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2. Classical and cubic Rashba effect in the presence of in-plane 4f magnetism at the iridium silicide surface of the antiferromagnet GdIr2Si2

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3. Insight into the temperature evolution of electronic structure and mechanism of exchange interaction in EuS

4. Photoelectron diffraction for probing valency and magnetism of 4f -based materials: A view on valence-fluctuating EuIr2Si2

5. Cubic Rashba Effect in the Surface Spin Structure of Rare-Earth Ternary Materials

6. Electrical Conductivity Modeling of Graphene-based Conductor Materials

7. The role of plasma analytics in leading-edge semiconductor technologies

8. Crystallization of optically thick films of CoxFe80−xB20 : Evolution of optical, magneto-optical, and structural properties

9. Spin structure of spin-orbit split surface states in a magnetic material revealed by spin-integrated photoemission

10. Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes

11. Corrigendum to 'A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups' [Microporous Mesoporous Mater. 306 (2020) 110434]

12. A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups

13. Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales

14. Interaction between carbon nanotubes and metals: Electronic properties, stability, and sensing

15. Influence of porosity and methyl doping inside silica network: An electron diffraction and DFTB analysis

16. Wetting Behavior of Plasma Etch Residue Removal Solutions on Plasma Damaged and Repaired Porous ULK Dielectrics

17. Exchange bias and diffusion processes in laser annealed CoFeB/IrMn thin films

18. Spectroscopic ellipsometry and magneto-optical Kerr effect spectroscopy study of thermally treated Co60Fe20B20 thin films

19. Carbon Nanotubes for Mechanical Sensor Applications

20. Sensoric Micro and Nano Systems

21. Electroforming-free resistive switching in yttrium manganite thin films by cationic substitution

22. Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales

23. Photosensitive Field‐Effect Transistors Made from Semiconducting Carbon Nanotubes and Non‐Covalently Attached Gold Nanoparticles

24. The dielectric response of low-k interlayer dielectric material characterized by electron energy loss spectroscopy

25. Controlling SWCNT assembling density by electrokinetics

26. Investigation of CH4, NH3, H2 and He plasma treatment on porous low-k films and its effects on resisting moisture absorption and ions penetration

27. Determination of Surface Energy Characteristics of Plasma Processed Ultra Low-K Dielectrics for Optimized Wetting in Wet Chemical Plasma Etch Residue Removal

28. Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials

29. Optimized Wetting Behavior of Water-Based Cleaning Solutions for Plasma Etch Residue Removal by Application of Surfactants

30. Modeling of TDDB in advanced Cu interconnect systems under BTS conditions

31. Variable-shaped e-beam lithography enabling process development for future copper damascene technology

32. How to evaluate surface free energies of dense and ultra low-κ dielectrics in pattern structures

33. Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma

34. Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives

35. Chemical Repair of Plasma Damaged Porous Ultra Low-k SiOCH Film using a Vapor Phase Process

36. Carbon nanotubes for nanoscale low temperature flip chip connections

37. Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS

38. Investigation of physical and chemical property changes of ultra low-κ SiOCH in aspect of cleaning and chemical repair processes

39. Surface Energy and Wetting Behaviour of Plasma Etched Porous SiCOH Surfaces and Plasma Etch Residue Cleaning Solutions

40. Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications

41. Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits

42. Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys

43. A plasma assisted in situ restoration process for sidewall damaged ULK dielectrics

44. Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS

45. Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics

46. Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation

47. Phosphane copper(I) complexes as CVD precursors

48. Evaluation of air gap structures produced by wet etch of sacrificial dielectrics: Extraction of keff for different technology nodes and film permittivity

49. Cu/barrier CMP on porous low-k based interconnect schemes

50. Mesoporous SiO2 as low-k dielectric for integration in Cu/low-k interconnect systems