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Total-ionizing-dose (TID) responses are investigated for 3-D-sequentially integrated fully depleted silicon-on-insulator (FD-SOI) MOSFETs. Strong layer-to-layer coupling of TID response is observed. The simultaneous application of positive bias to the gate of the bottom-layer device and negative bias to the top-layer device leads to the maximum enhancement of positive charge trapping in the top-layer device and the intermediate dielectric layer. This enhancement is due to the upward-directed electric field in the intermediate dielectric layer under these bias conditions. In contrast, electrostatic shielding prevents the gate bias of the top-layer device from affecting the response of the bottom-layer device, as confirmed by experiments and technology computer-aided design (TCAD) simulations. Effects of layer-to-layer coupling are less significant for postirradiation-biased annealing. [ABSTRACT FROM AUTHOR]

Total-ionizing-dose (TID) effects are investigated in a highly-scaled gate-all-around (GAA) FET technology using Si nanowire channels with a diameter of 8 nm. n- and p-FETs are irradiated up to 300 Mrad(SiO2) and annealed at room temperature. TID effects are negligible up to 10 Mrad(SiO2). At ultrahigh doses, the TID degradation depends on the irradiation bias condition, with more severe effects observed in longer channel devices. The worst case irradiation condition is when positive bias is applied to the gate. Threshold-voltage shifts are caused by H+-driven generation of interface traps at the oxide/channel interface. In contrast, FETs irradiated under negative gate bias are dominated by transconductance loss and increases of low-frequency noise, suggesting the activation of border traps. Enhanced off-leakage current is observed in n-FETs due to charge trapping in shallow-trench isolation, and in p-FETs due to trap-assisted recombination at STI sidewalls and/or spacer dielectrics at drain/bulk junctions. [ABSTRACT FROM AUTHOR]

An overview is presented of displacement damage (DD) effects, total-ionizing-dose (TID) effects, and single-event effects in AlGaN/GaN high electron mobility transistors (HEMTs). High-fluence proton-induced DD creates point defects and impurity complexes at fluences that are comparable to or higher than those encountered in space applications. Defect and impurity dehydrogenation also contributes significantly to the DD/TID response at fluences typical of realistic space environments. The bias applied during irradiation can affect the DD/TID response strongly. Bias stress before irradiation can lead to enhanced proton-induced degradation of AlGaN/GaN HEMTs. Low-frequency noise measurements and density functional calculations provide insight into defect microstructures and energy levels. GaN-based HEMTs can be quite vulnerable to single-event effects in space. Of particular concern is single-event burnout (SEB). The vulnerabilities of GaN-based devices to SEB at voltages below rated limits and significant device-to-device variations in SEB response lead to significant voltage derating for GaN-based power devices in space systems. Developing an improved understanding of the effects of defects and hydrogen on the radiation response of AlGaN/GaN HEMTs can improve the DD/TID response by reducing threshold-voltage shifts and transconductance degradation. Reducing defect densities may also reduce the variation in SEB response, enabling reliable device operation at higher voltages in future space systems. [ABSTRACT FROM AUTHOR]

The total-ionizing-dose response of third-generation SiGe HBTs was investigated at elevated temperatures (80 °C and 130 °C) and compared with the response at 30 °C. The devices show less damage to irradiation at higher temperatures. Annealing experiments and TCAD simulations are used to investigate the degradation mechanism. The reduced degradation in forward mode at elevated temperatures is caused by increased annealing of interface traps primarily due to diffusion and reactions of H2 within the oxide/nitride EB spacer. The degradation is modest at all measured temperatures, allowing these devices to be suitable for radiation-rich environments where elevated temperatures are expected. [ABSTRACT FROM AUTHOR]

Integrated silicon microwave pin diodes are exposed to 10-keV X-rays up to a dose of 2 Mrad(SiO2) and 14-MeV fast neutrons up to a fluence of $2.2\,\,\boldsymbol {\times }\,\,10\,\,^{\mathrm{ 13}}$ cm−2. Changes in both dc leakage current and small-signal circuit components are examined. Degradation in performance due to total-ionizing dose (TID) is shown to be suppressed by non-quasi-static (NQS) effects during radio frequency (RF) operation. Tolerance to displacement damage from fast neutrons is also observed, which is explained using technology computer-aided design (TCAD) simulations. Overall, the characterized pin diodes are tolerant to cumulative radiation at levels consistent with space applications such as geosynchronous weather satellites. [ABSTRACT FROM AUTHOR]

Effects of ~35 years of aging during storage are investigated on the radiation response and 1/ $f$ noise of Oki nMOS and pMOS transistors with high oxygen vacancy densities in SiO2. Short-term interface-trap buildup during irradiation is enhanced significantly, relative to that observed in 1989, 1997, and 2008. In contrast, a similar latent interface-trap buildup is observed for aged pMOS devices irradiated and annealed at room and elevated temperatures at positive bias in this and earlier studies. The significant latent interface-trap buildup is observed for nMOS devices irradiated at 0 V and annealed at room and elevated temperatures under positive bias, a condition not evaluated in prior work. Results strongly suggest that latent interface-trap buildup is due to H2 diffusion and dissociation at charged or dipolar O vacancies in SiO2, followed by proton transport to the Si/SiO2 interface and reactions with Si–H complexes. Models that attribute latent interface-trap buildup to long-term proton trapping at O vacancies in SiO2 appear to be ruled out by these results. Additional insight is provided into mechanisms of postirradiation interface- and border-trap buildup after long-term MOS device storage. [ABSTRACT FROM AUTHOR]

Total ionizing dose (TID) effects at the 7-nm bulk FinFET node are characterized through changes in ring oscillator (RO) frequencies and current as a function of $V_{\mathrm {DD}}$ to model delay and power degradations in digital circuits. At the 7-nm node, tests show that gate delay decreased, and power consumption increased as TID increased. Percent increase in parameter degradations shows an inverse relationship with supply voltage, while percent increase in power consumption shows a direct relationship with supply voltage. Annealing at room temperature did not affect degradations. Circuit-level degradations for the 7-nm technology were less than 1% after TID exposure of 380 krad(SiO2). These TID exposure results will provide insight to designers about circuit-level parameters of interest concerning the 7-nm technology node. [ABSTRACT FROM AUTHOR]

Total-ionizing-dose (TID) effects and low-frequency noise are evaluated in advanced bulk nMOS and pMOS FinFETs with SiO2/HfO2 gate dielectrics. Otherwise identical devices built with and without through-silicon via (TSV) integration exhibit threshold voltage shifts of less than 25 mV and changes in maximum transconductance of less than 1% up to 2 Mrad(SiO2). TSV integration negligibly impacts threshold shifts and degradation of subthreshold swing and $I_{\mathrm{\scriptscriptstyle ON}}/I_{\mathrm{\scriptscriptstyle OFF}}$ ratios. Similar low-frequency noise magnitudes and frequency dependencies are observed before and after TID irradiation for each device type. Effective densities of the near-interfacial electron traps responsible for the noise in the nMOS devices increase as the surface potential moves toward midgap, while effective densities of the hole traps that cause the noise in the pMOS devices increase as the surface potential moves toward the valence band edge. [ABSTRACT FROM AUTHOR]

Total-ionizing-dose (TID) effects are compared in 1) conventional high-temperature processed planar fully-depleted silicon-on-insulator (FD-SOI) p-channel MOSFETs, 2) 3-D sequentially integrated (3DSI) FD-SOI MOSFETs in the bottom layer with additional thermal budget and process flows due to the creation of the top layer, and 3) 3DSI low-temperature-processed FD-SOI MOSFETs in the top layer. When irradiated under worst case negative bias, 3DSI bottom-isolated transistors show significantly enhanced charge trapping and transconductance degradation than planar devices. The enhanced degradation for bottom-isolated devices is attributed primarily to increased interface- and border-trap formation at the buried oxide (BOX)/Si interface and/or lateral charge nonuniformities in the BOX. The radiation-induced transconductance degradation in top-isolated devices is attributed to the increased resistance of the portion of the channel that underlies the source/drain spacers. [ABSTRACT FROM AUTHOR]

Total-ionizing-dose (TID) effects are investigated for 22-nm fully-depleted silicon-on-insulator (FDSOI) and 14-nm bulk FinFET charge-trap memory transistors. Electron trapping in the gate dielectric establishes the programmed memory state for both silicon on insulator (SOI) and bulk devices. To first order, ionizing radiation does not interact strongly with programing-induced charges in the gate dielectric for either device type. Hole trapping in the buried oxide dominates the TID response of the 22-nm FDSOI devices. The 14-nm bulk devices with two fins and total effective fin widths of 150 nm are minimally affected by TID, but the subthreshold leakage of devices with 40 fins and total effective fin widths of $3~\mu \text{m}$ increases with increasing TID. When devices are programmed or reprogrammed after irradiation, significant increases in subthreshold slope are observed due to the generation of interface traps, border traps, and/or charge lateral nonuniformities. [ABSTRACT FROM AUTHOR]

Pulsed-laser-induced single-event current measurements on two geometries of waveguide-integrated germanium photodiodes were conducted over a range of operating voltages to examine the impact of photodiode geometry on the transient response. Vertical p-i-n photodiodes exhibit transients with a duration that is relatively independent of the operating voltage, while the transient duration in lateral p-i-n photodiodes depends on the operating voltage. Furthermore, the experimental measurements facilitate identification of device dimensions that impact the transient response. These results can be used to identify potential radiation mitigation strategies for photodiodes operating in a radiation environment. Understanding the implications of design choices is critical for designing integrated photonic systems that balance system performance with tolerance for radiation degradation. [ABSTRACT FROM AUTHOR]

The energy distributions of electrons in gate-all-around (GAA) Si MOSFETs are analyzed using full-band 3-D Monte Carlo (MC) simulations. Excellent agreement is obtained with experimental current–voltage characteristics. For these 24-nm gate length devices, the electron distribution features a smeared energy peak with an extended tail. This extension of the tail results primarily from the Coulomb scattering within the channel. A fraction of electrons that enter the drain retains their energy, resulting in an out-of-equilibrium distribution in the drain region. The simulated density and average energy of the hot electrons correlate well with experimentally observed device degradation. We propose that the interaction of high-energy electrons with hydrogen-passivated phosphorus dopant complexes within the drain may provide an additional pathway for interface-trap formation in these devices. [ABSTRACT FROM AUTHOR]

The total-ionizing-dose (TID) response of indium gallium arsenide (InGaAs) MOSFETs with Al2O3 gate dielectrics and several channel lengths is evaluated under different biases. DC static characteristics show large negative threshold voltage Vth shifts and subthreshold stretchout (SS), indicating net positive charge trapping in the gate oxide and generation of the interface and border traps. Hysteresis and Id – Vgs measurements from cryogenic to high temperatures show the important role of defects in the Al2O3 gate dielectric to the TID response. Radiation-induced-hole trapping is attributed to oxygen vacancies in the Al2O3. The relatively large hysteresis in these devices is attributed primarily to dangling Al bonds in the near-interfacial Al2O3. Analysis of the temperature dependence of Vth and SS suggests that the rate at which electrons leave the Al2O3 during a positive-to-negative gate-bias sweep is higher than the rate at which they enter during a negative-to-positive gate-bias sweep. [ABSTRACT FROM AUTHOR]

We evaluate the total ionizing dose (TID) responses of InGaAs nMOS FinFETs with different gate lengths irradiated with 10-keV X-rays under different gate biases. The largest degradation after irradiation occurs at $V_{\mathrm {G}} = -1$ V. Radiation-induced trapped positive charge dominates the TID response of InGaAs FinFET transistors, consistent with previous results for InGaAs multifin capacitors. Shorter gate-length devices show larger radiation-induced charge trapping than longer gate-length devices, most likely due to the electrostatic effects of trapped charge in the surrounding SiO2 isolation and SiO2/Si3N4 spacer oxides. The 1/ $f$ noise measurements indicate a high trap density and a nonuniform defect-energy distribution, consistent with a strong variation of effective border-trap density with surface potential. [ABSTRACT FROM AUTHOR]

Significant threshold voltage $V_{\mathrm {th}}$ shifts are observed during 10-keV X-ray irradiation of AlGaN/GaN high-electron mobility transistors (HEMTs). Shifts are much smaller for lower dose-rate Cs-137 irradiation than that for higher dose-rate X-ray irradiation. This occurs because hydrogen transport and interactions with defects and impurities in these crystalline wide bandgap semiconductor materials differ fundamentally from those in amorphous SiO2. The electric field is also higher in GaN-based HEMTs than in bipolar base oxides. The absence of enhanced low-dose-rate sensitivity in these devices simplifies testing of GaN-based HEMTs for space applications. No significant X-ray-induced $V_{\mathrm {th}}$ shifts are observed in development stage InAlN/GaN HEMTs. [ABSTRACT FROM AUTHOR]

Silicon waveguide (WG) integrated p-i-n germanium photodiodes (PDs) from a monolithic electronic–photonic integrated circuit technology were exposed to ionizing radiation from a 10-keV X-ray source to investigate total ionizing dose effects. Existing work on radiation effects in PDs, which is almost entirely based on normal-incidence PDs (rather than WG-integrated PDs), is reviewed to provide context and a framework for understanding the measurement results. Back-end-of-line considerations suggest the enhancement of the ionizing dose due to high- $Z$ materials near the PD. PD performance was characterized in terms of dark current, S-parameters, dc photocurrent response, and optical-to-electrical conversion frequency response, shortly before and after irradiation. No significant degradation was observed, indicating that these devices may be suitable for applications in harsh radiation environments. [ABSTRACT FROM AUTHOR]

Tunneling-dominated charge transport is demonstrated in vertically stacked MoS2/interlayer/MoS2 heterostructures with Al2O3, hexagonal boron nitride (h-BN), and HfO2 dielectrics. All devices are highly resistant to 10-keV X-ray irradiation. Only small transient changes in X-ray-induced photocurrent are observed as a result of trap creation in the thin interlayer dielectric, with rapid passivation. Samples with Al2O3 and h-BN interlayer dielectrics show significant increases in conduction current during proton irradiation, due to displacement-damage-induced defects that lower the effective tunnel-barrier height. Density-functional-theory calculations provide insights into the pertinent defects. Devices with HfO2 interlayer dielectrics show great promise for use in radiation tolerant, ultimately scaled tunnel FETs. [ABSTRACT FROM AUTHOR]

Nb2O5-based metal–insulator–metal (MIM) diodes are ideal for neuromorphic computing applications because they exhibit desirable rectification, hysteresis, and capacitance characteristics without electroforming. We employ capacitance-frequency measurements to evaluate the total-ionizing-dose res- ponse of these devices to avoid measurement-induced disturbance of trap distributions caused by typical gate-voltage sweeping methods. Power-law dependences are observed for the low-frequency capacitance and conductance, consistent with hopping conduction of carriers through the oxides. Despite their high oxygen-vacancy densities, the Nb2O5-based MIM diodes are radiation tolerant up to at least Mrad(SiO2) doses. [ABSTRACT FROM PUBLISHER]

The single-event-transient response of InGaAs FinFETs with different fin widths is examined using pulsed-laser and heavy-ion irradiation. Devices with wider fins collect more charge in both environments. Quantum-well structures confine charge collection in the channel, and determine the sensitive volume. Simulations show that the charge density produced by irradiation is similar for devices with different fin widths, but more charge is collected by wider fin devices due to the larger channel volume. Charge accumulated in the buffer and substrate layers modulates the body potential, altering the degree of back-gate control, leading to additional effects associated with charge accumulation in wider fin devices. Optical simulations for a model system suggest that optical phenomena in the fins should be considered for laser testing. These include optical interference, plasmonic enhancement at the metal–dielectric interfaces, and enhanced electron–hole pair recombination due to multiple reflections in multigate devices with nanoscale dimensions. [ABSTRACT FROM PUBLISHER]

We have evaluated the total-ionizing-dose response of graphene-based X-ray detectors fabricated from graphene oxide (GO) via laser scribing. Raman characterization shows that the resulting structures exhibit the desired conversion of GO to graphene; both high- and low-resistance detectors are formed. The detectors are quite radiation sensitive, as demonstrated by fast pulse testing. The response time of the detectors degrades with total-ionizing dose exposure as a result of electron trapping at residual oxygen from unreacted GO and/or adsorbed oxygen on the graphene surface. [ABSTRACT FROM PUBLISHER]

The degradation induced by ultrahigh total ionizing dose in 65-nm MOS transistors is strongly gate-length dependent. The current drive decreases during irradiation, and the threshold voltage often shifts significantly during irradiation and/or high-temperature annealing, depending on transistor polarity, applied field, and irradiation/annealing temperature. Ionization in the spacer oxide and overlying silicon nitride layers above the lightly doped drain extensions leads to charge buildup as well as the ionization and/or release of hydrogen. Charge trapped in the spacer oxide or at its interface modifies the parasitic series resistance, reducing the drive current. The released hydrogen transports as H+ with an activation energy of ~0.92 eV. If the direction of the electric field is suitable, the H+ can reach the gate oxide interface and depassivate Si-H bonds, leading to threshold voltage shifts. Newly created interface traps are most prominent near the source or drain. The resulting transistor responses and defect-energy distributions often vary strongly in space and energy as a result, as demonstrated through current–voltage, charge-pumping, and low-frequency noise measurements. [ABSTRACT FROM PUBLISHER]

Total-ionizing-dose-induced resonance frequency shifts in piezoresistive micromachined cantilevers are experimentally shown to be dose-rate dependent. Devices were irradiated to 1 Mrad(SiO2) at rates from 5.4 to 30.3 krad(SiO2)/min, with lower rate exposures producing up to four-times more negative frequency shifts than higher rate exposures. Devices that were hydrogenated in a steam bath for 1 h showed shifts similar to those of control (not hydrogenated) devices at higher dose rates, and larger shifts than control devices at lower rates. All devices recovered to levels close to preirradiation after several hours of post-irradiation annealing. The dose-rate dependence is attributed to differences in carrier concentration caused by varying efficiencies of the depassivation of boron by hydrogen at higher and lower dose rates and/or surface charging effects, and the subsequent differences in Young’s modulus that occur as a result. Many of these processes are similar to effects that lead to ELDRS in linear bipolar transistors, emphasizing the need to include low-dose-rate testing of microelectromechanical systems devices when considering them for use in space systems. [ABSTRACT FROM PUBLISHER]

The response of silicon-based microelectromechanical systems resonators to proton irradiation is determined by the combined effects of displacement damage and total ionizing dose (TID). Displacement damage (DD) can lead to carrier removal, which tends to decrease the carrier concentration, and TID leads to dopant activation and/or surface charging effects, which tend to increase the carrier concentration. These competing effects lead to changes in carrier concentration that alter Young’s modulus, and consequently the resonance frequency. For higher flux 2-MeV proton irradiation to 1014/cm2, TID effects dominate at low fluence, leading to a decrease in resonance frequency, which is offset by displacement damage effects at higher fluence. Fast recovery is observed as TID effects anneal out and DD effects remain. For lower-flux 0.8-MeV proton irradiation to 7 \times 10^12 /cm2, DD effects are relatively more significant than for 2-MeV proton irradiation, and an increase in resonance frequency is observed at all fluences. Stopping and range of ions in matter calculations reinforce these conclusions. [ABSTRACT FROM PUBLISHER]

We have characterized the total ionizing dose response of strained Ge p MOS FinFETs built on bulk Si using a fin replacement process. Devices irradiated to 1.0 Mrad(SiO2) show minimal transconductance degradation (less than 5%), very small \text {V}_{th} shifts (less than 40 mV in magnitude) and very little ON/OFF current ratio degradation (<5%), and only modest variation in radiation response with transistor geometry (typically less than normal part-to-part variation). Both before and after irradiation, the performance of these strained Ge p$ MOS FinFETs is far superior to that of past generations of planar Ge $p$ MOS devices. These improved properties result from significant improvements in processing technology, as well as the enhanced gate control provided by the strained Ge FinFET technology. [ABSTRACT FROM PUBLISHER]

Total-ionizing-dose (TID) effects on piezoelectric micromachined ultrasonic transducers (pMUTs) are investigated using 10-keV X-rays under different bias conditions. The corresponding changes in resonant frequency and quality factor are evaluated using impedance analysis methods. Radiation-generated electrons or holes are trapped in the pre-existing defects of piezoelectric materials. Therefore, the sensitivity of pMUTs to X-ray irradiation depends strongly on the device bias during irradiation. The trapped charges change stress and strain in the materials due to the inverse piezoelectric effect, resulting in resonant frequency shifts and quality factor variation. [ABSTRACT FROM PUBLISHER]

Responses to 1.8 MeV proton irradiation and 10-keV X-ray irradiation under typical bias conditions are investigated for AlGaN/GaN HEMTs fabricated with different types of process technologies. We find that, in contrast to previous generations of process technologies, total ionizing dose effects can be significant in these devices. For proton irradiation, worst-case bias for transconductance degradation for GaN-on-SiC substrate devices is ON bias, and for devices built on free-standing GaN substrates, the worst-case bias condition is semi-ON bias. Low-frequency noise measurements demonstrate that these differences result from differences in defect types and energy distributions for the different types of devices, both before and after irradiation. These results emphasize the need to test devices under a wide range of conditions during characterization and qualification testing. [ABSTRACT FROM PUBLISHER]

The effects of total-ionizing-dose irradiation are investigated in HfO2/InGaAs quantum-well MOSFETs. Radiation-induced hole trapping is higher for irradiation under positive gate bias than under negative gate bias. Electrical stress-induced electron trapping compensates radiation-induced hole trapping during positive gate-bias irradiation. Stress-induced hole trapping adds to the effects of radiation-induced hole trapping under negative gate bias. Radiation-induced charge trapping increases with the channel length. [ABSTRACT FROM PUBLISHER]

We find that the low-frequency 1/ f noise of AlGaN/GaN HEMTs before and after 1.8-MeV proton irradiation is more consistent with a carrier-number fluctuation model that includes a non-constant defect-energy distribution {D}_{t} ( {E}_{f} ) than with the Hooge mobility fluctuation model. A strongly varying Dt ( {E}f ) in these devices is confirmed by measurements of the voltage and temperature dependence of the noise. First-order estimates of effective border-trap density before and after 1.8-MeV proton irradiation are obtained for commercial and research-grade devices using a simple number-fluctuation model. The input-referred noise magnitude of GaN/AlGaN HEMTs decreases at biases that are much more positive than threshold because the gated region of the HEMT comprises a relatively small portion of the channel, and the noise is attenuated by the voltage divider formed by the gated and ungated regions of the channel. [ABSTRACT FROM PUBLISHER]

We evaluate the response of T-shaped, asymmetric, piezoresistive, micromachined cantilevers fabricated on p-type Si to 10-keV X-ray irradiation. The resonant frequency decreases by 25 ppm at 2.1 Mrad(SiO2), and partially recovers during post-irradiation annealing. An explanation of the results is proposed that is based on radiation-induced acceptor depassivation. This occurs because radiation-generated holes release hydrogen from previously passivated acceptors, causing the carrier concentration to increase, especially near the surface. Increased carrier concentration decreases Young’s modulus, resulting in a decrease in the cantilever resonant frequency. Finite element simulations show that the effect of a decreasing Young’s modulus in the surface region is consistent with the measured decrease in resonant frequency in the irradiated devices. [ABSTRACT FROM PUBLISHER]

Total ionizing dose (TID) effects in ultra-thin body Ge on Insulator (GOI) junctionless CMOSFETs with recessed source/drain and channel have been studied. 10-keV X-ray irradiation leads to net hole trapping at the top and bottom Ge/dielectric interfaces of both GOI NFETs and PFETs. The Ge channel thickness and post-oxidation processing can strongly affect the radiation response. Application of negative back-gate bias can moderate the radiation-induced threshold-voltage shifts. [ABSTRACT FROM PUBLISHER]

Commercial enhancement mode GaN HEMTs are irradiated with low energy protons under different bias conditions. Negative threshold voltage ( Vth ) shifts are observed. In contrast, Vth shifts are positive under high voltage stress without proton irradiation. $C$ - V$ measurements with floating terminals are performed before and after irradiation. Both I$ - V$ and C$ - degradation. The floating terminal C-V measurements that are introduced in this study appear to be quite sensitive to traps in the AlGaN buffer layer, making this a potentially useful technique for future device characterization. [ABSTRACT FROM PUBLISHER]

Total ionizing dose (TID) effects are evaluated for a high-voltage (>30 V) complementary SiGe on SOI technology. Devices are irradiated with 10-keV X-rays at doses up to 5 Mrad(SiO2). The results depend strongly on collector-to-emitter bias, in both forward- and inverse-mode. An anomalous reduction in current gain at high injection in forward-mode operation is observed at doses >500 krad(SiO2). Calibrated 2-D TCAD simulations suggest that this high injection phenomenon is primarily due to interface traps near the STI/Si interface, which is exhibited as a collector resistance increase in the forward Gummel characteristics. Additionally, a strong collector doping dependence is observed, which indicates that this is primarily driven by the thick and lightly doped collector used in this technology. These results illustrate, that high concentrations of interface traps at the STI can have a strong impact on the forward-mode TID response of SiGe HBTs. [ABSTRACT FROM PUBLISHER]

The total ionizing dose response of Ge channel pFETs with raised Si0.55Ge0.45 source/drain is investigated under different radiation bias conditions. Threshold-voltage shifts and transconductance degradation are noticeable only for negative-bias (on state) irradiation, and are mainly due to negative bias-temperature instability (NBTI). Nonmonotonic leakage changes during irradiation are observed, which are attributed to the competition of radiation-induced field transistor leakage and S/D junction leakage. [ABSTRACT FROM PUBLISHER]

The sensitivity of GaN/AlGaN HEMTs to 1.8 MeV proton irradiation is greatly enhanced by biasing the devices during irradiation and/or applying high field stress before irradiation. The resulting defect energy distributions are evaluated after irradiation and/or high field stress via low-frequency noise measurements. Significant increases are observed in acceptor densities for defects with \sim 0.2 and \sim 0.7 eV energy levels. These defects appear to dominate the degradation in threshold voltage and transconductance for these devices. Density functional theory (DFT) calculations show that N vacancy-related defects in GaN and hydrogenated ON complexes in AlGaN are strong candidates for the defects with \sim 0.2 eV energy levels in these devices. We also present evidence that the previously unidentified \sim 0.7 eV defect in GaN is a N anti-site defect (NGa). [ABSTRACT FROM PUBLISHER]

The effects of proton-induced displacement damage in GaN HEMTs on circuit-level RF power amplifier parameters such as circuit gain, stability, and RF output power are presented. The results are explained based on the device-level degradation. Commercial-off-the-shelf GaN HEMTs from two manufacturers were compared. Differences are observed in both device and circuit level responses. Suggestions to mitigate the negative effects of displacement damage on GaN based amplifiers are also provided. [ABSTRACT FROM PUBLISHER]

AlGaN/GaN high electron mobility transistors (HEMTs) irradiated with 1.8-MeV protons show more relative degradation in RF power/current gain, cutoff frequency f_T, and maximum oscillation frequency fmax than DC transconductance. These result from radiation-induced increases in fast bulk and surface trap densities, as well as increasing impedance mismatch at high frequencies with increasing proton fluence. NH3-rich MBE devices show less degradation in DC transconductance, but more degradation in RF gain than Ga-rich devices. [ABSTRACT FROM PUBLISHER]

Single and multiple-event upsets in \ HfO_2/\ Hf one transistor, one resistor (1T1R) resistive random access memory (RRAM) structures are modeled dynamically using 3-D technology computer-aided design (TCAD) simulations. A dynamic single-event compact model is presented that allows direct correlation of the ion-generated voltage transient across the RRAM and the change in RRAM resistance. Experiments and modeling demonstrate an exponential relationship between the susceptibility of the RRAM and the applied voltage. Two implementations of the model are also presented including hardening voltage-susceptible resistive memory technologies and the impact of highly scaled access transistors. [ABSTRACT FROM PUBLISHER]

Electrical stress and 10-keV x-ray irradiation and annealing responses are evaluated for back-gate MoS2 transistors. Relative stability of device characteristics is observed for constant-voltage stress. The drain current decreases significantly after both positive and negative bias irradiation. Density functional theory calculations and ozone exposure experiments suggest that O atoms adsorbed on the MoS2 surface during 10-keV x-ray irradiation function as electron traps, causing mobility degradation and voltage shifts. [ABSTRACT FROM PUBLISHER]

Tunnel-Diode Body-Contact (TDBC) SOI MOSFETs utilize a shallow source and a deep drain to eliminate total-ionizing-dose induced back-channel leakage and to suppress floating body effects. In contrast, significant leakage current is observed in T-gate Body-Contact (TB) SOI nMOSFETs, as a result of trapped charge in the buried oxide. A subthreshold hump is observed in TDBC SOI nMOSFETs after irradiation. The charge trapped at the shallow trench isolation (STI) corner is the major reason for the post-irradiation hump in the current-voltage characteristics. Pocket p^ + implantation reduces the size of the subthreshold hump in short-channel TDBC devices. [ABSTRACT FROM PUBLISHER]

The total ionizing dose (TID) response of double-gate SiGe-SiO_2/HfO_2 \ pMOS FinFET devices is investigated under different device bias conditions. Negative bias irradiation leads to the worst-case degradation due to increased hole trapping in the HfO_2 layer, in contrast to what is typically observed for devices with SiO_2 or HfO_2 gate dielectrics. This occurs in the devices because radiation-induced holes that are generated in the SiO_2 interfacial layer can transport and become trapped in the HfO_2 under negative bias, leading to a more negative threshold voltage shift than observed at 0 V bias. Similarly, radiation-induced electrons that are generated in the SiO_2 interfacial layer can transport into the HfO_2 and become trapped under positive bias, leading to a more positive threshold voltage shift than observed at 0 V bias. [ABSTRACT FROM PUBLISHER]

RRAM memory cells demonstrate resilience to ionizing dose and displacement damage, despite the presence of a nonhardened access transistor. Degradation in RRAM performance was not observed until large displacement damage doses and complete functionality was regained by cycling. A significant reduction in both the high and low resistance memory states and a complete collapse of the resistive window was observed for large proton fluences in RRAMs tested. Degradation in resistance states is associated with the generation of additional vacancies, which leads to (an) additional filament(s) in parallel to the existing conductive filament. Additional vacancies from displacement damage in the oxide of the resistive element do not permanently degrade device operation. The low resistance state is recovered to the pre-irradiation resistance through cycling at nominal high-speed switching conditions. Recovery of the resistive window to pre-irradiation values is obtained by applying longer write pulses which migrate remnants of radiation-induced filaments. [ABSTRACT FROM PUBLISHER]

This paper presents an investigation of the impact of single-event transients (SETs) and total ionization dose (TID) on precision voltage reference circuits designed in a fourth-generation, 90-nm SiGe BiCMOS technology. A first-order uncompensated bandgap reference (BGR) circuit is used to benchmark the SET and TID responses of these voltage reference circuits (VRCs). Based on the first-order BGR radiation response, new circuit-level radiation-hardening-by-design (RHBD) techniques are proposed. An RHBD technique using inverse-mode (IM) transistors is demonstrated in a BGR circuit. In addition, a PIN diode VRC is presented as a potential SET and TID tolerant, circuit-level RHBD alternative. [ABSTRACT FROM PUBLISHER]

The total-dose radiation tolerance of 32-nm nFETs is investigated. nFETs built in 32-nm RF-CMOS-on-SOI technology with high-k dielectrics show increased off-state leakage current and electron trapping in the gate oxide. The impact of CMOS-on-SOI technology scaling (from 65-nm to 32-nm) on the total-dose radiation tolerance and hot-carrier reliability (HCR) is investigated through both experiments and supporting TCAD simulations. The 32-nm nFETs exhibit less total-dose degradation compared to 45-nm nFETs. However, the hot-carrier degradation increases as the technology scales. An interplay of electric-field in the gate oxide and impact ionization in the channel region is responsible for the observed differences in the degradation mechanisms for the three technologies. [ABSTRACT FROM AUTHOR]

The effects of X-ray and proton radiation on a LiNbO_2 analog memristor are investigated by I-V hysteresis, Electrochemical Impedance Spectroscopy, low-frequency AC voltage, and X-ray diffraction analysis. Both electrical and structural characterization of an irradiated memristor show that irradiation leads to an increased level of defects in the LiNbO_2 crystalline lattice. These radiation-induced defects facilitate faster lithium movement as shown by electrochemical impedance spectroscopy measurements on the as-grown and irradiated memristor. X-ray radiation improves ionic motion in the bulk of the device and increases the ionic resistance at the LiNbO_2-metal interface. In the case of proton radiation, the memristance response improves due to an increase in ionic motion in the bulk and at the interfaces. It is also shown by Monte Carlo simulations that proton irradiation of LiNbO_2 results in structural damage, which was verified experimentally by an X-ray diffraction study. [ABSTRACT FROM PUBLISHER]

The responses to 1.8 MeV proton irradiation of AlGaN/GaN HEMTs grown under Ga-rich and ammonia-rich conditions are investigated in this work. Changes in defect energy distributions of AlGaN/GaN HEMTs during proton irradiation are characterized via temperature-dependent low-frequency noise measurements. Density functional theory calculations show these changes are consistent with the reconfiguration and/or dehydrogenation of oxygen-related defects in Ga-rich devices. [ABSTRACT FROM PUBLISHER]

Enhanced rates of oxide growth have been observed on silicon upon exposure to 10-keV X-ray irradiation. Oxide thicknesses were determined using spectroscopic ellipsometry on irradiated and control samples, and confirmed via X-ray photoelectron spectroscopy. The oxidation rate varied with the radiation total dose and dose rate. The increased oxidation rate is attributed to the generation of ozone, which decomposes into molecular oxygen and highly reactive atomic oxygen at the surface of the Si wafer. The generation of ozone by 10-keV X-rays was found to increase linearly with increasing dose rate. UV irradiation led to similarly enhanced oxidation rates. The potential application of this phenomenon to dosimetry is explored. [ABSTRACT FROM AUTHOR]

Irradiated Ge pMOSFETs have been characterized via charge pumping (ICP) and 1/f noise. The noise increases much more with irradiation than does ICP for devices with eight Si monolayers at the interface, while devices with five Si monolayers and lower halo implantation dose exhibit comparable increases in noise and ICP with irradiation. These results suggest that border traps in the HfO2 affect the noise more than interface traps, and that devices with eight Si monolayers have a higher border-trap density than devices with five Si monolayers. Noise measurements as a function of gate voltage show that the border trap density increases significantly toward the Ge valence band edge, while three-level charge pumping reveals an interface trap density that increases slightly toward midgap. [ABSTRACT FROM AUTHOR]

We have evaluated the responses of graphene materials and devices to 10-keV X-ray irradiation and ozone exposure. Large positive shifts are observed in the current-voltage characteristics of graphene-on-\SiO2 transistors irradiated under negative gate bias. Moreover, significant radiation-induced increases are found in the resistance of suspended graphene layers; the charge neutral point (CNP) of the graphene layer also shifts positively with increasing total dose. Raman spectroscopy shows that similar defects are generated in graphene-on-\SiO2 sheets by 10-keV X-ray irradiation and ozone exposure. First principles calculations of the relevant binding energies, and reaction and diffusion barriers for oxygen on graphene, strongly suggest that oxygen adsorption and reactions, along with the resulting p-type doping, can lead to the observed degradation of irradiated or ozone-exposed graphene materials and devices. [ABSTRACT FROM PUBLISHER]

The irradiation and annealing responses of 4H-SiC MOS devices with nitrided oxides are investigated at varying biases. Radiation-induced hole trapping dominates the radiation response of these devices. Switching the bias between irradiation and annealing can lead to significant enhancement of the degradation in some cases. Positive irradiation bias followed by negative annealing bias is found to be the worst-case for the combined degradation. After irradiation, significant reversibility of charge trapping is observed in switched-bias annealing of n-substrate capacitors, while enhanced charge trapping is found in p-substrate capacitors. These results show the potential importance of evaluating the combined radiation and reliability responses of SiC MOS devices for long-term use in high total-ionizing-dose space applications. [ABSTRACT FROM PUBLISHER]