process in fine pitch micro-bumps soldering.
18. A study of thin wafer handling in 3D-IC applications.
19. Absorbing properties of frequency selective surface with random distributed resistance patches.
20. In(Ga)As Quantum Ring Terahertz Photodetector With Cutoff Wavelength at 175 μm.
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.