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Ge/SiGe heterostructures are promising in the view of silicon-foundry compatible THz optoelectronic applications. Here we present a structural and optical characterization of Ge/SiGe parabolic quantum wells that represent ideal systems for room-temperature THz emission and strong light-matter coupling investigation.

The realization of a Ge/SiGe THz emitter is of great interest since it can help to reach room-temperature operation due to the peculiar electron-phonon interaction in nonpolar crystals. Here we present Ge/SiGe quantum-well building blocks epitaxially grown on silicon wafers in order to understand limitations of this material platform in the perspective of realizing a Si-based laser.

Strain relaxed Si 1 − x Ge x buffer layers on Si(001) can be used as virtual substrates for the growth of both strained Si and strained SiGe, which are suitable materials for sub-7 nm CMOS devices due to their enhanced carrier mobility. For industrial applications, the threading dislocation density (TDD) has to be as low as possible. However, a reduction of the TDD is limited by the balance between dislocation glide and nucleation as well as dislocation blocking. The relaxation mechanism of low strain Si 0.98 Ge 0.02 layers on commercial substrates is compared to substrates with a predeposited SiGe backside layer, which provides threading dislocations at the edge of the wafer. It is shown that by the exploitation of this reservoir, the critical thickness for plastic relaxation is reduced and the formation of misfit dislocation bundles can be prevented. Instead, upon reaching the critical thickness, these preexisting dislocations simultaneously glide unhindered from the edge of the wafer toward the center. The resulting dislocation network is free of thick dislocation bundles that cause pileups, and the TDD can be reduced by one order of magnitude.

The waveguide losses from a range of surface plasmon and double metal waveguides for Ge/Si1−xGe x THz quantum cascade laser gain media are investigated at 4.79 THz (62.6 μm wavelength). Double metal waveguides demonstrate lower losses than surface plasmonic guiding with minimum losses for a 10 μm thick active gain region with silver metal of 21 cm−1 at 300 K reducing to 14.5 cm−1 at 10 K. Losses for silicon foundry compatible metals including Al and Cu are also provided for comparison and to provide a guide for gain requirements to enable lasers to be fabricated in commercial silicon foundries. To allow these losses to be calculated for a range of designs, the complex refractive index of a range of nominally undoped Si1−xGe x with x = 0.7, 0.8 and 0.9 and doped Ge heterolayers were extracted from Fourier transform infrared spectroscopy measurements between 0.1 and 10 THz and from 300 K down to 10 K. The results demonstrate losses comparable to similar designs of GaAs/AlGaAs quantum cascade laser plasmon waveguides indicating that a gain threshold of 15.1 cm−1 and 23.8 cm−1 are required to produce a 4.79 THz Ge/SiGe THz laser at 10 K and 300 K, respectively, for 2 mm long double metal waveguide quantum cascade lasers with facet coatings.

We explore saturable absorption and terahertz photoluminescence emission in a set of n-doped Ge/SiGe asymmetric coupled quantum wells, designed as three-level systems (i.e., quantum fountain emitter). We generate a non-equilibrium population by optical pumping at the 1→3 transition energy using picosecond pulses from a free-electron laser and characterize this effect by measuring absorption as a function of the pump intensity. In the emission experiment we observe weak emission peaks in the 14–25 meV range (3–6 THz) corresponding to the two intermediate intersubband transition energies. The results represent a step towards silicon-based integrated terahertz emitters.

The exploitation of intersubband transitions in Ge/SiGe quantum cascade devices could pave the way towards the integration of THz light emitters into the silicon-based technology. Aiming at the realization of a Ge/SiGe Quantum Cascade Laser (QCL), we investigate optical and structural properties of n-type Ge/SiGe coupled quantum well systems. The samples have been investigated by means of X-ray diffraction, scanning transmission electron microscopy, atom probe tomography and Fourier Transform Infrared absorption spectroscopy to assess the growth capability with respect to QCL design requirements, carefully identified by means of modelling based on the non-equilibrium Green function formalism.

n-type Ge/SiGe terahertz quantum cascade laser are investigated using non-equilibrium Green's functions calculations. We compare the temperature dependence of the terahertz gain properties with an equivalent GaAs/AlGaAs QCL design. In the Ge/SiGe case, the gain is found to be much more robust to temperature increase, enabling operation up to room temperature. The better temperature robustness with respect to III-V is attributed to the much weaker interaction with optical phonons. The effect of lower interface quality is investigated and can be partly overcome by engineering smoother quantum confinement via multiple barrier heights., 5 pages, 5 figures

With the aim of tuning the optical properties of SiC selective solar absorbers, we investigate the surface micro/nano-texturing of porous silicon carbide by using two approaches, namely i) the femtosecond laser treatment and ii) the fluorine based reactive ion etching. It is found that both the techniques are capable of inducing significant surface morphology modification inducing a substantial roughening. The surface features produced are found to be tunable by tailoring the main process parameters, i.e. translation speed and pulse repetition rate for laser treatment, and RF-power, gas pressure and gas mixture for the reactive ion etching process.

We report on the morphological investigation of nanoscale thick patterns obtained by the scanning probe assisted local oxidation technique on graphene layers grown directly on Ge (100) substrates using CVD technique. Protruding mounds and lines are produced by applying a negative voltage to the atomic force microscope probe while translating the probe tip across the sample surface. The main features of the local oxide produced and the differences with respect to similar experiments conducted on Ge or Si samples are presented.

An extended formation of faceted pit-like defects on Ge(001) and Ge(111) wafers was obtained by thermal cycles to T> 750 {\deg}C. This temperature range is relevant in many surface-preparation recipes of the Ge surface. The density of the defects depends on the temperature reached, the number of annealing cycles performed and correlates to the surface-energy stability of the specific crystal orientation. We propose that the pits were formed by preferential desorption from the strained regions around dislocation pile-ups. Indeed, the morphology of the pits was the same as that observed for preferential chemical etching of dislocations while the spatial distribution of the pits was clearly non-Poissonian in line with mutual interactions between the core dislocations., Comment: European Union (EU), Horizon 2020, Far-Infrared Lasers Assembled using Silicon Heterostructures,FLASH,Grant number: 766719

In this paper we investigate the structural and optical properties of few strain-unbalanced multiple Ge/GeSi quantum wells pseudomorphically grown on GeSi reverse-graded substrates. The obtained high epitaxial quality demonstrates that strain symmetrization is not a mandatory requirement for few quantum-well repetitions. Photoluminescence data, supported by a thorough theoretical modeling, allow us to unambiguously disentangle the spectral features of the quantum wells from those originating in the virtual substrate and to evaluate the impact on the optical properties of key parameters, such as quantum confinement, layer compositions, excess carrier density, and lattice strain. This detailed understanding of the radiative recombination processes is of paramount importance for the development of Ge/GeSi-based optical devices.

We report on the realization of high-mobility two-dimensional electron gas based on modulation-doped Si/SiGe heterostructure grown directly on thin SiGe-On-Insulator (SGOI) substrate. The samples were grown by using low-pressure chemical vapor deposition. A pregrowth procedure for the cleaning of the SGOI surface that preserves the integrity and the composition of the substrate was developed. An electron mobility as high as 10(5)cm(2)V(-1) s(-1) at T = 0.4 K and 2000 cm(2)V(-1) s(-1) at T = 300 K was obtained. (C) 2007 Elsevier B.V. All rights reserved.

We apply a new experimental method for determining band lineups at the Ge Si (100) heterostructure. This method uses a modern version of an old spectroscopy: the photoelectric yield spectroscopy excited with photons in the near UV range. It is shown that both substrate and overlayer valence-band tops can be identified in the yield spectrum, thus allowing a direct and precise determination of the band lineup. We find an offset of 0.36 ± 0.02 eV for heterojunctions whose overlayers were grown according to the Stranski-Krastanov mechanism.

An X-ray scanning microscope study of self-organized morphological defects arising during the growth of thick SiGe virtual substrates grown on Si(001) surface is reported. The 200 nm microscope resolution permitted to probe the local alloy composition. The measured variations of the Ge content in the alloy demonstrate that defect formation and evolution represent a strain relief mechanism. The observed large stress concentration inside the defect and the absence of the cross-hatch pattern on its internal facets are findings in close analogy with the lateral strain relaxation of self-organized islands in heterostructures.

The growth of high-mobility modulation-doped Si/SiGe heterostructures on silicon-on-insulator (SOI) substrates is demonstrated. The structural and electrical properties of the samples are comparable with those of similar samples grown on standard Si substrates. Electron mobilities as high as 2800 cm 2 V −1 s −1 at room temperature and 8.2×10 4 cm 2 V −1 s −1 at 4 K are obtained.

We present a new experimental method for determining band lineups at the semiconductor heterojunctions and apply it to the $c\ensuremath{-}\mathrm{S}\mathrm{i}\left(100\right)/a\ensuremath{-}\mathrm{S}\mathrm{i}:\mathrm{H}$ heterostructure. This method uses a modern version of an old spectroscopy: the photoelectric yield spectroscopy excited with photons in the near UV range. It is shown that both substrate and overlayer valence-band tops can be identified in the yield spectrum due to the high escape depth and the high dynamical range of the technique, thus allowing a direct and precise determination of the band lineup. A value of $\ensuremath{\Delta}{E}_{V}\phantom{\rule{0ex}{0ex}}=\phantom{\rule{0ex}{0ex}}0.44\ifmmode\pm\else\textpm\fi{}0.02\mathrm{eV}$ was found for the valence band discontinuity.

We have investigated the morphology defects, in particular, pits present in compositionally graded SiGe thick films heteroepitaxially grown on Si(001) surfaces. Besides the pits clearly related to impurities and interface defects, a class of pits intrinsic to the strained-layer growth has been found. Two stable and one metastable pit shapes have been identified that can be related to the alloy film thickness and pit dimension. The influence of the pits on the mobility of the two dimensional electron gas grown on these kinds of substrates has been also investigated.

""We report on the fabrication process of suspended anodes implemented in Schottky-diode devices on epitaxial Ge. An air-bridge technique based on reactive ion etching in SF(6) was developed in order to release the Schottky contact bridge, ensuring higher control respect to wet etching. Metal-semiconductor junctions in the sub-micron range with rectifying behaviour have been obtained. The present fabrication process can be extended as is to the use of silicon on insulator substrates. (C) 2010 Elsevier B.V. All rights reserved.""

The beam of planar THz Schottky detectors is strongly concentrated in the dielectric half-space. With the goal of illuminating arrays from the free-space side, we started to investigate substrate removal from both GaAs and Ge-on-Si diode wafers. © 2011 IEEE.

The growth of high-mobility modulation-doped Si/SiGe heterostructures on silicon-on-insulator substrates is demonstrated. The structural and electrical properties of the samples are reported to be comparable with those of similar samples grown on standard Si substrates. Electron mobilities as high as 2900 cm2/Vs at room temperature and 8.2×104 cm2/Vs at 4.2 K were obtained.

We present morphological and electrical characterizations of thin and narrow resistors obtained by focused ion beam assisted deposition of Pt based material. For thin and narrow depositions the measured thickness and width are significantly different from the nominal values. From leakage tests we found that in order to have electrically insulated parallel resistors at room temperature, it is mandatory that the Pt-halo, which results from the deposition procedure, has a thickness well below 6 nm. (C) 2008 Elsevier Ltd. All rights reserved.

We report on the growth and characterization of high‐mobility 2DEGs on tensile strained Si grown on cubic SiGe alloy on SOI substrates. The electrical properties were investigated in the 4.2–300 K temperature range as a function of growth conditions and sample structure. Hall mobilities as high as 82000 cm2/V.s at T=4.2 K were obtained in the best 2DEGs on SOI. We found that the main mechanism limiting the mobility at low temperature is the ionized impurity scattering.

Due to the evergrowing use of optical fibers in communications, for both long distances and local area networks, there is an increasing effort toward the realization of high speed and high efficiency optical detectors, operating in the low-absorption regions ~1.3‐1.55 mm! of silica fibers. Although III‐V semiconductors provide high detection efficiency in the range of interest, incorporating them in the well-established Si technology is difficult and expensive. 1 SiGe structures on silicon represent an alternative solution for near-infrared photodetection, owing to their narrow band gap and full compatibility with silicon technologies. SiGe alloy heterostructures, multiquantum wells, and superlattices have been used as active layers in p-i-n photodetectors and their operation at 1.3 mm has been successfully demonstrated for both normal incidence 2 and waveguide configurations. 3 The fundamental limitation of SiGe-based heterostructures is the vanishing response at 1.55 mm. Pure germanium, indeed, represents the best candidate for 1.3‐1.55 mm photodetectors, due to its direct band gap of 0.8 eV. However, owing to the high lattice mismatch with Si, it is not easy to obtain Ge films with suitable characteristics: thickness appropriate for maximum efficiency, flatness compatible with submicron lithography, minimum defect content for high speed. Thick graded buffers can be used to partially relax the strain due to the lattice mismatch, 4 but the molecular beam epitaxy ~MBE! growth of such a layer is cumbersome and expensive. In the present work we investigate the feasibility of the simplest fabrication approach, i.e., the epitaxial growth of thick layers ~well over the critical thickness! of pure germanium on silicon by chemical vapor deposition ~CVD!. The use of pure Ge on Si for efficient photon detection in the range 1.3‐1.5 mm, first attempted by Luryi et al., 5 requires

In the present work we investigate photo-detectors based on thick relaxed Ge layers, epitaxially grown on silicon after insertion of a low-temperature-grown Ge buffer layer. By using this procedure it was possible to grow films having thicknesses comparable with light penetration depth in the 1.3–1.6μm spectral range. The films exhibited flatness on the atomic scale. Two kinds of detectors were investigated: vertical heterojunction diodes and a planar Metal-Semiconductor-Metal structure. The detectors show a good responsivity at normal incidence at both 1.3 and 1.55μm. The photocurrent increases with the voltage applied, reaching a maximum responsivity of 0.24 A/W at 1.3μm under a bias of IV. A complete optoelectronic characterization of the fabricated devices is performed. The results confirm the feasibility of the proposed approach for the fabrication of 1.3–1.55μm near infrared photodetectors integrated on silicon chips.

We report on Ge Schottky diodes epitaxially grown on Si(001) exhibiting a good responsivity in the near-infrared up to 1.55 mu m. The Ge layers were grown by UHV chemical vapor deposition. It was found that the photocurrent increases upon increasing the reverse bias, reaching a maximum responsivity of 0.12 A/W at 1.3 mu m for 4 V bias. The leakage current density at the saturation voltage is 1 nA/mu m(2).

In this letter we present an atomic force microscopy and photoluminescence investigation of two‐ and three‐dimensional Ge structures deposited on Si(100) substrates. The photoluminescence spectra demonstrated the presence of quantum confinement effects in flat and uncapped Ge layers and in Ge islands even for the relatively large size of the structures. Moreover, a correlation between the sample morphology and the features of the photoluminescence is demonstrated.

We report on Ge Schottky photodiodes epitaxially grown on Si (100) exhibiting a good responsivity in the near infrared up to 1.55 mu m. The Ge epitaxial layers, grown by ultrahigh vacuum chemical vapor deposition, were deposited in two steps differing by the substrate temperature. With this procedure it was possible to obtain films thicknesses comparable with light penetration depth in the 1.3-1.6 mu m range. The photodiodes have a photocurrent which increases as a function of voltage bias, reaching a maximum responsivity of 0.12 A/W at 1.3 mu m under a reverse bias of 4 V. The leakage current density at the saturation voltage is 1 nA/mu m(2). The results show that the proposed approach is promising for the fabrication of 1.3-1.55 mu m near-infrared photodetectors integrated on silicon chips. (C) 1999 American Vacuum Society. [S0734-211X(99)07402-8].

Employing electronic transitions in the conduction band of semiconductor heterostructures paves a way to integrate a light source into silicon-based technology. To date all electroluminescence demonstrations of Si-based heterostructures have been p-type using hole-hole transitions. In the pathway of realizing an n-type Ge/SiGe terahertz quantum cascade laser, we present electroluminescence measurements of quantum cascade structures with top diffraction gratings. The devices for surface emission have been fabricated out of a 4-well quantum cascade laser design with 30 periods. An optical signal was observed with a maximum between 8-9 meV and full width at half maximum of roughly 4 meV.

Terahertz (THz) semiconductor based quantum cascade lasers (QCLs) represent powerful and compact integrated light sources. To date they have been realized with various III-V materials where LO phonon emission becomes very effective as the temperature is increased, limiting the maximum operating temperature to 200K. To overcome this limitation, non-polar material systems are attractive because of their weaker e-phonon interaction. Theoretical studies have indicated n-type Ge/SiGe heterostructures where transport is associated to L electrons, as the most promising architecture [1]. Experimentally, sharp intersubband transitions in n-type strain compensated Ge/SiGe QWs have been observed in the 20–50 meV region [2]. Recently, non-equilibrium Green's functions calculations proved to be efficient in optimising high temperature performance of GaAs/AlGaAs THZ QCLs [3]. In the effort of realizing a Ge/SiGe THz QCL, we present here a QCL structure designed by means of non-equilibrium Green's functions [4], whose the bandstructure is reported in Fig.1(a). Epitaxial growth of strain-compensated Ge/SiGe heterostructure (≈1.5 μm thick) has been carried out by means of UHV-CVD yielding very good sample quality as visible from Fig.1(b). Mesa devices for transport experiments have been fabricated by dry etching and metallization. In Fig.1(c) a series of I-V curves as a function of the heatsink temperature display a thermally activated behaviour with E act ≃ 10 meV. From low temperature (4 K) magnetotransport [5] in a magnetic field parallel to the current direction shows characteristics oscillations. we can deduce an energy distance between the lasing states of E 23 =19.5 meV, in good agreement with the theoretical calculation. Optical experiments are ongoing and experimental results will be presented.

Low-power pulsed-laser annealing (LPPLA) was applied to III-V compound semiconductors GaAs and InP. The effects have been analyzed using several experimental techniques such as reflection high-energy electron diffraction, Rutherford backscattering spectroscopy, x-ray photoelectron spectroscopy, and electrical measurements. In addition, a calculation method was developed to study the heat propagation in the irradiated sample during the LPPLA process. The irradiation conditions, realizing a uniform surface laser-energy distribution, made possible a unidimensional approach. The results obtained experimentally and by numerical modeling agree well if one assumes that a solid-phase epitaxy takes place. The XPS measurements for GaAs and InP show, in particular, that a range of the irradiation power density exists where the LPPLA can effectively restore the lattice order without appreciable alteration of the surface stoichiometry. At higher power density of irradiation, the As and P vacancies introduced by the laser, in GaAs and InP, respectively, may no longer be neglected. \textcopyright{} 1996 The American Physical Society.