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In this paper, the relation between the surface electric field and the temperature distribution dependence on the drift-region doping concentration in a 30-V asymmetric drain-extended MOSFET is studied. For the case of high drift-region concentration, the drain resistance is low, and the current density is high, which induces a high nonuniform temperature distribution in the transistor, which in turn reduces the carrier mobility and causes a negative drain resistance. For the case of low drift-region concentration, a uniform temperature distribution is obtained. However, the different drift-region concentration changes the location of the maximum temperature from the gate-overlapped drift region for the high concentration case to the drain-side contact region for the low concentration case under the high VGS and VDS conditions. Therefore, the self-heating effect is also changed by the redistribution of the electric field in the drift region. [ABSTRACT FROM AUTHOR]

A 60 GHz monolithic low-noise amplifier (LNA) fabricated with 0.15-μm gallium-arsenic pseudomorphic high-electron mobility transistors is presented.Using a three-stage cascaded topology and in-stage transmission lines, the LNA is designed using 5 V power supply voltage. Measured results of the LNA show the peak gain of 13.5 dB and the lowest noise figure of 5.15 dB around 61 GHz, and the 1 dB compression point (P1dB) of the LNA is −10 dBm. The LNA also demonstrates a complete design flow for millimeter-wave applications. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett, 54:329-332, 2012; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.26525 [ABSTRACT FROM AUTHOR]

This paper presents, for the first time, the study of the application of a lateral diffused metal–oxide–semiconductor field-effect transistor (LDMOSFET) in a common-gate configuration to radio-frequency (RF) transmit/receive (T/R) switching circuits. A single-pole double-throw (SPDT) 900-MHz T/R switch is implemented using 0.25-\mu\m LDMOSFET foundry technology. Measured results show that our switching circuit can achieve a low insertion loss of 0.82 dB and a high power handling capability of 27 dBm. This result is promising in integrating power management integrated circuits, RF power amplifiers, and switching circuits in a single chip, based on LDMOSFET technology, to realize an RF transmit front-end system-on-chip solution. [ABSTRACT FROM AUTHOR]