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This paper introduces a 6.5-kV 1-kA SiC PiN diode module for megawatt-range medium voltage converters. The analysis comprises a short description of the die and module technology and a device characterization. The effects of di/dt and temperature variation, as well as parasitic oscillations are discussed. A comparison of the results with a commercial Si diode (6.5 kV and 1.2 kA) is included. In the last section, an estimation of maximum converter output power, maximum switching frequency, losses and efficiency in a 3L-NPC converter operating with SiC and Si diodes is presented. The analyzed diode module exhibits a very good performance regarding switching loss reduction, which allows an increase of at least 16% in the output power of a 6-MVA converter. Alternatively, the switching frequency can be increased by 46%. [ABSTRACT FROM AUTHOR]

Recently developed insulated-gate bipolar transistor (IGBT) press-pack (PP) devices with a blocking voltage of 4.5 kV are being used in medium-voltage converters as an alternative to integrated gate-commutated thyristors (IGCTs). This paper presents an overview of PP packaging and both semiconductor technologies. A quantitative comparison of these devices is achieved through measurements for a 4.5-kV 1.2-kA IGBT and a 4.5-kV 4-kA IGCT. The laboratory test bench for the switching transient characterization at a dc-link voltage of 2.5 kV and currents up to 3 kA is described. Conduction, blocking, and switching behavior for junction temperatures up to 125 ^\circ\C are investigated. The IGCT and the IGBT are tested using a di/dt-limiting clamp circuit. In addition, the IGBT is tested in hard switching mode. [ABSTRACT FROM PUBLISHER]