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Selective area doping via ion implantation is crucial to the implementation of most modern devices and the provision of reasonable device design latitude for optimization. Herein, we report highly effective silicon ion implant activation in GaN via Symmetrical Multicycle Rapid Thermal Annealing (SMRTA) at peak temperatures of 1450 to 1530 °C, producing a mobility of up to 137 cm2/Vs at 300K with a 57% activation efficiency for a 300 nm thick 1 × 1019 cm−3 box implant profile. Doping activation efficiency and mobility improved alongside peak annealing temperature, while the deleterious degradation of the as-grown material electrical properties was only evident at the highest temperatures. This demonstrates efficient dopant activation while simultaneously maintaining low levels of unintentional doping and thus a high blocking voltage potential of the drift layers for high-voltage, high-power devices. Furthermore, efficient activation with high mobility has been achieved with GaN on sapphire, which is known for having relatively high defect densities but also for offering significant commercial potential due to the availability of cheap, large-area, and robust substrates for devices. [ABSTRACT FROM AUTHOR]

GaN vertical PiN diodes with different anode thicknesses were fabricated on three native GaN wafers with the same p-layer doping concentrations, and planar hybrid edge termination. The breakdown behavior in terms of the breakdown voltage and the electroluminescence were studied as functions of the anode thickness. A repeatable avalanche breakdown and highest breakdown voltage were measured with the thinnest anode of 300 nm and with the thinnest edge termination region. This indicates the efficacy of the nitrogen-implanted hybrid edge termination design that comprises of junction termination and guard rings hybrid design. As the anode thickness increases, the edge termination thickness increases, and the devices exhibit lower breakdown voltages and less robust breakdown characteristics, often destructive. From this study, we also conclude that a very high p-layer doping of 2 × 1019 cm−3 is not s practical doping level, because it is too sensitive to the edge termination thickness. [ABSTRACT FROM AUTHOR]

Gallium nitride (GaN) high electron-mobility transistors (HEMTs) offer considerable high-power operation but suffer in reliability due to potentially damaging self-heating. In this study, self-heating in AlGaN/GaN HEMTs on high conductivity substrates is assessed using a high-resolution thermoreflectance (TR) imaging technique, to compare the thermal response between GaN-on-Si, GaN-on-Diamond, and GaN-on-4H-SiC. The TR method accuracy at high-power density is verified using a nonlinear coefficient of TR (CTR) as a function of temperature. The acquired steady-state thermal maps give a thermal resistance of 11.5~mm ⋅ K/W for GaN-on-Si (based on peak channel temperature), compared to 2.7 and 3.3~mm ⋅ K/W for GaN-on-SiC and GaN-on-diamond substrates, respectively. The tested GaN-on-diamond HEMT exhibits similar heating rates to those seen on a SiC substrate, with a slightly higher peak temperature, which indicates a higher thermal boundary resistance that could offset the benefits of using a higher conductivity substrate and lead to faster thermally enhanced degradation. The analysis reveals the importance using high-resolution imaging to detect hotspots and areas of peak temperature that largely affect failure initiation and device reliability and which may not be otherwise observable. [ABSTRACT FROM AUTHOR]

GaN is a favorable martial for future efficient high voltage power switches. GaN has not dominated the power electronics market due to immature substrate, homoepitaxial growth, and immature processing technology. Understanding the impact of the substrate and homoepitaxial growth on the device performance is crucial for boosting the performance of GaN. In this work, we studied vertical GaN PiN diodes that were fabricated on non-homogenous Hydride Vapor Phase Epitaxy (HVPE) substrates from two different vendors. We show that defects which stemmed from growth techniques manifest themselves as leakage hubs. Different non-homogenous substrates showed different distribution of those defects spatially with the lesser quality substrates clustering those defects in clusters that causes pre-mature breakdown. Energetically these defects are mostly mid-gap around 1.8Ev with light emission spans from 450nm to 700nm. Photon emission spectrometry and hyperspectral electroluminescence were used to locate these defects spatially and energetically. [ABSTRACT FROM AUTHOR]

About 2 MeV proton numerical calculation damage indicates that a quasiflat profile is introduced into the GaN buffer layer of high‐electron‐mobility transistor (HEMT) templates. A previous transport study of such HEMT structures showed increased breakdown voltage and reduced GaN buffer layer leakage after proton irradiation. Hyperspectral electroluminescence measurements detected the emission band in the spectral region between 700 and 800 nm. This emission is assumed to be associated with the generation of trap levels responsible for the device failure. To obtain insights into the nature of radiation‐generated traps, detailed low‐temperature photoluminescence (PL) and cathodoluminescence (CL) experiments are conducted in a set of virgin and proton‐irradiated device structure templates. Both the PL and CL spectra show large intensity variations of all emission bands, in the spectral range between 330 and 890 nm, with increasing proton dosage. This is consistent with the introduction of compensating and/or nonradiative recombination centers in the GaN buffer layer. Luminescence measurements carried out under various excitation conditions show different recombination rates for emission bands observed near 420 and 550 nm, indicating different free carrier capture rates. Spectral analysis suggests that these two emission bands have different dependences on proton irradiation dosage, consistent with different chemical natures. [ABSTRACT FROM AUTHOR]

We report selective area n-type doping using ion implantation of Si into semi-insulating, C-doped GaN samples activated using both conventional rapid thermal annealing (RTA) and 30 atm N2 overpressure annealing. Implanted regions were tested for Si activation using Circular Transmission Line Measurements (CTLM), while linear and circular photoconductive switches (PCSS) in the unimplanted regions were used as a test vehicle to separate implanted Si dopant activation from leakage paths generated by N vacancy formation due to damage and decomposition during annealing. We observed that at an optimal temperature around 1060 °C, a low contact resistivity of $1\times 10^{-6}\,\,\Omega $ -cm2 was obtained while preserving the breakdown of the unimplanted regions. [ABSTRACT FROM AUTHOR]

Record DC power has been demonstrated in AlGaN/GaN high electron mobility transistors fabricated using a substrate replacement process in which a thick diamond substrate is grown by chemical vapor deposition following removal of the original Si substrate. Crucial to the process is a ~30 nm thick SiN interlayer that has been optimized for thermal resistance. The reductions obtained in self-heating have been quantified by transient thermoreflectance imaging and interpreted using 3D numerical simulation. With a DC power dissipation level of 56 W/mm, the measured average and maximum temperatures in the gate-drain access region were 176 °C and 205 °C, respectively. [ABSTRACT FROM AUTHOR]

The activation of ion implanted p-type dopants in GaN is notoriously difficult as the extremely high temperatures required to activate implanted Mg also damage the GaN crystal. In this paper, we present refinements to our novel annealing process (symmetric multicycle rapid thermal annealing) to reduce surface damage and contamination responsible for elevated leakage currents and non-ideal diode behavior. Furthermore, we apply the technique to Mg-implanted bulk GaN substrates to enable vertical power device structures, demonstrating rectifying p-i-n junctions. In addition, the technique was applied for edge termination in both p-i-n and Schottky barrier diodes, realizing floating guard ring and junction termination extension structures. The processes demonstrated here represents a key enabling step for future GaN-based power devices. [ABSTRACT FROM AUTHOR]

In this paper, electrical characterization results of N-polar GaN high-electron-mobility transistors that have been released from a 6H-SiC wafer and manually transferred to a Si wafer using a novel epitaxial lift-off (ELO) technique are presented. This recently developed ELO method uses a thin sacrificial layer of Nb2N, a hexagonal epitaxial conductor with less than 1% lattice mismatch to 4H- and 6H-SiC, to serve as the template for III-N device heterostructure growth. Measured results of transferred devices indicate that electron transport properties and low power density electrical performance are nominally unchanged relative to values measured before release. This technique has several advantages over competing ELO techniques, such as the well-known smart cut method, including bonding-ready released material with atomically-smooth backsides (≤ 0.5 nm rms), easy substrate reclaim with indefinite recycling potential, and a transfer process that can be performed after full front-side device processing and yield screening has been completed. [ABSTRACT FROM AUTHOR]

Carrier injection by single-photon absorption using ultraviolet optical pulses is used to investigate single-event transients in pristine and proton-irradiated AlGaN/GaN HEMTs. High-precision spatial mapping of defects and traps in AlGaN/GaN HEMT devices identify regions of enhanced SET signals, or “hot spots” that are ascribed to the presence of lattice defects that modify the electric field in the structure. The resulting transient shape and amplitude depend strongly on the specific location of the injected carriers, and vary with changes in gate and drain bias. Proton irradiation significantly alters transient signal shapes, increases the integrated collected charge, and increases density of defects and traps. [ABSTRACT FROM PUBLISHER]

Top-side integration of nanocrystalline diamond films in the fabrication sequence of AlGaN/GaN high electron mobility transistors is demonstrated. Reliable oxygen plasma etching of the diamond capping layer, required for a diamond-before-gate process, was implemented by using a sacrificial SiN 'dummy' gate. Hall characterization showed minimal (∼6%) reduction in sheet carrier density and commensurate increase in sheet resistance, while maintaining mobility and on-state drain current density. Off-state drain current and threshold voltage were increased, likely by fluorination of the AlGaN surface after removal of the sacrificial gate, even though a 20 nm thick Al2O3 layer was used as a SF6-plasma etch stop. Pulsed IDS and on-resistance were improved, indicating that a 10 nm SiN/500 nm NCD could offer improved AlGaN surface passivation compared to a more conventional 100 nm thick PECVD SiN film. [ABSTRACT FROM AUTHOR]

An Mg-implanted p-i-n diode was fabricated and characterized. Mg activation was achieved using the multicycle rapid thermal annealing technique with rapid heating pulses up to 1340 °C. The surface of the implanted GaN after annealing was smooth (0.94 nm RMS roughness) with growth steps evident as characterized by atomic force microscopy. The full width at half-maximum of the implanted GaN E2 Raman mode approaches that of the as-grown GaN after the annealing process, indicating that the annealing process is able to reverse most of the implantation damage. The Mg-implanted p-i-n diode exhibits rectification and a low leakage current of 0.11 μA cm−2 at a bias of −10 V. Under forward bias, light emission was observed from the p-i-n diode. The implantation and activation of Mg in a GaN-based device, demonstrated for the first time in this research, is a key enabling step for future optoelectronic and power electronic devices. Current-voltage characteristics of the Mg-implanted p-i-n diode with an inset of the device schematic. [ABSTRACT FROM AUTHOR]

AlGaN/GaN high-electron mobility transistor (HEMT) structures were grown by metal–organic chemical vapor deposition on SiC, hydride vapor phase epitaxy (HVPE) GaN, and ammonothermal GaN substrates to achieve HEMTs with over five orders of magnitude variation in extended defect density. This enables a direct comparison of the effect of extended defects on device performance to achieve the best possible reliability. As-grown material was characterized by atomic force microscopy, electron channeling contrast imaging, and Raman spectroscopy. Devices were characterized by Hall, dc $I$ – $V$ , and pulsed $I$ – $V$ behavior. Reduced threading dislocation density provides an increased 2-D electron gas mobility, but inhibits ohmic contact formation resulting in high contact resistance. Transistor characteristics were nominally identical, with higher OFF-state leakage in the HEMTs on ammonothermal GaN. The pulsed $I$ – $V$ response indicated significantly reduced current collapse in the HEMT on HVPE GaN due to reduced buffer trapping. [ABSTRACT FROM PUBLISHER]

AlGaN/GaN high electron mobility transistors grown on Si, SiC, and sapphire substrates were exposed to 2-MeV proton irradiation in incremental fluences up to \(6 \times 10^{14}\) cm \(^{-2}\) . The devices were characterized initially and after each irradiation by Hall and dc \(I\) – \(V\) measurements to probe the mechanisms associated with radiation-induced degradation and failure. It was determined that defects created at the AlGaN/GaN interface introduce scattering centers near the two-dimensional electron gas (2DEG), which result in degraded mobility. Additionally, charged traps in the structure serve to screen the 2DEG resulting in reduced sheet carrier density. These two effects are responsible for degraded \(I\) – \(V\) behavior, including reduced saturation current and transconductance, increased ON-resistance, and positive threshold voltage shift. Interestingly, the sample with the most pre-existing defects was the most tolerant of radiation-induced damage. [ABSTRACT FROM PUBLISHER]

Enhancements in AlGaN/GaN high-electron-mobility transistor (HEMT) performance have been realized through ultrathin (4 nm) AlN passivation layers, formed by atomic layer epitaxy (ALE). A combination of ex situ and in situ surface cleans prepare the surface for deposition of ALE AlN. HEMTs passivated by high crystallinity AlN, grown at 500^\circC, show improvements in 2-D electron gas sheet carrier density, gate leakage current, off-state drain leakage current, subthreshold slope, and breakdown voltage. In addition, degradation of dynamic on resistance during pulsed off-state voltage switching stress is suppressed by \sim50\% compared with HEMTs passivated by conventional plasma enhanced chemical vapor deposition SiNx. [ABSTRACT FROM PUBLISHER]

A novel device structure incorporating an ultrathin AIGaN barrier layer capped by an AIN layer in the source-drain access regions has been implemented to reliably control threshold voltage in AIGaN/GaN high-electron-mobility transistors. A recessed-gate structure has been used to decrease 2-D electron gas (2DEG) density under the gate, thus controlling threshold voltage while maintaining low on-resistance and high current density. The structure presented in this letter implements an ultrathin AIGaN structure grown by metal-organic chemical vapor deposition capped with AIN to maintain a high 2DEG density in the access regions. A selective wet etch using heated photoresist developer is used to selectively etch the AIN layer in the gate region to the AIGaN barrier. We have demonstrated a repeatable threshold voltage of +0.21 V with 4-nim AIGaN barrier layer thickness. [ABSTRACT FROM AUTHOR]