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In light of the importance of selective area doping in GaN to enable planar process technology, and to avoid the complications from the etch/regrowth process, ion implantation is the recognizable alternative. Annealing to activate dopant species and repair the damage to a crystal poses a challenge for GaN since the material will decompose to Ga + N2 at atmospheric pressure and relevant temperatures. In this research, in situ high- and low-temperature epitaxial and ex situ sputtered AlN caps were examined in different stacking arrangements to study the optimum conditions for Mg ion implantation and activation. Concurrently, a matrix of different implantation doses was also investigated to better understand the dose-dependent activation. Each sample has a unique cap stack and four different implant doses, including an unimplanted reference quadrant. The results show that poorer quality cap films enable nitrogen to leave the crystal during annealing and leave nitrogen vacancies behind. Furthermore, a high dose is needed at the surface to facilitate ohmic contact formation. The results suggest that in situ epitaxial-grown AlN caps are more suitable for GaN activation annealing, and high-temperature thin caps provide the best barrier to prevent crystal disintegration. We reveal a timely strategy for preserving the quality of GaN crystal structure during the electrical activation of the ion-implanted Mg atoms. This work provides valuable information that bridges the gap between device processing and electrical characterization of GaN devices, presenting a clear path towards achieving an electrical activation of implanted Mg while maintaining the integrity of the crystalline structure of GaN.

Present GaN technology consists primarily of heteroepitaxial, lateral high electron mobility transistors; however, high-power devices would be much more efficiently manufactured with a vertical geometry due to better blocking voltage scaling. This technology has yet to be realized due to the inconsistency of GaN wafer properties. These inconsistencies can be detected with several long-range, non-destructive techniques including Raman spectroscopy, optical profilometry, and photoluminescence mapping. In particular, Raman spectroscopy is an effective tool for determining the carrier concentration of GaN substrates and whether the wafers are uniform or inhomogeneous. In this work, vertical p-i-n GaN diodes are fabricated using both uniform and inhomogeneous wafers determined by using the A1 Raman peak position to monitor carrier concentration. The inhomogeneous samples have regular patterns of varying conductivity as a result of electron-donating defects brought about by changes in crystal stress. By avoiding these defects, we have found that diode performance improves by increasing the +/− 10 V rectification ratio by up to a factor of 5X and reducing the 200 V reverse bias leakage current by several orders of magnitude. Using the higher quality substrates with uniform electron carrier concentrations can improve the rectification ratio by another order of magnitude.

GaN is a favorable martial for future efficient high voltage power switches. GaN has not dominated the power electronics market due to immature substrate, homoepitaxial growth, and immature processing technology. Understanding the impact of the substrate and homoepitaxial growth on the device performance is crucial for boosting the performance of GaN. In this work, we studied vertical GaN PiN diodes that were fabricated on non-homogenous Hydride Vapor Phase Epitaxy (HVPE) substrates from two different vendors. We show that defects which stemmed from growth techniques manifest themselves as leakage hubs. Different non-homogenous substrates showed different distribution of those defects spatially with the lesser quality substrates clustering those defects in clusters that causes pre-mature breakdown. Energetically these defects are mostly mid-gap around 1.8Ev with light emission spans from 450nm to 700nm. Photon emission spectrometry and hyperspectral electroluminescence were used to locate these defects spatially and energetically.

Vertical GaN power switch technology is expected to be utilized in next-generation medium to high voltage power converters due to the low ON-resistance and high breakdown voltage enabled by the improved critical electric field and mobility compared to Si and SiC-based devices. As large area substrates have become available by hydride vapor phase epitaxy (HVPE) and ammonothermal growth, the properties of nitrides are no longer dominated by defects introduced by heteroepitaxial growth, allowing recent realization of several fundamental vertical power devices, including diodes with edge termination, trench MOSFETs, and CAVETs. However, additional materials challenges are coming to the forefront that need to be understood and surmounted in order to allow vertical GaN power devices to achieve their full potential, notably the realization of repeatable thick drift layers with low background doping. To enable this, a deeper understanding of substrate preparation and the effects of the substrate and growth initiation on the characteristics of the epitaxial layers is required for MOCVD growth of homoepitaxial films. We investigate these effects on epi morphology, uniformity, and impurity incorporation by growing simultaneously on wafers from different vendors. The goal of this work is to detect and identify defects in GaN substrates with a series of quick, non-destructive, inexpensive techniques with capabilities of mapping whole wafers. We have characterized multiple substrates from over eight suppliers and the homoepitaxy grown on those substrates. All the substrates had nominally similar as-received specifications (resistivity, thickness, off-cut angle, bow, surface finish). The substrates were evaluated with a variety of techniques including Raman spectroscopy, photoluminescence, white light interferometry, and Nomarski imaging, enabling to detection of different concentrations of grain boundaries, sample impurities, point defects, v-shaped pits, polishing defects, crystal stress damage, and non-uniform insulating and conducive regions. The substrates can be characterized in two different categories: those with uniform characteristics, including carrier concentration, and those without. Comparing these results to those from homoepitaxial growth on the same wafers, the effects are both subtle and overt. Macroscopic surface morphology, which has shown a direct correlation to leakage current, copies and exaggerates that of the underlying substrate. Photoluminescence of the homoepitaxial surface along with Raman spectroscopy show that non-uniformities in the substrate carrier concentration can continue into the epitaxy. Following optical characterization, vertical Schottky diodes were fabricated to quickly evaluate device performance. While most of the films showed the ability to withstand high electric fields, those with more uniform properties in the substrate also showed more uniform electrical properties. These results show that the bulk substrates enable the path to high voltage vertical devices, but also show the significant influence that substrates can play in device performance.

We report selective area n-type doping using ion implantation of Si into semi-insulating, C-doped GaN samples activated using both conventional rapid thermal annealing (RTA) and 30 atm N2 overpressure annealing. Implanted regions were tested for Si activation using Circular Transmission Line Measurements (CTLM), while linear and circular photoconductive switches (PCSS) in the unimplanted regions were used as a test vehicle to separate implanted Si dopant activation from leakage paths generated by N vacancy formation due to damage and decomposition during annealing. We observed that at an optimal temperature around 1060 °C, a low contact resistivity of $1\times 10^{-6}\,\,\Omega $ -cm2 was obtained while preserving the breakdown of the unimplanted regions.

Record DC power has been demonstrated in AlGaN/GaN high electron mobility transistors fabricated using a substrate replacement process in which a thick diamond substrate is grown by chemical vapor deposition following removal of the original Si substrate. Crucial to the process is a ~30 nm thick SiN interlayer that has been optimized for thermal resistance. The reductions obtained in self-heating have been quantified by transient thermoreflectance imaging and interpreted using 3D numerical simulation. With a DC power dissipation level of 56 W/mm, the measured average and maximum temperatures in the gate-drain access region were 176 °C and 205 °C, respectively.

It has been well established that GaN grown on native substrates yields higher quality films compared to those grown on non-native substrates, such as SiC or Si. However, homoepitaxy is hindered by the lack of inexpensive high-quality GaN substrates. The importance of substrate quality, in particular defects and impurities, arises from its impact on device performance. Many of the imperfections in GaN substrates are inhomogeneous, thus are often not detected when short-range techniques are used.Therefore, methods for evaluating substrate quality over long ranges need to be developed. This research reports the study of these defects on four different GaN wafers from four different vendors using quick, long-range, non-destructive techniques that can be performed in a few hours. All samples are expected to be n+ and should theoretically be suited for use in GaN homoepitaxial vertical power devices, though had different properties that could impact device performance. Through evaluation by Raman spectroscopy, photoluminescence, white light optical profilometry, and Nomarski imaging concentrations of grain boundaries, impurity incorporations, point defects, v-shaped cone defects, polishing defects, crystal stress damage, and insulating and conductive regions were identified across the various GaN substrates studied.

Ga2O3 is the only ultra-wide bandgap semiconductor with melt-growth substrate technology similar to that of Si, heterostructure device technology similar to that of the III-Nitride family, and high growth rate (GR) epitaxial technologies such as MOCVD and HVPE to support the development of ultra-high-breakdown voltage devices competitive with SiC technology. We have demonstrated for the first time a β-Ga2O3 MOSFET grown by high-GR MOCVD (Agnitron Technology’s Agilis 100 reactor) with record high mobility of 170 cm2/Vs, despite increased carrier scattering rate in the doped channel, facilitated by a significant improvement in epilayer quality. The high GR demonstrated via this method paves the road for demonstration of high breakdown voltage devices on a thick Ga2O3 buffer layer. [1] M.J. Tadjer et al., J. Phys. D: Appl. Phys. 54 (2021) 034005.

This paper describes the development of vertical GaN PN diodes for high-voltage applications. A centerpiece of this work is the creation of a foundry effort that incorporates epitaxial growth, wafer metrology, device design, processing, and characterization, and reliability evaluation and failure analysis. A parallel effort aims to develop very high voltage (up to 20 kV) GaN PN diodes for use as devices to protect the electric grid against electromagnetic pulses.

Skyrmions hold great promise for low-energy consumption and stable high-density information storage, and stabilization of the skyrmion lattice (SkX) phase at or above room temperature is greatly desired for practical use. The topological Hall effect can be used to identify candidate systems above room temperature, a challenging regime for direct observation by Lorentz electron microscopy. Atomically ordered FeGe thin films are grown epitaxially on Ge(111) substrates with $\ensuremath{\sim}4%$ tensile strain. Magnetic characterization reveals enhancement of the Curie temperature to 350 K due to strain, well above the bulk value of 278 K. A strong topological Hall effect was observed between 10 and 330 K, with a significant increase in magnitude observed at 330 K. The increase in magnitude occurs just below the Curie temperature, similar to the onset of the SkX phase in bulk FeGe. The results suggest that strained FeGe films may host a SkX phase above room temperature when significant tensile strain is applied.

In this work, we evaluate the effect of the novel symmetric multicycle rapid thermal annealing (SMRTA) process on both Mg ion implanted and non-implanted thick unintentionally doped GaN drift layers for vertical power devices. The typical p-type behavior and restoration of implant damage are observed in implanted samples, but on non-implanted samples a reduction in background carrier concentration and associated reduction in leakage current and increase in breakdown voltage is observed. This indicates that the capping/annealing process itself is not detrimental to the crystal, and the annihilation of native point defects in the process has beneficial effects for device structures.

The availability of high quality, free-standing GaN substrates enables new device applications in III-nitrides, especially for vertical device structures. With the introduction of these native substrates, the properties of nitrides are no longer dominated by defects introduced by heteroepitaxial growth. However, additional materials challenges are coming to the forefront that need to be understood and surmounted in order to allow homoepitaxial devices to achieve their full potential. In this paper, 2 μm of UID GaN are grown simultaneously by MOCVD on three commercially sourced 2″ HVPE wafers. By doing so, the substrates are exposed to the exact same growth conditions and the influence of the substrate can be unambiguously identified. The results are presented in regards to the effects of the substrates on epitaxial film morphology, uniformity, impurity incorporation, substrate/epitaxy interface, and electrical properties.

Single phase e -Mn4N thin and ultrathin films are grown on MgO(001) using molecular beam epitaxy. Reflection high-energy electron diffraction and out-of-plane X-ray diffraction measurements are taken for each sample in order to determine the in- and out-of-plane strain for each sample. Vibrating sample magnetometry and superconducting quantum interference device measurements, which are performed on the thin and ultrathin films respectively, are used to plot the magnetization of each sample versus both in- and out-of-plane H → -fields and to determine the magnitude of perpendicular magnetic anisotropy in these films. Three significant components of perpendicular magnetic anisotropy are observed in these films and are attributed to sample strain (1 component) and shape (2 components). Among these components, the most significant component 0.8 – 4.9 Merg cm 3 is identified as a second term of shape anisotropy, which possesses a negative linear relationship with sample thickness over the range from 9 nm to 310 nm. Atomic (magnetic) force microscopy measurements show the presence of a surface localized magnetic polarization (22–82 % ), which increases with decreasing thickness, when the net magnetizations of the films are zero. The second term of shape anisotropy as well as the surface localized polarization, which each depend on sample thickness, are each regarded as a consequence of Ising domains overlapping out-of-plane in these films.

The Super-Lattice Power Amplifier with Diamond Enhanced Superjunction (SPADES) device is being developed to enable a 2x increase in breakdown voltage of a Super-Lattice Castellated Field Effect Transistor (SLCFET) device. Incorporation of a diamond superjunction (SJ) within the drain region of a SLCFET was previously predicted to improve breakdown voltage with minimal impact on performance. P-type doped nanocrystalline diamond (NCD) is grown within etched trenches in the drain region of a SLCFET and tied to the gate, forming an active vertical field plate to laterally distribute electric field. Under high drain bias, mutual depletion regions are formed in the current carrying ridges and NCD in the drain region. This results in lower parasitic capacitance compared to a metal field plate, an important consideration for millimeter wave applications. On devices with an NCD SJ, we observe minimal capacitance penalty, low dispersion, and breakdown voltage behavior consistent with TCAD model prediction.

We investigate the effects of high-rate and high total doses of 60Co gamma rays on the current–voltage (IV) characteristics of GaN p+n diodes grown by metal-organic chemical vapor phase epitaxy on Ga-face (0001) sapphire and hydride vapor phase epitaxy freestanding GaN substrates. We show that diodes grown on sapphire undergo more permanent changes upon irradiation at doses up to 3900 kGy than those grown on freestanding GaN. By combining diode and circular transfer length method measurements, we show that the p-type contact interface and adjacent p++ Mg-doped layer are sensitive to irradiation. In initial experiments, diodes grown on sapphire exhibited p-type contacts with Schottky characteristics, while those on freestanding GaN were Ohmic. Serendipitously, we identified and subsequently irradiated a freestanding sample with a pre-irradiation spatial gradient of p-contact Schottky vs Ohmic behavior across the die. This sample allowed the root cause of induced change to be identified as differences in the p++ contacting layer. We show that the p-type contact's pre-irradiation Schottky behavior is predictive of diodes' IV characteristics changing significantly upon gamma-ray irradiation. Further, we observe that the IV curves of diodes on freestanding GaN recover fully over several weeks at room temperature to be indistinguishable from pre-irradiation. IV curves from diodes on sapphire do not fully recover; we thus hypothesize that interactions between radiation-induced point defects and threading dislocations affect the evolution of radiation damage.

Heterojunction field-effect transistors based on the β-(AlxGa1−x)2O3/Ga2O3 heterostructure grown by ozone-assisted molecular beam epitaxy were demonstrated for the first time. Al composition ratios in the 14%–23% range were validated using x-ray diffraction on the three samples grown for this study. Electrochemical capacitance-voltage (ECV) measurements showed the presence of a charge sheet in the delta-doped (AlxGa1−x)2O3 barrier layer. Secondary ion mass spectroscopy and ECV measurements also revealed an unintentional Si peak at the (AlxGa1−x)2O3/Ga2O3 interface. Direct current (IDS-VGS) and transconductance (Gm-VGS) measurements demonstrated depletion-mode transistor operation as well as the presence of a parallel conduction channel. A one-dimensional Poisson model suggested that dopant redistribution in the delta-doped region could cause a secondary channel to form in the barrier in addition to the primary channel near the (AlxGa1−x)2O3/Ga2O3 interface under certain conditions met in these samples. Fabricated devices on sample A did not exhibit breakdown up to the measurement limit of 1100 V, with stability after ten cycles. A maximum output drain current density of 22 mA/mm was measured on sample B. Room temperature Hall measurements yielded a sheet carrier density of 1.12 × 1013 cm−2 with corresponding Hall mobility of 95 cm2/V s in sample C.

We investigate the impact of high-dose gamma-ray irradiation on the electrical performance of Ga-polar and N-polar GaN-based p–n diodes grown by metalorganic chemical vapor deposition. We compare the current density–voltage (J–V), capacitance–voltage (C–V), and circular transfer length method characteristics of the p–n diodes fabricated on Ga-polar and N-polar orientations before and after irradiation. The relative turn-on voltage increases for the Ga-polar diodes with an increasing irradiation dose, while it increases initially and then starts to decrease for the N-polar diodes. The p-contact total resistance increases for Ga-polar and decreases for N-polar samples, which we attribute to the formation of point defects and additional Mg activation after irradiation. The J–V characteristics of most of the tested diodes recovered over time, suggesting the changes in the J–V characteristics are temporary and potentially due to metastable occupancy of traps after irradiation. X-ray photoelectron spectroscopy and photoluminescence measurements reveal the existence of different types of initial defects and surface electronic states on Ga-polar and N-polar samples. Gallium vacancies (VGa) are dominant defects in Ga-polar samples, while nitrogen vacancies (VN) are dominant in N-polar samples. The presence of a higher concentration of surface states on Ga-polar surfaces than N-polar surfaces was confirmed by calculating the band bending and the corresponding screening effect due to opposite polarization bound charge and ionized acceptors at the surface. The difference in surface stoichiometry in these two orientations is responsible for the different behavior in electrical characteristics after gamma-ray interactions.

In this work, we fabricate Van der Pauw structures on AlGaN/GaN high electron mobility transistors (HEMTs) with both SiN and AlN passivation layers and both SiC and GaN substrates to study temperature dependent electron transport properties of 2 dimensional electron gases (2DEG) in as-fabricated and proton irradiated devices. We confirm that using a GaN substrate or AlN passivation layer enhances the mobility particularly at low temperatures, though this enhancement is greatly reduced upon irradiating the samples with high proton fluences. Our results suggest that the sheet density may be affected by Al diffusion in the sample creating electron donating impurities, which freeze out around 200 K and are more prominent in AlN passivated samples and minimized by using a GaN over a SiC substrate. Additionally, we show that a large dose of radiation forms traps in the AlGaN layer, which drop the sheet density at high proton fluences.

Single crystal (−201) β-Ga2O3 substrates doped with Si and Sn have been thermally annealed in N2 and O2 atmospheres. Structural and electrical properties evaluation was performed via a number of experimental methods in order to quantify the effects of the doping and annealing ambient on the properties of these samples. All samples annealed in O2 exhibited significantly lower carrier concentration, as determined by capacitance–voltage measurements. Schottky barrier diodes exhibited excellent rectification when the Ga2O3 was annealed in N2, and significantly lower forward current using O2-annealed Ga2O3 substrates. Deep level transient spectroscopy revealed four deep trap levels with activation energies in the range of 0.40–1.07 eV. Electron spin resonance showed a decrease in shallow donor concentration, and cathodoluminescence spectroscopy revealed nearly two orders of magnitude lower emission intensity in O2-annealed Ga2O3 samples. Raman spectroscopy revealed a carrier concentration dependent Raman mode around 254 cm−1 observed only when the final anneal of (−201) β-Ga2O3 was not done in O2. Secondary ion mass spectroscopy measurements revealed diffusion of unintentional Fe towards the surface of the (−201) Ga2O3 samples after annealing in O2. Depth resolved positron annihilation spectroscopy showed an increased density of vacancy defects in the bulk region of O2-annealed Ga2O3 substrates.

We demonstrate p-type activation of GaN doped by Mg ion implantation, and in situ during metalorganic chemical vapor deposition through sequential short-duration gyrotron microwave heating cycles at temperatures of 1200–1350 °C. GaN is implanted with 1019 cm−3 Mg ions, capped with AlN, and annealed under 3 MPa N2 overpressure in 5 s heating cycles for less than 60 s total using a high-power gyrotron microwave heating source. Through I–V characterization, photoluminescence spectroscopy, and Raman spectroscopy, we study the evolution of electrical properties, optically active point defects, and material strain in response to implantation and annealing. For Mg-implanted samples, increasing annealing temperature is characterized by an increase in the PL substitutional Mg-related peak (UVL) relative to the shallow-donor vacancy-related peak (GL2). Through comparison of implanted and in situ doped samples, it is demonstrated that the origin of compensating VN lies primarily in implantation rather than degradation from the annealing process. Transmission line measurements and diode I–V measurements show a sheet resistance of 1083 kΩ/□ and a hole concentration of 1.23 × 1015 cm−3, respectively, in the Mg-implanted material annealed at 1350 °C. We conclude that temperature-cycled gyrotron annealing at 1350 °C decreases implant-induced compensating point defects and activates Mg to obtain selective p-type conduction.

Plasma etching of p-type GaN creates n-type nitrogen vacancy (VN) defects at the etched surface, which can be detrimental to device performance. In mesa isolated diodes, etch damage on the sidewalls degrades the ideality factor and leakage current. A treatment was developed to recover both the ideality factor and leakage current, which uses UV/O3 treatment to oxidize the damaged layers followed by HF etching to remove them. The temperature dependent I–V measurement shows that the reverse leakage transport mechanism is dominated by Poole–Frenkel emission at room temperature through the etch-induced VN defect. Depth resolved cathodoluminescence confirms that the damage is limited to first several nanometers and is consistent with the VN defect.

Semi-insulating GaN films with controlled dopant profiles have significant potential to improve the performance of high-power electronics. Beryllium doped GaN (GaN:Be) films previously demonstrated a semi-insulating nature, but the Be-dopant profiles in these films exhibited Be surface segregation and accumulation, which would lead to undesired leakage current paths in devices and deterioration of breakdown voltage. Improved growth kinetics of metal modulated epitaxy at low growth temperatures are applied in the study of GaN:Be films to achieve selectively controlled and abrupt step-doped Be profiles. The GaN:Be films were found to be semi-insulating via Hall effect measurements at elevated temperatures of 495 K. The films were shown to effectively electrically compensate surface contaminants at regrowth interfaces. Surface contaminants (O, Si, and C) typically result in unintentional n-type doping at the GaN on GaN regrowth interface. In order to demonstrate the utility of Be doping, GaN:Mg p-type films are grown atop GaN:Be buffer, AlN buffer, and control samples without any insulating buffer on GaN:Fe templates. Remarkably, the p-type films grown atop control samples up to 400 nm thick are compensated from surface contaminants, whereas the films grown atop AlN and GaN:Be insulating layers effectively electrically neutralize the surface contaminants and result in high hole concentrations of 2.3 and 2.5 × 1019 cm−3, respectively. The use of GaN:Be instead of AlN buffers eliminates the need to deconvolve the effects of the AlN/GaN 2D sheet charges and defects from lattice mismatch, removes lateral conduction paths, and reduces inherently high static vertical electric fields that detract from power device performance.

III-Nitride high electron mobility transistors (HEMTs) have been of critical importance for commercial and military applications which require the high frequency, high power density enabled by the favorable properties of Gallium Nitride. However, the long-term reliable operation of GaN at high power has continued to face unique challenges originating from the simultaneously high electric field and high temperature within a small volume of a HEMT [1]. Mitigating self-heating using a CVD diamond cap have resulted in about 20% lower device temperature at the expense of additional process complexity in order to integrate the heat spreading close to the 2DEG channel [2]. Similarly, GaN -on-diamond technology has produced excellent electrothermal performance by integrating GaN -on-Si with CVD diamond growth on the N-polar back side [3]. Such advances in thermal management have demonstrated that GaN HEMTs have the potential to operate reliably at very high power density $(> 10\mathrm{W}/\mathrm{mm})$ . In this work, we have quantified the electrothermal performance of state-of-the-art AIGaN/GaN HEMTs on Si and diamond substrates and demonstrate very high DC output power operation at a reliably low temperature.

Vertical heterojunction p-CuI/n-Ga2O3 diodes were fabricated on commercial β-Ga2O3 substrates using the reaction of epitaxially-sputtered Cu with natural I2 vapor at room temperature followed by either a high temperature I2 gas reaction or an I2 solution treatment to remove iodine vacancies. Results show that using an epitaxially-oriented over a polycrystalline Cu layer produces larger and more strongly bonded CuI crystals. Hall and current–voltage measurements support rectifying behavior consistent with p-CuI/n-Ga2O3 heterojunction characteristics including 8 orders of magnitude I on/I off ratio and an ideality factor of 1.37 measured on the sample with the lowest concentration of iodine vacancies.

Ferromagnetic L10−MnGa was grown by molecular beam epitaxy under ultrahigh vacuum conditions to a 73±5nm thickness atop of 50±5nm thick molecular beam epitaxy grown antiferromagnetic η⊥−Mn3N2 on an MgO(001) substrate. The MnGa grew along the c-axis with an out-of-plane spacing of c=3.71±0.01A and a relaxed in-plane spacing of a=4.00±0.05A measured with x-ray diffraction and reflection high-energy electron diffraction, respectively. Williamson–Hall analysis revealed 67±17nm tall columnar grains with a residual strain of 2.40±0.26(×10−3). A radial distribution plot of screw dislocations observed in scanning tunneling microscopy images showed an in-plane coherence length of 15±5nm. Reflection high-energy electron diffraction analysis of the in-plane lattice spacing during growth reveals a critical thickness of 1.05±0.65nm for the MnGa, after which the MnGa film relaxes by incorporating dislocations of both edge and screw type. Vibrating sample magnetometry was employed to obtain the magnetic properties of the bilayer system. It is found that the dislocation density plays a significant role in influencing the measured moment per unit cell, where a large dislocation density lowers the moment per unit cell significantly due to chemical layer disordering.

We measure the spin Hall angle in Au layers of 5--100 nm thicknesses by spin pumping from ${\mathrm{Y}}_{3}\mathrm{F}{\mathrm{e}}_{5}{\mathrm{O}}_{12}$ epitaxial films grown by ultrahigh vacuum, off-axis sputtering. We observe a striking increase in the spin Hall angle for Au layers thinner than the measured spin diffusion length of 12.6 nm. In particular, the 5 nm Au layer shows a large spin Hall angle of 0.087, compared to those of 0.016 and 0.017 for the 50 and 100 nm Au layers, respectively, suggesting that the top surface plays a dominant role in spin Hall physics when the spin current is able to reach it. Other spin pumping related parameters, including Gilbert damping enhancement, interfacial spin mixing conductance, and spin current are also determined for Au layers of various thicknesses. Given the pervasive role of ultrathin films in electrical and spin transport applications, this result emphasizes the importance of considering the impact of the top surface and reveals the possibility of tuning critical spin parameters by film thickness.

B20 phase magnetic materials, such as FeGe, have been of significant interests in recent years because they enable magnetic skyrmions, which can potentially lead to low energy cost spintronic applications. One major effort in this emerging field is the stabilization of skyrmions at room temperature and zero external magnetic field. We report the growth of phase-pure FeGe epitaxial thin films on Si(111) substrates by ultrahigh vacuum off-axis sputtering. The high crystalline quality of the FeGe films was confirmed by x-ray diffraction and scanning transmission electron microscopy. Hall effect measurements reveal strong topological Hall effect after subtracting out the ordinary and anomalous Hall effects, demonstrating the formation of high density skyrmions in FeGe films between 5 and 275 K. In particular, substantial topological Hall effect was observed at zero magnetic field, showing a robust skyrmion phase without the need of an external magnetic field.

Epitaxial films of the pyrochlore Nd2Ir2O7 have been grown on (111)-oriented yttria-stabilized zirconia (YSZ) substrates by off-axis sputtering followed by post-growth annealing. X-ray diffraction (XRD) results demonstrate phase-pure epitaxial growth of the pyrochlore films on YSZ. Scanning transmission electron microscopy (STEM) investigation of an Nd2Ir2O7 film with a short post-annealing provides insight into the mechanism for crystallization of Nd2Ir2O7 during the post-annealing process. STEM images reveal clear pyrochlore ordering of Nd and Ir in the films. The epitaxial relationship between the YSZ and Nd2Ir2O7 is observed clearly while some interfacial regions show a thin region with polycrystalline Ir nanocrystals.

Semi-insulating halide vapor phase epitaxial β-Ga2O3 films without intentional dopants introduced during growth are demonstrated. The sheet resistance measured in the 340–480 K range yielded 268–134 kΩ/◻ and an activation energy of 0.81 eV. Room temperature capacitance-voltage measurements at 1 MHz showed evidence of an ultra-low free carrier concentration n-type film with a free carrier concentration near flatband (VFB ∼ 4.4 V) estimated to be

We report structural and magnetic properties of magnetostrictive Fe100−xGax (x ≈ 15) alloys when deposited onto antiferromagnetic manganese nitride and non-magnetic magnesium oxide substrates. From X-ray diffraction measurements, we find that the FeGa films are single crystalline. Scanning tunneling microscopy imaging reveals that the surface morphologies are dictated by the growth temperature, composition, and substrate. The magnetic properties can be tailored by the substrate, as found by magnetic force microscopy imaging and vibrating sample magnetometry measurements. In addition to pronounced tetragonal deformations, depositing FeGa onto manganese nitride leads to the formation of stripe-like magnetic domain patterns and to the appearance of perpendicular magnetic anisotropy.

The saturation magnetization of Y3Fe5O12 (YIG) epitaxial films 4 to 250 nm in thickness has been determined by complementary measurements including the angular and frequency dependencies of the ferromagnetic resonance fields as well as magnetometry measurements. The YIG films exhibit state-of-the-art crystalline quality, proper stoichiometry, and pure Fe3+ valence state. The values of YIG magnetization obtained from all the techniques significantly exceed previously reported values for single crystal YIG and the theoretical maximum. This enhancement of magnetization, not attributable to off-stoichiometry or other defects in YIG, opens opportunities for tuning magnetic properties in epitaxial films of magnetic insulators.

A method for the synthesis of three-dimensionally ordered macroporous crystals from materials that exhibit additional functionality using a hetero-metallic precursor is reported.