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The 3C-SiC (111) layer has been grown on Si (110) substrate by using hexachloro-disilane (HCDS) and propane. The propane flow rate was controlled in the carbonization step and the growth step for obtaining SiC layer with high crystal quality. The high quality epitaxial 3C-SiC (111) layer was successfully grown at growth temperature of 1280°C and lower propane flow rate condition. Grown 3C-SiC epitaxial layers were systematically analyzed by an optical microscope, Raman spectroscopy, FE-SEM and XRD

The chlorinated precursor is recently focused for high growth rate and high quality epitaxial layer. In the previous studies, the addition of chlorinated species from Si2Cl6 in the gas phase eliminated simultaneous Si nucleation which interferes with epitaxy. In this work, the characterization of epitaxial layers grown with chlorinated species is focused. High growth rate of 30 μm/h was achieved by using Si2(CH3)6 and Si2Cl6 as chlorinated precursors. We concluded that high growth rate was achieved by using HMDS and HCDS as the precursor of SiC at growth temperature of 1600 °C.

We adopted HMDS(Hexamethyledisilane) as a SiC(Silicon carbide) source material for epitaxial growth of 3C-SiC on Si substrate. Various growth profiles were investigated to optimize hetero-epitaxial growth of 3C-SiC layers. We also focused on the homogeneous film deposition of 3C-SiC on Si by employing two susceptor shapes, flat and tilted susceptors, to control a thickness of the boundary layer formed on the Si substrate. Fringe color patterns were observed on 3C-SiC layer on Si and hence it was easy to characterize the film uniformity by analyzing this color. 3C-SiC epitaxial layers were systematically analyzed by an optical microscope, a Raman spectroscopy, a SEM and an XRD.

The present research was focused to produce 2 inch wafers from small rectangular seeds and to investigate the quality of non-polar SiC substrates grown by a conventional PVT method. The non-polar SiC seeds were prepared by cutting along direction of 6H-SiC crystal grown on (0001) basal plane. As SiC ingot grows, many defects in connected region were gradually diminished. While the full width at half maximum (FWHM) values of m-plane SiC substrate measured along a-direction and c-direction were 60 arcsec and 70 arcsec, respectively, and the FWHM values of a-plane SiC substrate measured along m-direction and c-direction were 27 arcsec and 31 arcsec respectively. The stacking faults lying in the basal plane can be detected by molten KOH etching as linear etch pits extending along on the (11-20) surface and the carrier concentration was observed by Raman spectrum.

4H-SiC was grown on 4H-SiC (1100) substrates by sublimation boule growth, and transmission electron microscopic investigation was carried out. Two basal-plane-dislocations in the same basal plane (the BPD pair), whose dislocation line extend toward the [1100] growth direction, were observed as aligned along [0001]. The density of the BPD pairs along [0001] was in the same order with that of the stacking faults in the sample. A threading screw-dislocation was observed in between aligned BPD pairs. It is proposed that the interaction between stacking faults and threading screw-dislocations on the grown surface generates the BPD pairs. Since a high density of stacking faults is inherent to the growth on the substrates perpendicular to (0001), keeping an atomically flat grown surface is important to prevent the generation of the threading screw-dislocations, and thus to suppress the generation of the BPD pairs in case of the growth on (1100) and/or (11 2 0) substrates.

A sublimation epitaxial method, referred to as the Closed Space Technique (CST) was adopted to produce AlN epitaxial layers. In this study, we report the surface morphology of AlN epitaxial layer grown on various substrates such as 3C-SiC (100), 4H-SiC (0001) with 8o off-axis (0001) plane tilted toward the direction and on-axis 4H-SiC (0001). An average growth rate of AlN layer at 2350oC in 500 Torr of N2 was measured to be about 6μm/hr. While AlN layer grown on the 3C-SiC (100) substrate at 2350oC exhibited polycrystalline structure, AlN epitaxial layer grown on on-axis and off-axis 4H-SiC (0001) substrates had highly c-axis oriented epitaxial structure. In particular, the stacked structure of hexagonal plates was observed on off-axis substrate and the size of the hexagonal plates increased with growth time. Hexagonal plates were observed to be coalesced and the step-bunching was finally disappeared.

We have presented a combined method of microscopic measurements between Raman scattering and polarizing optical microscope to characterize inhomogeneous residual stress distributions around dislocations in 4H- and 6H-SiC wafers. First, stressed portions were found in wafers by an optical polarizing microscope under a crossed Nicole arrangement. Then, the portions were examined by Raman-imaging technique for lateral variations of phonon spectra. The residual stresses were quantified from the phonon-peak frequency shift using a known frequency-shift rate for 6H-SiC. Characterization to the depth direction was also conducted by surface etching with molten KOH. The stresses typically amounted to the order of 100 MPa. In a 4H-SiC homoepitaxial wafer sample, we observed threading dislocations transferred from the substrate to the epitaxial layer, and found that larger stress fields existed in the epitaxial layer than the substrate. We also observed stress distributions around compressively stressed sub-grain boundaries.

A sublimation epitaxial method, referred to as the Closed Space Technique (CST) was adopted to produce thick SiC epitaxial layers for power device applications. In this study, we aimed to systematically investigate surface morphologies and electrical properties of SiC epitaxial layers grown with varying a SiC/Al ratio in a SiC source powder during the sublimation growth using the CST method. It was confirmed that the acceptor concentration of epitaxial layer was continuously decreased with increasing the SiC/Al ratio. The blue light emission was successfully observed on a PN diode structure fabricated with the p-type SiC epitaxial layer. Furthermore, 4H-SiC MESFETs having a micron-gate length were fabricated using a lithography process and their current-voltage performances were characterized.

A sublimation epitaxial method, referred to as the Closed Space Technique (CST) was adopted to produce thick SiC epitaxial layers for power device applications. We aimed to systematically investigate the dependence of SiC epilayer quality and growth rate during the sublimation growth using the CST method on various process parameters such as the growth temperature and working pressure. The etched surface of a SiC epitaxial layer grown with low growth rate (30 μm/h) exhibited a low etch pit density (EPD) of ~2000 /cm2 and a low micropipe density (MPD) of 2 /cm2. The etched surface of a SiC epitaxial layer grown with a high growth rate (above 100 μm/h) contained a high EPD of ~3500 /cm2 and a high MPD of ~500 /cm2, which indicates that high growth rate aids the formation of dislocations and micropipes in the epitaxial layer.

Investigations were carried out to achieve high performance Silicon Carbide Metal-Oxide-Semiconductor device structures. 4H-SiC/SiO2 interface was prepared by growing amorphous SiO2 layers by an alternate low temperature atmospheric CVD technique using TEOS as source material and the interface properties were compared with the one prepared by conventional thermal oxidation technique. The low temperature CVD technique offered the improvement of the interface properties with reduced Dit in comparison with thermally oxidized interface. As a new attempt, an in situ post growth annealing technique in N2 atmosphere was carried out to reduce the Dit further. Both the CVD technique and the in situ annealing processes that were used in the present study have been identified to be potential approaches to improve the interface quality.

For preliminary step toward fabrication of MOSFET using 4H-SiC 8) 3 (03 prepared by sublimation method, epitaxial growth of device quality 4H-SiC on 4H-SiC (0001) 8.0° off substrate was carried out and investigated. Smooth and specular surface of 4H-SiC (0001) plane was obtained by optimum growth condition. And epitaxial growth on 4H-SiC 8) 3 (03 and ) 8 3 (03 substrates were carried out with optimum growth conditions of 4H-SiC (0001). Smooth and specular surface was obtained on 4H-SiC 8) 3 (03 and ) 8 3 (03 plane. Growth rate of epilayers of 4H-SiC (0001), 8) 3 (03 and ) 8 3 (03 face were same. Oxidation rate of 4H-SiC (0001), ) 1 (000 , 8) 3 (03 and ) 8 3 (03 face was investigated. The oxidation rate was different depending on the faces. It was observed that the difference of oxidation rate of 8) 3 (03 and ) 8 3 (03 is mainly due to the difference of polarity similar to the case of reported for (0001) and ) 1 (000 .

The selective growth of Si column was carried out by depositing Au on patterned Si (111) substrate as a solvent in chemical vapor transport method by using halides (HCl). The Si column was produced by VLS mechanism. The column was covered with SiC by conventional CVD process using HMDS ( Hexamethyldisilane ). Carbon Nano Tube ( CNT ) was deposited on Si column covered with SiC by DC assisted µ-wave plasma CVD.

The preparation of porous 4H-SiC by electrochemical etching of SiC crystals was investigated. The porous layer was created at the porous SiC (PSC)/SiC interface but not from the SiC/electrolyte interface. The nanopores at the adjacent region of PSC/SiC interface were bigger than those at the top region. In the visible light region, the optical reflectance from PSC exhibits interference fringes. In the Reststrahlen region, the fourier transform infrared (FTIR) reflectance of porous 4H-SiC shows a splitting into more bands: a broad band with high reflectivity at low frequency and several sharp peaks near the LO frequency. The width and shape of FTIR spectra depended on the anodization current density. The anodization current density is a crucial parameter which determined the porosity, porosity depth profile, and the thickness of PSC layers. A pore transformation of porous structure was observed after chemical vapor deposition process.

The pendeo epitaxial growth has been applied for the growth of 3C-SiC on (001) Si substrates. This growth was performed by VPE using hexamethyldisilane (HMDS) as a source gas. To characterize the crystallinity of the seed 3C-SiC and the pendeo epitaxial layer, the high resolution transmission electron microscopic (HRTEM) analysis was carried out. In the vertically grown layer on the seed 3C-SiC, the high-defect-density regions were observed. On the contrary, the low-defect-density regions were observed in the laterally grown layer. It was revealed from the TEM observations that lattice information can be transferred through the seed 3C-SiC while defects can be prevented from propagating into the epitaxial layer due to the presence of the air gap.

Hetero-epitaxial CVD growth of 3C-SiC on a Si(110) substrate gives a (111) crystal with low defects density. However, double positioning growth often disturbs growth of a single crystal. The growth on an off-axis Si(110) substrate suppressed propagation of the double positioning defects in the grown layer effectively. Cross-sectional transmission electron microscopy revealed the details of the suppression process on the off-axis substrate. The suppression mechanism and the origin of the defects formation at double positioning boundaries were interpreted by the growth model based on an anisotropic growth rate on (111) plane of 3C-SiC.

Interfaces between a Si(110) substrate and 3C-SiC crystals grown hetero-epitaxially by CVD were investigated by cross-sectional transmission electron microscopy. Gas flow condition during the carbonization process affects the roughness of the substrate surface and there is an optimum condition to preserve the flat surface. High quality 3C-SiC crystals grew only on the flat substrate, with crystallographic relationship of Si[1-10]//SiC[1-10] and Si[001]//SiC[1-1 - 2], because the well-lattice-match relationship was limited in a two-dimensional region at the SiC(111)/Si(110) interface. Using the optimum condition, some kinds of roughness at an atomic scale remained on the surface of the substrate. Nanoscopic observation of the crystals grown on an off-axis substrate revealed the influence of the roughness on the epitaxial growth and the defects generation at the interface.

Most of the ion implanter is large scale, high acceleration voltage and expensive. For research and development, such a huge implanter is not required. Our motivation is to make desktop type ion implanter for SiC device. We report the fabrication of a compact 100 kV ion implanter. In order to miniaturize the equipment, an ion source, an accelerator tube and a main chamber were vertically arranged. We implanted Argon (Ar) and Nitrogen (N) ions to 6H-SiC substrate and the implanted 6H-SiC substrates were characterized by Fourier Transform Infrared Spectrometer (FTIR), Rutherford Backscattering Spectrometry (RBS) and Secondary Ion Mass Spectrometry (SIMS). In this report, concept of desktop ion implanter, evaluation of implanted substrate and its device application are presented. In order to characterize capability, with using the newly made compact ion implanter, it was possible to make implantation on SiC to get amorphous layer suitable for deices.

Lateral epitaxial overgrowth (LEO) is known as method of defects reduction for GaN. LEO is expected to reduce crystal defects on hetero-epitaxial growth of 3C-SiC. (100) Si substrate patterned with SiO2 mask was used as the substrate. Before CVD process, V shape crater was made on Si surface by HCl etching. And growth condition of CVD was optimized. Single crystal of 3C-SiC was grown laterally on SiO2 layer. Cross-sectional transmission electron microscopic observation indicated that crystal quality of LEO region was single and no defect crystal.

Chemical vapor deposition of (111) 3C-SiC on (110) Si substrate was carried out, and the effect of the substrate off-axis introduced on (110) Si substrate for suppressing the twin formation in 3C-SiC hetero-epitaxial layers was investigated. From the growth on hemispherically polished (110) Si substrate, it was found that the off-axis toward the [001] Si axis had a noble effect for suppressing the twin formation, while the off-axis toward the [110] Si axis was ineffective. The growth of single 3C-SiC crystal containing few double positioning boundaries, which are related with the twin formation, was demonstrated on the (110) Si substrate 3° off-axis toward the [001] Si axis. Transmission electron microscopic observation revealed that double positioning boundaries on the (110) Si substrate off-axis toward the [001] Si axis were nearly eliminated within the initial a few hundreds nano meter in thickness.

Without any assumption of the number of donor species, the densities and energy levels of donors in undoped 3C-SiC grown from hexamethyldisilane (HMDS; Si2(CH3)6) are precisely determined by a graphical peak analysis method proposed here, using the temperature dependence of the majority-carrier concentration obtained from Hall-effect measurements.