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The precise control of Mg concentration ([Mg]) in p-type GaN layers from 2.3 × 1016 to 2.0 × 1019 cm−3 was demonstrated by halide vapor phase epitaxy (HVPE) on n-type GaN (0001) freestanding substrates. [Mg] in GaN layers could be controlled well by varying the input partial pressure of MgCl2 formed by a chemical reaction between MgO solid and HCl gas under the thermodynamic equilibrium condition. In the sample with [Mg] of 2.0 × 1019 cm−3, a step-bunched surface was observed because the surface migration of Ga adatoms was enhanced by the surfactant effect of Mg atoms. The samples show high structural qualities determined from x-ray rocking curve measurements. The acceptor concentration was in good agreement with [Mg], indicating that almost all Mg atoms act as acceptors. The compensating donor concentrations in the samples were higher than the concentrations of Si, O, and C impurities. We also obtained the Mg acceptor level at a sufficiently low net acceptor concentration of 245 ± 2 meV. These results show that the HVPE method is promising for fabricating GaN vertical power devices, such as n-channel metal–oxide–semiconductor field-effect transistors. [ABSTRACT FROM AUTHOR]

In this study, vertical-type thick BGaN PIN diodes were successfully fabricated to improve the neutron capture rate of BGaN diodes by improving the BGaN epitaxial growth technique. In this technique, 5-μm-thick epitaxial growth was achieved using trimethylboron as a B metal-organic source, which suppressed the gas-phase reaction. The α-particle energy spectrum, the neutron pulse signal, and the residual energy of particles emitted from a neutron capture reaction were measured using the fabricated BGaN diodes by performing radiation detection measurements. The detected signal position in the neutron detection signal spectrum was similar to that of 2.3 MeV α-particles. These results indicate that vertical-type BGaN diodes can be used as effective neutron detectors. [ABSTRACT FROM AUTHOR]

AlN‐based field‐effect transistors (FETs) enable high‐breakdown voltage, high drain current, and high‐temperature operation. To realize high‐frequency devices, N‐polar AlGaN/AlN heterostructure FETs are focused on. N‐polar Al0.1Ga0.9N/Al0.9Ga0.1N/AlN FET is fabricated using metal–organic vapor‐phase epitaxy, and its electrical characteristics are evaluated. An N‐polar AlN layer is grown on a sapphire substrate with a misorientation angle of 2.0° toward m‐axis, on which a 20 nm thick Al0.9Ga0.1N base layer and a 20 nm Al0.1Ga0.9N channel layer are grown. The static FET operation is confirmed to exhibit an n‐channel and pinch‐off. Normally, during operation with a turn‐on voltage of −3.2 V, a high operating breakdown voltage of 620 V and high operating temperature of 280 °C are also confirmed. [ABSTRACT FROM AUTHOR]

We studied indium incorporation into InGaN/GaN quantum wells grown by metal–organic vapor phase epitaxy by systematically varying of gallium and indium precursor flows on (0001), (10 1 ¯ 3), (11 2 ¯ 2), and (10 1 ¯ 0) orientations. The layer thickness and indium composition obtained from x-ray diffraction analysis were correlated with a model based on indium and gallium incorporation efficiencies. In the model, the indium incorporation efficiency is reproduced by the Langmuir surface coverage of gallium, indicating that indium atoms close to gallium atoms can be incorporated preferably. [ABSTRACT FROM AUTHOR]

A vertical GaN p+-n junction diode with an ideal breakdown voltage was grown by halide vapor phase epitaxy (HVPE). A steep p+-n interface was observed even with the use of the HVPE method. No Si-accumulating layer was formed at the p+-n interface because of the continuous HVPE growth from the n-type drift layer to the p-type layer. This method provides improved electrical properties compared with the regrowth of p-type GaN layers. The minimum ideality factor of approximately 1.6 was obtained. The breakdown voltage increased from 874 to 974 V with the increase in the temperature from 25 to 200 °C, which suggests that avalanche multiplication causes the breakdown. The temperature-dependent breakdown voltage was in good agreement with the breakdown voltage calculated using the ideal critical electric field. These results indicate that HVPE is promising for the fabrication of vertical GaN power devices. [ABSTRACT FROM AUTHOR]

A set of GaN/GaInN single quantum wells (SQWs) were grown on c-plane GaN/sapphire templates using metal organic vapor phase epitaxy (MOVPE) and atomic layer epitaxy (ALE). The structural information on the interfaces and surfaces was obtained by fitting the experimental X-ray spectra and was compared between MOVPE and ALE mode. The X-ray crystal truncation rod (CTR) scattering measurement results showed that the samples grown by ALE had sharper interfaces than those grown by MOVPE. Both the X-ray reflectivity (XRR) curve-fitting results and atomic force microscope (AFM) results indicated that the surfaces of the ALE-grown SQWs were smoother than those of MOVPE-grown SQWs. (© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [ABSTRACT FROM AUTHOR]

The selective growth of wurtzite GaN was performed by MOVPE on (1 1 1) facets on a patterned 7-degree off-oriented (0 0 1) silicon substrate, which had been prepared by anisotropic etching with KOH solution. The c-axis of the GaN was along the 〈1 1 1〉 axis of the silicon. At an early growth stage, the shape of the crystal grown selectively was a stripe having truncated triangular cross-section and its (1 1¯ 0 1) facet was parallel to the substrate surface. After a sufficient growth duration, the stripes coalesced with each other and a GaN film with a flat (1 1¯ 0 1) surface was achieved. [Copyright &y& Elsevier]

Thermal annealing at high temperatures of nonpolar (1 0 1 ¯ 0) m -plane AlN layers directly sputtered on m -plane sapphire was investigated. The crystallinity of the layers increased with increasing annealing temperature. The full-width at half maximum of the symmetric (1 0 1 ¯ 0) X-ray rocking curves along [0 0 0 1]/[1 1 2 ¯ 0 ] AlN decreased from about 3.5/2.0 ° to 0.24/0.19 ° . The density of basal stacking faults of the annealed layers was found to decrease from ∼ 1 × 10 5 to ∼ 5 × 10 3  cm −1 . The annealed layers had a larger optical bandgap energy than the as-sputtered layers due to their better crystallinity and structural order. [ABSTRACT FROM AUTHOR]

Abstract: Mg doping was attempted in (11¯01)GaN grown on a patterned (001)Si by selective metal-organic vapor phase epitaxy (MOVPE). The source material for the Mg doping was EtCp2Mg and the electrical properties were studied on samples with different doping levels. All samples showed p-type conduction. However, the hole concentration was decreased by the Mg doping at low doping levels followed by an increase at high doping levels. The activation energy was around 106–130meV depending on the doping level, which was larger than that found in undoped or carbon-doped samples. The AFM images showed gradual change in the surface structure in accordance with the Mg-doping level. The variation of the optical spectra was discussed in relation to the Mg-doping levels. [Copyright &y& Elsevier]

• The macroscopic morphology changes depending on the off-angle and its direction. • Macrostep and hillock form growth is observed below a certain off angle. • The lowest off-angle at which smooth morphology can be obtained is direction-dependent. • The m -direction provide the lowest off-angle and the step flow growth. • The off-angle and off-directions are important factors for morphologies control. [ABSTRACT FROM AUTHOR]

• Sn-doped n-type GaN layers were grown by halide vapor phase epitaxy. • Sn precursor was formed by reacting Sn metal with HCl gas. • Sn concentration in GaN layers increased with decreasing the growth temperature. • High electron density of 2 × 1020 cm−3 was achieved. • Sn introduction promoted the surface migration of Ga adatoms. A Sn-doped n-type GaN layer with a high electron density of 2 × 1020 cm−3 and a low resistivity of 8.7 × 10−4 Ω∙cm was grown by halide vapor phase epitaxy (HVPE). Sn doping was performed through the reaction between Sn metal and HCl gas. The Sn concentration markedly increased with decreasing growth temperature and the activation energy of Sn desorption from the GaN surface was found to be 4.1 eV. Smooth surfaces were obtained by introducing the Sn precursor even though the samples were grown at a low temperature of 905 °C, suggesting that Sn atoms act as surfactants and promote the migration of Ga adatoms. Almost all the Sn atoms act as donors in GaN below the Sn concentration of 2 × 1020 cm−3. These results indicate that using the Sn donor is promising for fabricating low-resistivity n-type GaN substrates by HVPE. [ABSTRACT FROM AUTHOR]

Highlights • A high-resolution time-of-flight mass spectrometry system was employed. • In-situ monitoring of vapor phase reaction was demonstrated. • Decomposition of NH 3 in the simple reactor was measured. Abstract The decomposition of ammonia (NH 3) in nitrogen (N 2) ambient was studied under non-equilibrium conditions similar to those in a metal organic vapor phase epitaxy (MOVPE) reactor during the epitaxial growth of group-III nitrides. The gas phase was sampled at different positions and analyzed using a time-of-flight mass spectrometry system with a high resolution (better than 0.002 u). Our results expand earlier findings. Even at the high temperature of 1200 °C, only 26% of NH 3 decomposed in a clean metal-free reactor, whereas a higher ratio of NH 3 decomposition was realized in the presence of stainless steel. The activation energy in the clean reactor was calculated to be 0.965 ± 0.004 eV. These results demonstrate the capability of our setup and shed new light on the elucidation of the vapor phase growth mechanism of group III-nitrides by MOVPE. [ABSTRACT FROM AUTHOR]

Hexagonal boron nitride (h-BN) was directly grown on sapphire substrate using alternating ammonia (NH 3 ) and triethylboron (TEB) supply (pulsed mode) in metalorganic vapor phase epitaxy. The best condition is when just enough NH 3 is supplied to fully convert the TEB within one cycle. Excess NH 3 caused islands on h-BN film surface while a lack of NH 3 does not form h-BN at all. The epitaxial relationship between grown h-BN layer and c -plane sapphire was confirmed to be [0001] h-BN ∥[0001] sapphire and [10-10] h-BN ∥[11-20] sapphire . It is known that, compared to AlN, BN requires higher V/III ratios for good crystallinity, which due to severe gas-phase reactions is difficult to achieve using continuous supply. Thus using pulsed mode the FWHM of the symmetric (0002) diffraction was almost halved and the growth rate was several times faster. [ABSTRACT FROM AUTHOR]

• P-type GaN layers with Mg concentrations of 8.0 × 1018–8.3 × 1019 cm−3 are fabricated by HVPE. • The electrical properties and structural defects of p-type GaN layers are characterized. • Pyramidal inversion domains are observed in the heavily Mg-doped GaN layers grown by HVPE. • Mg atoms accumulate in pyramidal inversion domain. The electrical properties and structural defects of p-type GaN layers with Mg concentrations from 8.0 × 1018 to 8.3 × 1019 cm−3 grown by halide vapor phase epitaxy (HVPE) were investigated. In all samples, p-type conduction was confirmed at room temperature. The hole concentration at room temperature decreased in a heavily Mg-doped sample. By analyzing the results of Hall-effect measurements at various temperatures, the acceptor concentration decreased in a heavily Mg-doped sample, whereas the compensating donor concentration increased. These results affect the decrease in the hole concentration. The hole mobility decreased with increasing acceptor concentration. In the heavily Mg-doped sample, pyramidal inversion domains (PIDs) were formed. The size of each PID in an HVPE-grown sample is in good agreement with that Mg-doped GaN layers grown by metalorganic vapor phase epitaxy (MOVPE). Thus, the formation mechanism of PIDs in HVPE-grown samples is possibly the same as that in MOVPE-grown samples. Energy-dispersive X-ray spectroscopy shows that Mg atoms accumulate in PIDs, which suggests that Mg atoms in PIDs are electrically inactive, inhibiting the increase in the acceptor concentration. These results are useful guidelines for fabricating p-type GaN layers with higher hole concentrations by HVPE. [ABSTRACT FROM AUTHOR]