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Printed electronics (PE) is an emerging technology that provides attractive and complementary features compared to traditional wafer-scale silicon fabrication, such as flexible substrate and point-of-use ultralow-cost manufacturing. The low-cost manufacturing and larger feature sizes mandate reduced complexity in circuit size and also limited and transparent printing layers. This enables optical inspection for manufacturing defect detection, eliminating the need for electrical testing for gross defect detection. Therefore, the traditional problem of controllability and observability in logic testing can completely be alleviated. In this article, we present a learning-based method for optical inspection to detect defective transistors in transparent PE. The method leverages domain-specific as well as common inspection features extracted from optical images to detect defective transistors using supervised learning algorithms trained with real fabricated transistor images. The results show that the proposed method detects 95% of the defective transistors, which can significantly reduce the cost of the overall test flow. [ABSTRACT FROM AUTHOR]

Low-frequency noise is a critical characteristic of transistors, but there are only a few experimental works on the noise in printed electronics. In this work, we characterize the low-frequency noise of inkjet-printed electrolyte-gated thin-film transistors (EGTs) with indium-oxide semiconductors. We confirm that the carrier number fluctuation with correlated mobility fluctuation is the dominating noise generation mechanism. Also, we present the benchmark analysis on the noise level of various thin-film technologies. Notably, the extracted value of trap density near the insulator-channel interface is high, indicating an inferior quality of solution-processed and inkjet-printed thin-films. However, because of electrolyte-gating, the large areal gate capacitance compensates the negative effect of the high trap density, effectively reducing the flat-band voltage noise. As a result, the normalized drain current noise is considerably lower than solution-processed transistors and comparable with sputtered inorganic transistors with dielectric gating. This renders the electrolyte-gating approach useful in reducing the noise for printed/solution-based transistors, suitable for low-noise applications. [ABSTRACT FROM AUTHOR]

Unlike nanoscale silicon transistors, printed thin-film transistors usually rely on micrometer size channel lengths. The device dimensions, the morphology of the channel material, and the interface properties strongly influence important device parameters such as the threshold voltage (Vth) and the transconductance parameter (k). In this article, we analyze and model the dependence of critical electrical device properties of printed, electrolyte-gated transistors, based on crystalline indium oxide channel, for various device geometries. It is shown that the threshold voltage scales with the charge density at the electrolyte channel interface and is hence linearly dependent on the channel length (L). Furthermore, nonlinear scaling effects in the transconductance parameter and in the ON-current are studied, which turn out to be dependent on both, channel width and length. Finally, we present a scaling model capturing the width/length dependencies of the studied transistor technology which enables the correct simulation of logic gates. [ABSTRACT FROM AUTHOR]

Rectifiers are vital electronic circuits for signal and power conversion in various smart sensor applications. The ability to process low input voltage levels, for example, from vibrational energy harvesters is a major challenge with existing passive rectifiers in printed electronics, stemming mainly from the built-in potential of the diode’s p-n-junction. To address this problem, in this work, we design, fabricate, and characterize an inkjet-printed full-wave rectifier using diode-connected electrolyte-gated thin-film transistors (EGTs). Using both experimental and simulation approaches, we investigate how the rectifier can benefit from the near-zero threshold voltage of transistors, which can be enabled by proper channel geometry setting in EGT technology. The presented circuit can be operated at 1-V input voltage, featuring a remarkably small voltage loss of 140mV and a cutoff frequency of ~300 Hz. Below the cutoff frequency, more than 2.6-μW dc power is obtained over the load resistances ranging from 5 to 20 k Ω. Furthermore, experiments show that the circuit can work with an input amplitude down to 500mV. This feature makes the presented design highly suitable for a variety of energy-harvesting applications. [ABSTRACT FROM AUTHOR]

Printed electronics (PE) enables disruptive applications in wearables, smart sensors, and healthcare since it provides mechanical flexibility, low cost, and on-demand fabrication. The progress in PE raises trust issues in the supply chain and vulnerability to reverse engineering (RE) attacks. Recently, RE attacks on PE circuits have been successfully performed, pointing out the need for countermeasures against RE, such as camouflaging. In this article, we propose a printed camouflaged logic cell that can be inserted into PE circuits to thwart RE. The proposed cell is based on three components achieved by changing the fabrication process that exploits the additive manufacturing feature of PE. These components are optically look-alike, while their electrical behaviors are different, functioning as a transistor, short, and open. The properties of the proposed cell and standard PE cells are compared in terms of voltage swing, delay, power consumption, and area. Moreover, the proposed camouflaged cell is fabricated and characterized to prove its functionality. Furthermore, numerous camouflaged components are fabricated, and their (in)distinguishability is assessed to validate their optical similarities based on the recent RE attacks on PE. The results show that the proposed cell is a promising candidate to be utilized in camouflaging PE circuits with negligible overhead. [ABSTRACT FROM AUTHOR]

Soft errors induced by high energy particles have been a severe concern in integrated circuits. Especially in advanced nanoscale technology nodes, the phenomenon of multi-node-upset caused by charge sharing is becoming a crucial issue. However, this problem remains a challenge as there are only few mitigation methods. This brief demonstrates a cost-efficient latch named CROUT featuring double-node-upset tolerance. Integrating coupled Schmitt-triggers and four always-on high-threshold transistors, CROUT is highly reliable in the presence of double-node-upset. To further validate this, a test chip was fabricated in the 28nm CMOS process and tested in a heavy-ion radiation environment. The experimental results indicated that the radiation tolerance is about 2x higher than the standard latches. Moreover, compared to other state-of-the-art multi-node-upset tolerant latches, its power-delay-product (PDP) is reduced by ~6x. The results show that our proposed latch is highly reliable and cost-effective for the space application, which further can be made into a standard cell to be integrated into large-scale circuits. [ABSTRACT FROM AUTHOR]

Electrolyte-gated thin-film transistors (EGTs) with indium oxide channel, and expected lifetime of three months, enable low-voltage operation (~1 V) in the field of printed electronics (PEs). The channel width of our printed EGTs is varied between 200 and 1000 μm, whereas a channel length between 10 and 100 μm is used. Due to the lack of uniform performance p-type metal oxide semiconductors, n-type EGTs and passive elements are used to design circuits. For logic gates, transistor–resistor logic has been employed so far, but depletion- and enhancement-mode EGTs in a transistor–transistor logic boost the circuit performance in terms of delay and signal swing. In this article, the threshold voltage of the EGT, which determines the operation mode, is tuned through sizing of the EGTs channel geometry. The feasibility of both transistor operation modes is demonstrated for logic gates and ring oscillators. An inverter operating at a supply voltage of 1 V shows a maximum gain of 9.6 and a propagation delay time of 0.7 ms, which represents an improvement of ~2 × for the gain and oscillation frequency, in comparison with the resistor–transistor logic design. Moreover, the power consumption is reduced by 6 ×. [ABSTRACT FROM AUTHOR]

Runtime variability sources, such as bias temperature instability (BTI) and supply voltage fluctuation affect both timing and functionality of the flip-flops inside a VLSI circuit. In this paper, we propose a method to improve the timing and reliability of the VLSI circuits by optimizing the flip-flops for resiliency against aging and supply voltage fluctuation. In the proposed selective reliability optimization method, we first extend the standard cell libraries by adding optimized versions of the flip-flops designed for better resiliency against severe BTI impact and/or supply voltage fluctuation. Then, we optimize the VLSI circuit by replacing the aging-critical and voltage-drop-critical flip-flops (VC) of the circuit with the reliability-optimized versions to improve the timing and the reliability of the entire circuit in a cost-effective way. The simulation results show that incorporating the optimized flip-flops in a processor can prolong the lifetime of the processor by 36.9% compared to the original design, which translates into better reliability. This is achieved with negligible leakage overhead (less than 0.1% on the processor) and no area overhead which facilitates the integration of the proposed method in the standard VLSI design flow. [ABSTRACT FROM AUTHOR]

Printed electronics (PE) circuits have several advantages over silicon counterparts for the applications where mechanical flexibility, extremely low-cost, large area, and custom fabrication are required. The custom (personalized) fabrication is a key feature of this technology, enabling customization per application, even in small quantities due to low-cost printing compared with lithography. However, the personalized and on-demand fabrication, the non-standard circuit design, and the limited number of printing layers with larger geometries compared with traditional silicon chip manufacturing open doors for new and unique reverse engineering (RE) schemes for this technology. In this paper, we present a robust RE methodology based on supervised machine learning, starting from image acquisition all the way to netlist extraction. The results show that the proposed RE methodology can reverse engineer the PE circuits with very limited manual effort and is robust against non-standard circuit design, customized layouts, and high variations resulting from the inherent properties of PE manufacturing processes. [ABSTRACT FROM AUTHOR]

Advances in printed electronics (PE) enables new applications, particularly in ultra-low-cost domains. However, achieving high-throughput printing processes and manufacturing yield is one of the major challenges in the large-scale integration of PE technology. In this article, we present a programmable printed circuit based on an efficient printed lookup table (pLUT) to address these challenges by combining the advantages of the high-throughput advanced printing and maskless point-of-use final configuration printing. We propose a novel pLUT design which is more efficient in PE realization compared to existing LUT designs. The proposed pLUT design is simulated, fabricated, and programmed as different logic functions with inkjet printed conductive ink to prove that it can realize digital circuit functionality with the use of programmability features. The measurements show that the fabricated LUT design is operable at 1 V. [ABSTRACT FROM AUTHOR]

Printed electronics (PE) is a fast-growing field with promising applications in wearables, smart sensors, and smart cards, since it provides mechanical flexibility, and low-cost, on-demand, and customizable fabrication. To secure the operation of these applications, true random number generators (TRNGs) are required to generate unpredictable bits for cryptographic functions and padding. However, since the additive fabrication process of the PE circuits results in high intrinsic variations due to the random dispersion of the printed inks on the substrate, constructing a printed TRNG is challenging. In this article, we exploit the additive customizable fabrication feature of inkjet printing to design a TRNG based on electrolyte-gated field-effect transistors (EGFETs). We also propose a printed resistor tuning flow for the TRNG circuit to mitigate the overall process variation of the TRNG so that the generated bits are mostly based on the random noise in the circuit, providing a true random behavior. The simulation results show that the overall process variation of the TRNGs is mitigated by 110 times, and the generated bitstream of the tuned TRNGs passes the National Institute of Standards and Technology – Statistical Test Suite. For the proof of concept, the proposed TRNG circuit was fabricated and tuned. The characterization results of the tuned TRNGs prove that the TRNGs generate random bitstreams at the supply voltage of down to 0.5 V. Hence, the proposed TRNG design is suitable to secure low-power applications in this domain. [ABSTRACT FROM AUTHOR]

Printed electronics can benefit from the deployment of electrolytes as gate insulators, which enables a high gate capacitance per unit area (1– 10 μF cm−2) due to the formation of electrical double layers (EDLs). Consequently, electrolyte-gated field-effect transistors (EGFETs) attain high-charge carrier densities already in the subvoltage regime, allowing for low-voltage operation of circuits and systems. This article presents a systematic study of lumped terminal capacitances of printed electrolyte-gated transistors under various dc bias conditions. We perform voltage-dependent impedance measurements and separate extrinsic components from the lumped terminal capacitance. The proposed Meyer-like capacitance model, which also accounts for the nonquasi-static (NQS) effect, agrees well with experimental data. Finally, to verify the model, we implement it in Verilog-A and simulate the transient response of an inverter and a ring oscillator circuit. Simulation results are in good agreement with the measurement data of fabricated devices. [ABSTRACT FROM AUTHOR]

A physical unclonable function (PUF) is a hardware circuit that produces a random sequence based on its manufacturing-induced intrinsic characteristics. In the past decade, silicon-based PUFs have been extensively studied as a security primitive for identification and authentication. The emerging field of printed electronics (PE) enables novel application fields in the scope of the Internet of Things (IoT) and smart sensors. In this paper, we design and evaluate a printed differential circuit PUF (DiffC-PUF). The simulation data are verified by Monte Carlo analysis. Our design is highly scalable while consisting of a low number of printed transistors. Furthermore, we investigate the best operating point by varying the PUF challenge configuration and analyzing the PUF security metrics in order to achieve high robustness. At the best operating point, the results show areliability of 98.37% and a uniqueness of 50.02%, respectively. This analysis also provides useful and comprehensive insights into the design of hybrid or fully printed PUF circuits. In addition, the proposed printed DiffC-PUF core has been fabricated with electrolyte-gated field-effect transistor technology to verify our design in hardware. [ABSTRACT FROM AUTHOR]

Electrolyte-gated, printed field-effect transistors exhibit high charge carrier densities in the channel and thus high on-currents at low operating voltages, allowing for the low-power operation of such devices. This behavior is due to the high area-specific capacitance of the device, in which the electrolyte takes the role of the dielectric layer of classical architectures. In this paper, we investigate intrinsic double-layer capacitances of ink-jet printed electrolyte-gated inorganic field-effect transistors in both in-plane and top-gate architectures by means of voltage-dependent impedance spectroscopy. By comparison with deembedding structures, we separate the intrinsic properties of the double-layer capacitance at the transistor channel from parasitic effects and deduce accurate estimates for the double-layer capacitance based on an equivalent circuit fitting. Based on these results, we have performed simulations of the electrolyte cutoff frequency as a function of electrolyte and gate resistances, showing that the top-gate architecture has the potential to reach the kilohertz regime with proper optimization of materials and printing process. Our findings additionally enable accurate modeling of the frequency-dependent capacitance of electrolyte/ion gel-gated devices as required in the small-signal analysis in the circuit simulation. [ABSTRACT FROM AUTHOR]

Near threshold computing (NTC) has significant role in reducing the energy consumption of modern very large scale integrated circuits designs. However, NTC designs suffer from functional failures and performance loss. Understanding the characteristics of the functional failures and variability effects is of decisive importance in order to mitigate them, and get the utmost NTC benefits. This paper presents a comprehensive cross-layer reliability analysis framework to assess the effect of soft error, aging, and process variation in the operation of near threshold voltage caches. The objective is to quantify the reliability of different SRAM designs, evaluate voltage scaling potential of caches, and to find a reliability-performance optimal cache organization for an NTC microprocessor. In this paper, the soft error rate (SER) and static noise margin (SNM) of 6T and 8T SRAM cells and their dependencies on aging and process variation are investigated by considering device, circuit, and architecture level analysis. Their experimental results show that in NTC, process variation and aging-induced SNM degradation is $2.5{\boldsymbol \times }$ higher than in the super threshold domain while SER is $8{\boldsymbol \times }$ higher. At NTC, the use of 8T instead of 6T SRAM cells can reduce the system-level SNM and SER by 14% and 22%, respectively. Besides, we observe that we can find the right balance between performance and reliability by using an appropriate cache organization at NTC which is different from the super threshold. [ABSTRACT FROM AUTHOR]

Electrolyte-gated field-effect transistor technology is an attractive candidate for printed low-power electronics due to its high field-effect mobility and extremely low-voltage operation. Relying on an additive process, inkjet-printed devices display large process variations due to ink-substrate interactions, sensitivity to environmental conditions, such as temperature and humidity, as well as intrinsic variations of the ink. All of these sources of variations may display themselves in non-Gaussian distributions as suggested by our experiments. In this paper, we therefore propose a generic methodology for variability modeling of printed transistors, based on the Gaussian mixture model, which can be used to model any arbitrary distribution of the transistor model parameters. The proposed methodology was tested on two different data sets and has been used to predict the behavior of a measured printed security circuit as well as transistor dc characteristics. [ABSTRACT FROM AUTHOR]

Printed electronics (PE) is a promising technology that provides mechanical flexibility and low-cost fabrication and the key enabler for emerging applications, such as smart sensors, wearables, and Internet of Things. To use printed batteries or printed energy harvesters in the future, electrolyte-gated field-effect transistors (EGFETs) based on inorganic materials enable printed circuits requiring small supply voltage and low power. Since these applications need secure communication and/or authentication, it is imperative to embed security primitives for cryptographic key and identification purposes into the applications. Physical unclonable functions (PUFs) have been adopted widely to provide secure keys. In this paper, we present the design, simulation, fabrication, and measurements of a PUF based on EGFETs using inorganic inkjet PE. A comprehensive framework, including Monte Carlo simulations calibrated on real device measurements, is developed. Moreover, a multibit PE-PUF design is proposed to optimize area usage. Our simulation results show that the PE-PUF has ideal uniqueness (50.1%) and good reliability (89%). In addition, the proposed multibit PE-PUF reduces the area usage around 30%. The proposed PE-PUF was fabricated and the experimental results confirm that the PE-PUF can operate reliably as low as 0.5 V, and hence, it is a remarkable candidate to be utilized in low-power applications. [ABSTRACT FROM AUTHOR]

Printed electronics is a fast-growing emerging technology, which is expected to play a major role in smart sensors for the Internet of Things domain. While there has been considerable progress at the device level by new materials, on circuit level results are still rare. In this letter, we report on the design, simulation, fabrication, and measurement of an inkjet-printed latch, which is an essential building block for digital circuits. Our technology approach is based on electrolyte-gated transistors, which enables low-voltage operation and yields an outstanding electrical performance due to high mobility of the semiconducting, precursor-made In2O3 channel. The fabricated latch can operate reliably down to 0.6 V, where the power consumption is only 16 \mu \textW . The area requirement is about 7 mm2, and in terms of lifetime, no performance degradation was observed during an experimental period of 12 weeks. [ABSTRACT FROM PUBLISHER]

Bias temperature instability (BTI) is one of the major CMOS reliability issues in nanoscales. The main impact of BTI on SRAM memory cells is the degradation of the static noise margin (SNM), which leads to a higher susceptibility to failures. A variety of techniques for mitigating the impact of BTI on caches have been proposed at architecture level. However, their considerable overheads limit the application of such techniques. Recent studies showed that the utilization of the cache capacity widely varies from one workload to another and even within a workload. When cache utilization is low, for the majority of the cells, the same value is stored for a very long period, which significantly degrades SNM due to BTI. In this paper, we propose a technique to dynamically adjust the cache size according to the running workload cache requirement by monitoring the cache miss rate. The unused cache capacity is power gated to increase the energy efficiency and mitigate aging of the entire cache. The experimental results show that the proposed technique reduces hold and read SNM degradation by up to 48.1% and 33.3%, respectively, at the cost of 2.0% performance penalty. [ABSTRACT FROM PUBLISHER]

Spin-transfer-torque magnetic random access memory (STT-MRAM) is a promising emerging memory technology because of its various advantageous features such as scalability, non-volatility, density, endurance, and soft-error immunity. However, high write energy and long write latency are the major obstacles for this technology. The long write latency of the STT-MRAM is primarily due to two reasons. First, the bit-cell switching is asymmetric, which means that one write direction is significantly slower than the other. Second, the stochastic switching behavior of the bit-cell mandates a significant margin for a target write error rate (WER). In this paper, we propose static and dynamic circuit-level techniques to reduce the overall write latency. The static technique reduces the impact of write asymmetry by increasing the write current only for the slow writes. The dynamic technique additionally targets the write margin by dynamically increasing the write current in a stepwise manner to mitigate the negative impact of the stochastic switching behavior. Experimental results show that our proposed dynamic method can reduce the overall write latency by 71% while maintaining the same WER. Applying this technique to a 512 kB L2-cache of a microprocessor improves its performance by 11% and saves energy by 10% on average. [ABSTRACT FROM PUBLISHER]

Transistor aging, mostly due to bias temperature instability (BTI), is one of the major unreliability sources at nano‐scale technology nodes. BTI causes the circuit delay to increase and eventually leads to a decrease in the circuit lifetime. Typically, standard cells in the library are optimised according to the design time delay; however, because of the asymmetric effect of BTI, the rise and fall delays might become significantly imbalanced over the lifetime. In this study, the BTI effect is mitigated by balancing the rise and fall delays of the standard cells at the excepted lifetime. The authors find an optimal tradeoff between the increase in the library size and the lifetime improvement by non‐uniform extension of the library cells for various ranges of the input signal probabilities. The simulation results reveal that this technique can prolong the circuit lifetime by around 150% with a negligible area overhead. Moreover, the effect of different realistic workloads on the distribution of internal node signal probabilities is investigated. This is done to obtain the sensitivity of the proposed static (design time) approach to different workloads during system lifetime. The results show that the proposed approach is still efficient if the workload changes during the runtime. [ABSTRACT FROM AUTHOR]

Magnetic Random Access Memory (MRAM) is a very promising emerging memory technology because of its various advantages such as nonvolatility, high density and scalability. In particular, Spin Orbit Torque (SOT) MRAM is gaining interest as it comes along with all the benefits of its predecessor Spin Transfer Torque (STT) MRAM, but is supposed to eliminate some of its shortcomings. Especially the split of read and write paths in SOT-MRAM promises faster access times and lower energy consumption compared to STT-MRAM. In this paper, we provide a very detailed analysis of SOT-MRAM at both the circuit- and architecture-level. We present a detailed evaluation of performance and energy related parameters and compare the novel SOT-MRAM with several other memory technologies. Our architecture-level analysis shows that a hybrid-combination of SRAM for the L1-Data-cache, SOT-MRAM for the L1-Instruction-cache and L2-cache can reduce the energy consumption by 60% while the performance increases by 1% compared to an SRAM-only configuration. Moreover, the retention failure probability of SOT-MRAM is 27\boldsymbol \times smaller than the probability of radiation-induced Soft Errors in SRAM, for a 65nm technology node. All of these advantages together make SOT-MRAM a viable choice for microprocessor caches. [ABSTRACT FROM PUBLISHER]

As complementary metal-oxide-semiconductor technologies enter nanometer scales, microprocessors become more vulnerable to transistor aging, mainly due to bias temperature instability and hot carrier injection. These phenomena lead to increasing device delays during the operational lifetime, which result in growing delays of the instruction pipeline stages. However, the aging rates of different stages are different. Hence, a previously delay-balanced pipeline becomes increasingly imbalanced resulting in a non-optimized design in terms of lifetime [i.e., mean time to failure (MTTF)], frequency, area, and power consumption. In this paper, we propose an aging-aware, MTTF-balanced pipeline design, in which the pipeline stage delays are balanced at the desired lifetime rather than at design time. This can lead to significant MTTF (lifetime) improvements as well as additional performance, area, and power benefits. Our experimental results show that for two different microprocessors, MTTF can be extended by at least 2.3 times while achieving an additional 10% energy improvement with no penalty on delay and area. If the demand for performance is higher than that for a longer MTTF, it is also possible to improve the clock frequency by 2%. [ABSTRACT FROM PUBLISHER]

Modern society is striving for digital connectivity that demands information security. As an emerging technology, printed electronics is a key enabler for novel device types with free form factors, customizability, and the potential for large-area fabrication while being seamlessly integrated into our everyday environment. At present, information security is mainly based on software algorithms that use pseudo random numbers. In this regard, hardware-intrinsic security primitives, such as physical unclonable functions, are very promising to provide inherent security features comparable to biometrical data. Device-specific, random intrinsic variations are exploited to generate unique secure identifiers. Here, we introduce a hybrid physical unclonable function, combining silicon and printed electronics technologies, based on metal oxide thin film devices. Our system exploits the inherent randomness of printed materials due to surface roughness, film morphology and the resulting electrical characteristics. The security primitive provides high intrinsic variation, is non-volatile, scalable and exhibits nearly ideal uniqueness. Designing efficient system for digital connectivity preserving information security remains a challenge. Here, the authors present hardware-intrinsic security solutions based on physical unclonable functions incorporating an inkjet-printed core circuit as an intrinsic source of entropy, integrated into a silicon-based CMOS system environment. [ABSTRACT FROM AUTHOR]