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In this study, AlGaN/GaN light-emitting HEMTs (LE-HEMT) with a single quantum well inserted in different locations in the epitaxy layers are fabricated and analyzed. For both structures, light-emitting originated from electrons in the 2DEG and holes from the p-GaN for radiative recombination is located in the quantum well. To investigate the importance of the location of single quantum well, optical characteristics are compared by simulation and experimental results. The experimental results show that the main light-emitting wavelength is shifted from 365 nm in the UV range to 525 nm in the visible range when the radiative recombination is confined in the quantum well and dominates among other mechanisms. Epi B, which has a quantum well above the AlGaN barrier layer in contrast to Epi A which has a quantum well underneath the barrier, shows better intensity and uniformity in light-emitting. According to the simulation results showing the radiative distribution and electron concentrations for both structures, the lower quantum efficiency is due to the diverse current paths in Epi A. On the other hand, Epi B shows better quantum confinement and therefore better luminescence in the same bias condition, which is consistent with experimental observations. These findings are critical for advancing the performance of LE-HEMTs. [ABSTRACT FROM AUTHOR]

Gallium nitride high electron mobility transistors outperform Silicon devices due to their excellent physical properties. However, being an immature technology, it exhibits dynamic on-state resistance ($R_{\text{ds}, \text{on}}$). This causes increased conduction loss and leads to reduced operating efficiency. To evaluate the dynamic $R_{\text{ds}, \text{on}}$ of the device, a measurement circuit is required. In literature, a standardized double pulse test is widely used for the measurement of $R_{\text{ds}, \text{on}}$. However, due to the uncontrolled off-state time and inability to independently adjust, the test conditions result in restricted measurement. This article proposes a measurement circuit of the device in power electronics operations. The circuit uses an H-Bridge-derived topology with capacitive storage to enable forward and reverse conduction mode measurement of the device. In all the modes, the circuit allows measurement from the first switching cycle and independent control over the testing conditions by using a hysteresis current control. The proposed measurement circuit is validated using simulation and experimentation. Finally, analytical efficiency compared with the state-of-the-art measurement circuits is provided. [ABSTRACT FROM AUTHOR]

In this letter, a fully transparent AlGaN/GaN HEMT (FT-HEMT) using indium-tin-oxide (ITO) as a transparent electrode is fabricated. The n-ohmic contacts are formed based on a Si-implant process using a deposited ITO rather than the conventional alloyed metal stacks. Following a post-annealing process at 600°C, the field-effect mobility and the maximum current density for an FT-HEMT were 1004 cm2/ $\text{V}{\cdot }\text{s}$ and 179 mA/mm, respectively. Furthermore, the measured transmittance for a fabricated chip in the visible range of 400 - 700 nm was greater than 70%, which is almost the same as an as-grown GaN-on-sapphire substrate. These results show that, by using this approach, an FT-HEMT that has superior electronic properties, such as high mobility and high output current, can be realized, and show great promise for applications in transparent and/or flexible electronics, as well as other optoelectronic devices. [ABSTRACT FROM AUTHOR]

III-V heterostructure based high electron mobility transistors (HEMTs) offer superior performance as compared to CMOS silicon transistors owing to the high mobility in the 2D electron gas (2DEG) channel at the heterostructure interface. Gallium nitride (GaN) based HEMTs are also suitable for high power and high temperature applications. GaN has a rich offering of material properties spanning domains of non-linear optics, piezoelectric micro-electro-mechanical systems, and monolithic microwave integrated circuits. In this paper, we propose HEMT inspired III-V electro-optic modulator topologies and study the light interaction with 2DEG in such structures. We analyze the electroabsorption and electrorefraction on account of the 2DEG interaction with light and present a design framework to selectively leverage the desired mechanism of modulation. Our analysis suggests that modulation index of electrorefractive modulation in a HEMT-like structure is comparable to silicon photonic modulators. By leveraging the higher electron mobility in these material platforms, the device concepts proposed here could potentially be used to design electro-optic modulators with extremely high modulation rates. [ABSTRACT FROM AUTHOR]

In this letter, we analyzed the gate capacitance characteristics in p-GaN gate/AlGaN/GaN heterostructures by using a two-junction capacitor model. First, we have observed that the C – V behavior depends on the different processing conditions of the p-GaN gate. Second, a two-junction capacitor model considering a series connection of the Schottky metal/p-GaN junction capacitor and the AlGaN barrier capacitor is proposed to explain this C – V behavior. Based on this model, the junction capacitance has an influence on the total capacitance value under a high gate bias due to the Schottky metal/p-GaN junction. Furthermore, the Mg-concentration and hole density can be extracted. The extracted hole density is consistent with the results obtained by Hall measurements. [ABSTRACT FROM AUTHOR]

In this paper, fully recessed-gate GaN MISFETs with two different gate dielectrics, i.e., plasma-enhanced atomic layer deposition (PEALD) SiN and ALD Al2O3 gate dielectric, are used to study the origin of positive bias temperature instability (PBTI). By employing a set of dedicated stress-recovery tests, we study PBTI during the stress and relaxation. Hence, a defect band model with different distributions of defect levels inside the gate dielectric is proposed, which can excellently reproduce the experimental data and provide insightful information about the origin of PBTI in GaN MISFETs. The results indicate that the serious PBTI in the device with PEALD SiN is mainly due to a wide distribution of defect levels ( \sigma \sim 0.67 eV), centered below the conduction band of GaN ( E_{C} -0.05 eV), and can be easily accessed by the channel carriers already at a low-gate voltage. On the other hand, ALD Al2O3 gate dielectric shows a narrower distribution of defects ( \sigma \sim 0.42$ eV), which are far from the conduction band of GaN ( E_{C} +1.15 eV). This observations explain the improved PBTI reliability observed in devices with ALD Al2O3. [ABSTRACT FROM AUTHOR]

This letter reports an in-depth study of the negative threshold voltage instability in GaN-on-Si metal-insulator–semiconductor high electron mobility transistors with partially recessed AlGaN. Based on a set of stress/recovery experiments carried out at several temperatures, we demonstrate that: 1) operation at high temperatures and negative gate bias (−10 V) may induce a significant negative threshold voltage shift, that is well correlated to a decrease in on-resistance; 2) this process has time constants in the range between 10–100 s, and is accelerated by temperature, with activation energy equal to 0.37 eV; and 3) the shift in threshold voltage is recoverable, with logarithmic kinetics. The negative shift in threshold voltage is ascribed to the depletion of trap states located at the SiN/AlGaN interface and/or in the gate insulator. [ABSTRACT FROM PUBLISHER]

In this work we report on the three dominant trapping mechanisms affecting the dynamic performance of a double-heterostructure GaN-based MIS-HEMT grown on silicon substrate. In the OFF-state, with high drain voltage and pinched-off 2DEG, the dominant mechanism is the charge-trapping in the gate-drain access region caused by the transversal drain-to-substrate potential. This effect causes the dynamic increase of the ON-resistance, and is positively temperature-dependent, thus of great concern for high-temperature operation. In the SEMI-ON-state, due to the presence of high VDS and relatively high IDS, an additional trapping mechanism emerges, involving the injection of hot electrons from the 2DEG into trap states located in the GaN-buffer or in the AlGaN barrier. This mechanism, critical in hard-switching operations, affects both the ON-resistance and the VTH. Finally, when the gate is positively biased (gate overdrive state) trapping of electrons happens in the gate dielectric layer(s), leading to strong metastable VTH instabilities. [ABSTRACT FROM AUTHOR]

This letter demonstrates that GaN-based MIS-HEMTs submitted to stress with high-temperature, high drain bias, and constant source current (HTSC stress) may show degradation modes that are not detectable during standard high temperature reverse bias (HTRB) stress. Based on a number of stress/recovery experiments, we demonstrate the following novel results: 1) the combined presence of high drain bias and constant drain–source current (HTSC stress) can lead to a significant increase in ON-resistance ( R\mathrm{\scriptscriptstyle ON} ) that is not detected under conventional HTRB stress; 2) R\mathrm{\scriptscriptstyle ON} increases without changes in the threshold voltage, indicating that charge trapping takes place in the access regions, and not under the gate; 3) the R\mathrm{\scriptscriptstyle ON} increase has a monotonic dependence on the source current flowing during stress; and 4) for the same stress current level, the R\mathrm{\scriptscriptstyle ON} increase has a negative dependence on temperature. The strong correlation between R\mathrm{\scriptscriptstyle ON} increase and source current and the negative temperature coefficient strongly support the hypothesis that trapping originates from the injection of hot electrons toward the gate–drain access region. [ABSTRACT FROM PUBLISHER]

In this paper, we review and add additional data and understandings on our findings on the two most common failure modes of GaN-based HEMTs: 1) permanent gate leakage current increase and 2) output current drop. We suggested that they have different origins and one is not necessarily correlated to the other. Yet, they can both concur to the device degradation. First, we demonstrate that the phenomenon of gate leakage current increase has a voltage-accelerated degradation kinetic. Therefore, the identification of the critical voltage for leakage increase is meaningless. We demonstrate that the time-to-breakdown tBD data are Weibull distributed and we prove that they represent intrinsic failures. According to our data, this phenomenon is not related to the inverse piezoelectric effect. Finally, a new degradation model for the gate leakage current increase based on the percolation path theory is proposed. Second, we show that the permanent output current drop is a consequence of the relaxation of AlGaN layer. This occurs by means of formation of crystallographic defects as described by the inverse piezoelectric degradation model. Finally, we show an excellent stability of devices with reduced Al content in the AlGaN barrier, proving the crucial role of strain in the reliability of AlGaN/GaN HEMTs. [ABSTRACT FROM AUTHOR]

In this letter, we studied the forward bias gate breakdown mechanism on enhancement-mode p-GaN gate AlGaN/GaN high-electron mobility transistors. To the best of our knowledge, it is the first time that the temperature dependence of the forward gate breakdown has been characterized. We report for the first time on the observation of a positive temperature dependence, i.e., a higher temperature leads to a higher gate breakdown voltage. Such unexpected behavior is explained by avalanche breakdown mechanism: at a high positive gate bias, electron/hole pairs are generated in the depletion region at the Schottky metal/p-GaN junction. Furthermore, at a high gate bias but before the catastrophic gate breakdown, a light emission was detected by a emission microscopy measurement. This effect indicates an avalanche luminescence, which is mainly due to the recombination of the generated electron/hole pairs. [ABSTRACT FROM PUBLISHER]

The aim of achieving E-mode operations has led to the proposal of novel hybrid ferroelectric charge trap gate stack schemes. These schemes involve utilizing a combination of the charge trapping layer (CTL) and the ferroelectric laminated layer to positively shift the threshold voltage to a normally-off margin after initializing the gate pulse, thus achieving the Enhancement-mode (E-mode) characteristic. This study focuses on the forward gate bias time-dependent dielectric breakdown (TDDB) gate reliability in the E-Mode GaN MIS-HEMTs using ferroelectric charge trap gate stack (FEG-HEMT) with and without recess and investigates the impact of temperature on TDDB. The gate voltages required for operation with a 1 % failure rate over a 10-year period are 12.95 V and 10.22 V at 25 °C and 150 °C for both samples, respectively. Also, the examination of the stability of the recessed process by calculating the activation energies (0.7 eV) of both samples are demonstrated. The article also investigates the relationship between long-term reliability and short-term initialization by examining the transition point of the time-dependent failure curve. • The aim of achieving E -mode operations has led to the proposal of novel hybrid ferroelectric charge trap gate stack schemes. • This study focuses on the forward gate bias time-dependent dielectric breakdown (TDDB) gate reliability in the E-Mode GaN MIS-HEMTs using ferroelectric charge trap gate stack (FEG-HEMT) • The gate voltages required for operation with a 1% failure rate over a 10-year period are 12.95V and 10.22V at 25°C and 150°C for both samples, respectively. • Also, the examination of the stability of the recessed process by calculating the activation energies (0.7eV) of both samples are demonstrated. [ABSTRACT FROM AUTHOR]

To our knowledge, this is the first study to investigate the high-frequency (100–300 kHz) switching stability of SiC power devices at a Vds of 800 V during hard switching (HSW) and zero voltage switching (ZVS) operations. In this study, we proposed a topology for evaluating the switching dependencies (i.e., temperature, frequency, current, and duty cycle) in order to determine their flexibility in identifying circuit-level switching stability. We also evaluated the high-frequency switching stability of GaN power devices for comparison purposes. Overall, the results indicated that compared with GaN power devices, SiC power devices have higher dynamic drain-to-source on-resistance stability during ZVS and HSW high-frequency switching operations. • Investigate the high-frequency (100–300 kHz) switching stability of SiC power devices. • Propose a topology for evaluating the switching dependencies (i.e., temperature, frequency, current, and duty cycle). • Evaluate the high-frequency switching stability of GaN power devices for comparison purposes. • SiC power devices have higher dynamic drain-to-source on-resistance stability. [ABSTRACT FROM AUTHOR]

This paper reports an extensive analysis of the trapping and reliability issues in AlGaN/GaN metal insulator semiconductor (MIS) high electron mobility transistors (HEMTs). The study was carried out on three sets of devices with different gate insulators, namely PEALD SiN, RTCVD SiN and ALD Al 2 O 3 . Based on combined dc, pulsed and transient measurements we demonstrate the following: (i) the material/deposition technique used for the gate dielectric can significantly influence the main dc parameters (threshold current, subthreshold slope, gate leakage) and the current collapse; and (ii) current collapse is mainly due to a threshold voltage shift, which is ascribed to the trapping of electrons at the gate insulator and/or at the AlGaN/insulator interface. The threshold voltage shift (induced by a given quiescent bias) is directly correlated to the leakage current injected from the gate; this demonstrates the importance of reducing gate leakage for improving the dynamic performance of the devices. (iii) Frequency-dependent capacitance–voltage (C–V) measurements demonstrate that optimized dielectric allow to lower the threshold-voltage hysteresis, the frequency dependent capacitance dispersion, and the conductive losses under forward-bias. (iv) The material/deposition technique has a significant impact on device robustness against gate positive bias stress. Time to failure is Weibull-distributed with a beta factor not significantly influenced by the properties of the gate insulator. The results presented within this paper provide an up-to-date overview of the main advantages and limitations of GaN-based MIS HEMTs for power applications, on the related characterization techniques and on the possible strategies for improving device performance and reliability. [ABSTRACT FROM AUTHOR]

In this work, we have demonstrated the wireless power transfer (WPT) system based on the pristine and irradiated E-mode GaN devices. The GaN device has been irradiated up to the 100 kGy dose under the γ-ray irradiation, showing the improved electrical characteristic, such as the drain current increase (~8.34%) and gate current decrease (~−7.79%). An off-state drain induced instability measurement shows the robust performance in pristine and irradiated GaN device. Noted that the irradiated device exhibits less ΔV TH , suggesting the device instability has been improved. Moreover, the wireless power transfer efficiency was evaluated by utilizing different load (20 Ω ~ 120 Ω) at V DS = 50 V and V GS = 4 V. The results indicate that the transfer efficiency of WPT by implementing the pristine and irradiated GaN device are similar. Furthermore, the output power of WPT using the irradiated GaN device becomes higher, which is mainly due to the improved drain current in irradiated GaN power devices. • Demonstration of the wireless power transfer (WPT) system based on the pristine and irradiated E-mode GaN devices. • The GaN device has been irradiated (γ-ray with 100kGy dose), showing the I D increase (~8.34%) and I G decrease (~-7.79%). • The wireless power transfer efficiency was evaluated by utilizing different loads (20 Ω~120 Ω) at V DS = 50V and V GS = 4V. • The transfer efficiency of WPT by implementing pristine and irradiated GaN device are similar. • Furthermore, the output power of WPT using the irradiated GaN device becomes higher. [ABSTRACT FROM AUTHOR]

In this work, we observe the distinct V TH characteristics in the Au-free gate-first processing p-GaN/AlGaN/GaN HEMTs with two commonly used passivation layers, i.e., SiN and SiO 2. The lower incorporated H was found in the p-GaN/AlGaN/GaN heterostructure with higher activation anneal temperature (i.e., 700 °C). Furthermore, Photoluminescence (PL) spectrum demonstrates a higher blue luminescence (BL) intensity after higher annealing treatment. The X-ray photoelectron spectroscopy (XPS) spectrum near valence band edge depicts a similar valence band maximum (VBM) characteristic, by means no impact on p-GaN surface bending by using distinct thermal treatment. The device with SiN shows a depletion-mode (D-mode) characteristic (V TH ~ -5 V) whereas the device with SiO 2 passivation exhibits an enhancement-mode (E -mode) characteristic (V TH ~ +0.7 V). Moreover, Transmission Line Model (TLM) devices are fabricated to investigate the effects of the passivation on two-dimensional electron gas (2DEG) in p-GaN/AlGaN/GaN stack. The results indicate that a low R sh is obtained while passivating device surface with SiN layer, suggesting that 2DEG is present, which is most probably due to an unfunctional p-GaN layer. The secondary ion mass spectrometry (SIMS) results indicate a high hydrogen intensity in the p-GaN/AlGaN/GaN stack with a SiN passivation layer. Thus, the p-GaN deactivation process that correlates to the formation of complex Mg H after SiN passivation is proposed to explain the D-mode characteristic in the device with a SiN passivation layer. [ABSTRACT FROM AUTHOR]