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In light of the importance of selective area doping in GaN to enable planar process technology, and to avoid the complications from the etch/regrowth process, ion implantation is the recognizable alternative. Annealing to activate dopant species and repair the damage to a crystal poses a challenge for GaN since the material will decompose to Ga + N2 at atmospheric pressure and relevant temperatures. In this research, in situ high- and low-temperature epitaxial and ex situ sputtered AlN caps were examined in different stacking arrangements to study the optimum conditions for Mg ion implantation and activation. Concurrently, a matrix of different implantation doses was also investigated to better understand the dose-dependent activation. Each sample has a unique cap stack and four different implant doses, including an unimplanted reference quadrant. The results show that poorer quality cap films enable nitrogen to leave the crystal during annealing and leave nitrogen vacancies behind. Furthermore, a high dose is needed at the surface to facilitate ohmic contact formation. The results suggest that in situ epitaxial-grown AlN caps are more suitable for GaN activation annealing, and high-temperature thin caps provide the best barrier to prevent crystal disintegration. We reveal a timely strategy for preserving the quality of GaN crystal structure during the electrical activation of the ion-implanted Mg atoms. This work provides valuable information that bridges the gap between device processing and electrical characterization of GaN devices, presenting a clear path towards achieving an electrical activation of implanted Mg while maintaining the integrity of the crystalline structure of GaN.

Present GaN technology consists primarily of heteroepitaxial, lateral high electron mobility transistors; however, high-power devices would be much more efficiently manufactured with a vertical geometry due to better blocking voltage scaling. This technology has yet to be realized due to the inconsistency of GaN wafer properties. These inconsistencies can be detected with several long-range, non-destructive techniques including Raman spectroscopy, optical profilometry, and photoluminescence mapping. In particular, Raman spectroscopy is an effective tool for determining the carrier concentration of GaN substrates and whether the wafers are uniform or inhomogeneous. In this work, vertical p-i-n GaN diodes are fabricated using both uniform and inhomogeneous wafers determined by using the A1 Raman peak position to monitor carrier concentration. The inhomogeneous samples have regular patterns of varying conductivity as a result of electron-donating defects brought about by changes in crystal stress. By avoiding these defects, we have found that diode performance improves by increasing the +/− 10 V rectification ratio by up to a factor of 5X and reducing the 200 V reverse bias leakage current by several orders of magnitude. Using the higher quality substrates with uniform electron carrier concentrations can improve the rectification ratio by another order of magnitude.

GaN is a favorable martial for future efficient high voltage power switches. GaN has not dominated the power electronics market due to immature substrate, homoepitaxial growth, and immature processing technology. Understanding the impact of the substrate and homoepitaxial growth on the device performance is crucial for boosting the performance of GaN. In this work, we studied vertical GaN PiN diodes that were fabricated on non-homogenous Hydride Vapor Phase Epitaxy (HVPE) substrates from two different vendors. We show that defects which stemmed from growth techniques manifest themselves as leakage hubs. Different non-homogenous substrates showed different distribution of those defects spatially with the lesser quality substrates clustering those defects in clusters that causes pre-mature breakdown. Energetically these defects are mostly mid-gap around 1.8Ev with light emission spans from 450nm to 700nm. Photon emission spectrometry and hyperspectral electroluminescence were used to locate these defects spatially and energetically.

Androgen Receptor (AR) signaling is a critical driver of hormone-dependent prostate cancer and has also been proposed to have biological activity in female hormone-dependent cancers, including type I endometrial carcinoma (EMC). In this study, we evaluated the preclinical efficacy of a third-generation AR antagonist, enzalutamide, in a genetic mouse model of EMC, Sprr2f-Cre;Ptenfl/fl. In this model, ablation of Pten in the uterine epithelium leads to localized and distant malignant disease as observed in human EMC. We hypothesized that administering enzalutamide through the diet would temporarily decrease the incidence of invasive and metastatic carcinoma, while prolonged administration would result in development of resistance and loss of efficacy. Short-term treatment with enzalutamide reduced overall tumor burden through increased apoptosis but failed to prevent progression of invasive and metastatic disease. These results suggest that AR signaling may have biphasic, oncogenic and tumor suppressive roles in EMC that are dependent on disease stage. Enzalutamide treatment increased Progesterone Receptor (PR) expression within both stromal and tumor cell compartments. Prolonged administration of enzalutamide decreased apoptosis, increased tumor burden and resulted in the clonal expansion of tumor cells expressing high levels of p53 protein, suggestive of acquired Trp53 mutations. In conclusion, we show that enzalutamide induces apoptosis in EMC but has limited efficacy overall as a single agent. Induction of PR, a negative regulator of endometrial proliferation, suggests that adding progestin therapy to enzalutamide administration may further decrease tumor burden and result in a prolonged response.

Vertical GaN power switch technology is expected to be utilized in next-generation medium to high voltage power converters due to the low ON-resistance and high breakdown voltage enabled by the improved critical electric field and mobility compared to Si and SiC-based devices. As large area substrates have become available by hydride vapor phase epitaxy (HVPE) and ammonothermal growth, the properties of nitrides are no longer dominated by defects introduced by heteroepitaxial growth, allowing recent realization of several fundamental vertical power devices, including diodes with edge termination, trench MOSFETs, and CAVETs. However, additional materials challenges are coming to the forefront that need to be understood and surmounted in order to allow vertical GaN power devices to achieve their full potential, notably the realization of repeatable thick drift layers with low background doping. To enable this, a deeper understanding of substrate preparation and the effects of the substrate and growth initiation on the characteristics of the epitaxial layers is required for MOCVD growth of homoepitaxial films. We investigate these effects on epi morphology, uniformity, and impurity incorporation by growing simultaneously on wafers from different vendors. The goal of this work is to detect and identify defects in GaN substrates with a series of quick, non-destructive, inexpensive techniques with capabilities of mapping whole wafers. We have characterized multiple substrates from over eight suppliers and the homoepitaxy grown on those substrates. All the substrates had nominally similar as-received specifications (resistivity, thickness, off-cut angle, bow, surface finish). The substrates were evaluated with a variety of techniques including Raman spectroscopy, photoluminescence, white light interferometry, and Nomarski imaging, enabling to detection of different concentrations of grain boundaries, sample impurities, point defects, v-shaped pits, polishing defects, crystal stress damage, and non-uniform insulating and conducive regions. The substrates can be characterized in two different categories: those with uniform characteristics, including carrier concentration, and those without. Comparing these results to those from homoepitaxial growth on the same wafers, the effects are both subtle and overt. Macroscopic surface morphology, which has shown a direct correlation to leakage current, copies and exaggerates that of the underlying substrate. Photoluminescence of the homoepitaxial surface along with Raman spectroscopy show that non-uniformities in the substrate carrier concentration can continue into the epitaxy. Following optical characterization, vertical Schottky diodes were fabricated to quickly evaluate device performance. While most of the films showed the ability to withstand high electric fields, those with more uniform properties in the substrate also showed more uniform electrical properties. These results show that the bulk substrates enable the path to high voltage vertical devices, but also show the significant influence that substrates can play in device performance.

Activation of implanted donors into a highly-resistive, nitrogen-doped homoepitaxial β-Ga2O3 has been investigated. Nitrogen acceptors with the concentration of ∼1017 cm−3 were incorporated during epitaxial growth yielding low-doped (net donor concentration 14 cm−3) films subsequently implanted with Si, Ge, and Sn. Upon Ohmic contact formation to the implanted regions, sheet resistance values of 314, 926, and 1676 Ω/sq were measured at room temperature for the Si-, Ge-, and Sn-implanted samples, respectively. Room temperature Hall measurements resulted in sheet carrier concentrations and Hall mobilities of 2.13 × 1014 /93, 8.58 × 1013/78, and 5.87 × 1013/63 cm2/(V s), respectively, for these three donor species. Secondary ion mass spectroscopy showed a volumetric dopant concentration of approximately 2 × 1019 cm−3 for the three species, resulting in carrier activation efficiencies of 64.7%, 40.3%, and 28.2% for Si, Ge, and Sn, respectively. Temperature-dependent Hall effect measurements ranging from 15 to 300 K showed a nearly constant carrier concentration in the Si-implanted sample, suggesting the formation of an impurity band indicative of degenerate doping. With a bulk carrier concentration of 1.3 × 1019 cm−3 for the Si implanted sample, a room temperature mobility of 93 cm2/(V s) is among the highest reported in Ga2O3 with a similar carrier concentration. The unimplanted Ga2O3:N regions remained highly resistive after the surrounding areas received implant and activation anneal. These results open the pathway for fabricating Ga2O3 devices through the selective n-type doping in highly resistive epitaxial Ga2O3.

We report selective area n-type doping using ion implantation of Si into semi-insulating, C-doped GaN samples activated using both conventional rapid thermal annealing (RTA) and 30 atm N2 overpressure annealing. Implanted regions were tested for Si activation using Circular Transmission Line Measurements (CTLM), while linear and circular photoconductive switches (PCSS) in the unimplanted regions were used as a test vehicle to separate implanted Si dopant activation from leakage paths generated by N vacancy formation due to damage and decomposition during annealing. We observed that at an optimal temperature around 1060 °C, a low contact resistivity of $1\times 10^{-6}\,\,\Omega $ -cm2 was obtained while preserving the breakdown of the unimplanted regions.

Record DC power has been demonstrated in AlGaN/GaN high electron mobility transistors fabricated using a substrate replacement process in which a thick diamond substrate is grown by chemical vapor deposition following removal of the original Si substrate. Crucial to the process is a ~30 nm thick SiN interlayer that has been optimized for thermal resistance. The reductions obtained in self-heating have been quantified by transient thermoreflectance imaging and interpreted using 3D numerical simulation. With a DC power dissipation level of 56 W/mm, the measured average and maximum temperatures in the gate-drain access region were 176 °C and 205 °C, respectively.

It has been well established that GaN grown on native substrates yields higher quality films compared to those grown on non-native substrates, such as SiC or Si. However, homoepitaxy is hindered by the lack of inexpensive high-quality GaN substrates. The importance of substrate quality, in particular defects and impurities, arises from its impact on device performance. Many of the imperfections in GaN substrates are inhomogeneous, thus are often not detected when short-range techniques are used.Therefore, methods for evaluating substrate quality over long ranges need to be developed. This research reports the study of these defects on four different GaN wafers from four different vendors using quick, long-range, non-destructive techniques that can be performed in a few hours. All samples are expected to be n+ and should theoretically be suited for use in GaN homoepitaxial vertical power devices, though had different properties that could impact device performance. Through evaluation by Raman spectroscopy, photoluminescence, white light optical profilometry, and Nomarski imaging concentrations of grain boundaries, impurity incorporations, point defects, v-shaped cone defects, polishing defects, crystal stress damage, and insulating and conductive regions were identified across the various GaN substrates studied.

In this work, the effects of the substrate defects on the reverse leakage behavior of vertical GaN Schottky and p-i-n diodes are investigated. A direct connection between the reverse leakage behavior of GaN based vertical devices and the defect characteristics of the substrate was achieved. The difference in the leakage current can be as high as 6 orders of magnitude for vertical GaN p-i-n diodes at -200V, using HVPE substrate with inhomogeneous defect distributions (with dot-cores). For comparison, using HVPE substrate with uniform defect distribution (no cores), the p-i-n diodes show much more uniform leakage behavior at -200V, varying within only an order of magnitude. The wafers with inhomogeneous defect distribution possess periodically patterned core-centers with higher defect density (up to 108 cm-2) than regions in between cores, which have very low defect concentrations (as low as 104 cm-2). The full width at 0.01 maximum of the triple axis rocking curves (GaN (0004)) shows a large variation ranging from 60 to 930 arcsec. In comparison, wafers without the periodic cores have a uniform defect density (~106 cm-2) and show a small variation in the rocking curve FW0.01M, ranging only from 70 to 280 arcsec. For Schottky diodes fabricated on substrate with cores, positioning the devices away from the core-centers results in a reduction of the reverse bias leakage by 2-4 orders of magnitude at -10 V. Similar trend are also observed in the p-i-n diodes, with device further away from the core-centers showing lower leakage. The devices in the low defect concentration region (> 200 um away from core centers) on the wafer with cores outperform the devices from the wafer without cores, showing up to 2 orders of magnitude lower leakage current at -200 V. The results from this study show that the substrate defect density and distribution play an important role on the device leakage current and avoiding highly defective regions on the substrate will improve the performance of vertical GaN devices.

GaN research is important to the development of next generation power conversion technology because its large Baliga figure of merit GaN gives it the potential to outperform SiC. Presently, commercialized GaN technology is based on lateral high electron mobility transistors (HEMTs); however, large areas would be required for high voltage applications thus there is motive to switch to vertical GaN. Current GaN substrate manufacturing technology is known to produce inconsistent quality with a varying concentration of defects. These defects are known to cause catastrophic device failure, thus there is motive to develop quick, non-destructive techniques to predict the quality of the wafer before undergoing the expensive fabrication process. This talk focuses on using data science and machine learning to predict the quality of the diodes. This work demonstrated that Raman spectroscopy can be used to detect high crystal stress points, which strongly correlates with an increased leakage current. Optical profilometry images can be used to detect defects that cause catastrophic failures; however, the presence of benign defects makes it difficult to predict the device quality using a simple algorithm. Thus, a machine learning algorithm relate optical profilometry images to device performance of subsequently processed device. The results showed that this algorithm was 91% accurate at predicting the forward bias behavior of devices, and it is possible that the devices it could accurately predict failures due to device processing errors. This work was supported by the Office of Naval Research.

Ga2O3 is the only ultra-wide bandgap semiconductor with melt-growth substrate technology similar to that of Si, heterostructure device technology similar to that of the III-Nitride family, and high growth rate (GR) epitaxial technologies such as MOCVD and HVPE to support the development of ultra-high-breakdown voltage devices competitive with SiC technology. We have demonstrated for the first time a β-Ga2O3 MOSFET grown by high-GR MOCVD (Agnitron Technology’s Agilis 100 reactor) with record high mobility of 170 cm2/Vs, despite increased carrier scattering rate in the doped channel, facilitated by a significant improvement in epilayer quality. The high GR demonstrated via this method paves the road for demonstration of high breakdown voltage devices on a thick Ga2O3 buffer layer. [1] M.J. Tadjer et al., J. Phys. D: Appl. Phys. 54 (2021) 034005.

In this work, the effects of the substrate defect density and distribution on the reverse leakage behavior of GaN vertical Schottky diodes and p–i–n diodes are investigated. A direct connection between the reverse leakage behavior of GaN based vertical devices and the dislocation density of the underlying material was determined. The difference in the leakage current for devices on different locations of the wafer can be as high as 6 orders of magnitude (for p–i–n diodes) at −200V, for HVPE substrate with inhomogeneous but predictable defect distributions (GaN substrates with dot-core inversion domain features). For comparison, using HVPE substrates with uniform defect distribution (but with no cores), the p–i–n diodes show much more uniform leakage behavior, varying within only an order of magnitude, and that range fell within the much greater range of that for the inhomogeneous substrates. The substrates with inhomogeneous defect distribution proved to be useful to show the direct correlation. The topography measurements confirmed that the wafers with inhomogeneous defect distribution possess periodically patterned core-centers with higher defect density and larger lattice distortions surrounded by other regions, which have very low defect concentrations. Devices located away from the defective core-centers result in a reduction of the reverse bias leakage by over two orders of magnitude at −10 V for Schottky diodes. Similar trends are also observed in the p–i–n diodes; the devices close to the core centers show the highest reverse leakage (>0.01 A cm−2 at −200V). Devices further away from the core-centers (lower dislocation density) show lower reverse leakage current. Moreover, the p–i–n diodes on regions more than 300 μm away from the core-centers show the best leakage behavior (−7 A cm−2 at −200V) of all the devices, outperforming the devices on the substrates with uniform defect distribution (∼10−6 A cm−2 at −200V). The results from this study show that the substrate defect density and distribution play important roles in the device leakage current. X-ray topography is extremely effective for studying defect characteristics underneath individual devices. The use of the wafers with inhomogeneous, but predictable defect density clearly demonstrated the importance of low defect densities for high device performance.

This paper describes the development of vertical GaN PN diodes for high-voltage applications. A centerpiece of this work is the creation of a foundry effort that incorporates epitaxial growth, wafer metrology, device design, processing, and characterization, and reliability evaluation and failure analysis. A parallel effort aims to develop very high voltage (up to 20 kV) GaN PN diodes for use as devices to protect the electric grid against electromagnetic pulses.

Skyrmions hold great promise for low-energy consumption and stable high-density information storage, and stabilization of the skyrmion lattice (SkX) phase at or above room temperature is greatly desired for practical use. The topological Hall effect can be used to identify candidate systems above room temperature, a challenging regime for direct observation by Lorentz electron microscopy. Atomically ordered FeGe thin films are grown epitaxially on Ge(111) substrates with $\ensuremath{\sim}4%$ tensile strain. Magnetic characterization reveals enhancement of the Curie temperature to 350 K due to strain, well above the bulk value of 278 K. A strong topological Hall effect was observed between 10 and 330 K, with a significant increase in magnitude observed at 330 K. The increase in magnitude occurs just below the Curie temperature, similar to the onset of the SkX phase in bulk FeGe. The results suggest that strained FeGe films may host a SkX phase above room temperature when significant tensile strain is applied.

In this work, we evaluate the effect of the novel symmetric multicycle rapid thermal annealing (SMRTA) process on both Mg ion implanted and non-implanted thick unintentionally doped GaN drift layers for vertical power devices. The typical p-type behavior and restoration of implant damage are observed in implanted samples, but on non-implanted samples a reduction in background carrier concentration and associated reduction in leakage current and increase in breakdown voltage is observed. This indicates that the capping/annealing process itself is not detrimental to the crystal, and the annihilation of native point defects in the process has beneficial effects for device structures.

The availability of high quality, free-standing GaN substrates enables new device applications in III-nitrides, especially for vertical device structures. With the introduction of these native substrates, the properties of nitrides are no longer dominated by defects introduced by heteroepitaxial growth. However, additional materials challenges are coming to the forefront that need to be understood and surmounted in order to allow homoepitaxial devices to achieve their full potential. In this paper, 2 μm of UID GaN are grown simultaneously by MOCVD on three commercially sourced 2″ HVPE wafers. By doing so, the substrates are exposed to the exact same growth conditions and the influence of the substrate can be unambiguously identified. The results are presented in regards to the effects of the substrates on epitaxial film morphology, uniformity, impurity incorporation, substrate/epitaxy interface, and electrical properties.

Single phase e -Mn4N thin and ultrathin films are grown on MgO(001) using molecular beam epitaxy. Reflection high-energy electron diffraction and out-of-plane X-ray diffraction measurements are taken for each sample in order to determine the in- and out-of-plane strain for each sample. Vibrating sample magnetometry and superconducting quantum interference device measurements, which are performed on the thin and ultrathin films respectively, are used to plot the magnetization of each sample versus both in- and out-of-plane H → -fields and to determine the magnitude of perpendicular magnetic anisotropy in these films. Three significant components of perpendicular magnetic anisotropy are observed in these films and are attributed to sample strain (1 component) and shape (2 components). Among these components, the most significant component 0.8 – 4.9 Merg cm 3 is identified as a second term of shape anisotropy, which possesses a negative linear relationship with sample thickness over the range from 9 nm to 310 nm. Atomic (magnetic) force microscopy measurements show the presence of a surface localized magnetic polarization (22–82 % ), which increases with decreasing thickness, when the net magnetizations of the films are zero. The second term of shape anisotropy as well as the surface localized polarization, which each depend on sample thickness, are each regarded as a consequence of Ising domains overlapping out-of-plane in these films.

The Super-Lattice Power Amplifier with Diamond Enhanced Superjunction (SPADES) device is being developed to enable a 2x increase in breakdown voltage of a Super-Lattice Castellated Field Effect Transistor (SLCFET) device. Incorporation of a diamond superjunction (SJ) within the drain region of a SLCFET was previously predicted to improve breakdown voltage with minimal impact on performance. P-type doped nanocrystalline diamond (NCD) is grown within etched trenches in the drain region of a SLCFET and tied to the gate, forming an active vertical field plate to laterally distribute electric field. Under high drain bias, mutual depletion regions are formed in the current carrying ridges and NCD in the drain region. This results in lower parasitic capacitance compared to a metal field plate, an important consideration for millimeter wave applications. On devices with an NCD SJ, we observe minimal capacitance penalty, low dispersion, and breakdown voltage behavior consistent with TCAD model prediction.

We investigate the effects of high-rate and high total doses of 60Co gamma rays on the current–voltage (IV) characteristics of GaN p+n diodes grown by metal-organic chemical vapor phase epitaxy on Ga-face (0001) sapphire and hydride vapor phase epitaxy freestanding GaN substrates. We show that diodes grown on sapphire undergo more permanent changes upon irradiation at doses up to 3900 kGy than those grown on freestanding GaN. By combining diode and circular transfer length method measurements, we show that the p-type contact interface and adjacent p++ Mg-doped layer are sensitive to irradiation. In initial experiments, diodes grown on sapphire exhibited p-type contacts with Schottky characteristics, while those on freestanding GaN were Ohmic. Serendipitously, we identified and subsequently irradiated a freestanding sample with a pre-irradiation spatial gradient of p-contact Schottky vs Ohmic behavior across the die. This sample allowed the root cause of induced change to be identified as differences in the p++ contacting layer. We show that the p-type contact's pre-irradiation Schottky behavior is predictive of diodes' IV characteristics changing significantly upon gamma-ray irradiation. Further, we observe that the IV curves of diodes on freestanding GaN recover fully over several weeks at room temperature to be indistinguishable from pre-irradiation. IV curves from diodes on sapphire do not fully recover; we thus hypothesize that interactions between radiation-induced point defects and threading dislocations affect the evolution of radiation damage.

Heterojunction field-effect transistors based on the β-(AlxGa1−x)2O3/Ga2O3 heterostructure grown by ozone-assisted molecular beam epitaxy were demonstrated for the first time. Al composition ratios in the 14%–23% range were validated using x-ray diffraction on the three samples grown for this study. Electrochemical capacitance-voltage (ECV) measurements showed the presence of a charge sheet in the delta-doped (AlxGa1−x)2O3 barrier layer. Secondary ion mass spectroscopy and ECV measurements also revealed an unintentional Si peak at the (AlxGa1−x)2O3/Ga2O3 interface. Direct current (IDS-VGS) and transconductance (Gm-VGS) measurements demonstrated depletion-mode transistor operation as well as the presence of a parallel conduction channel. A one-dimensional Poisson model suggested that dopant redistribution in the delta-doped region could cause a secondary channel to form in the barrier in addition to the primary channel near the (AlxGa1−x)2O3/Ga2O3 interface under certain conditions met in these samples. Fabricated devices on sample A did not exhibit breakdown up to the measurement limit of 1100 V, with stability after ten cycles. A maximum output drain current density of 22 mA/mm was measured on sample B. Room temperature Hall measurements yielded a sheet carrier density of 1.12 × 1013 cm−2 with corresponding Hall mobility of 95 cm2/V s in sample C.

We investigate the impact of high-dose gamma-ray irradiation on the electrical performance of Ga-polar and N-polar GaN-based p–n diodes grown by metalorganic chemical vapor deposition. We compare the current density–voltage (J–V), capacitance–voltage (C–V), and circular transfer length method characteristics of the p–n diodes fabricated on Ga-polar and N-polar orientations before and after irradiation. The relative turn-on voltage increases for the Ga-polar diodes with an increasing irradiation dose, while it increases initially and then starts to decrease for the N-polar diodes. The p-contact total resistance increases for Ga-polar and decreases for N-polar samples, which we attribute to the formation of point defects and additional Mg activation after irradiation. The J–V characteristics of most of the tested diodes recovered over time, suggesting the changes in the J–V characteristics are temporary and potentially due to metastable occupancy of traps after irradiation. X-ray photoelectron spectroscopy and photoluminescence measurements reveal the existence of different types of initial defects and surface electronic states on Ga-polar and N-polar samples. Gallium vacancies (VGa) are dominant defects in Ga-polar samples, while nitrogen vacancies (VN) are dominant in N-polar samples. The presence of a higher concentration of surface states on Ga-polar surfaces than N-polar surfaces was confirmed by calculating the band bending and the corresponding screening effect due to opposite polarization bound charge and ionized acceptors at the surface. The difference in surface stoichiometry in these two orientations is responsible for the different behavior in electrical characteristics after gamma-ray interactions.

The ordered double perovskites Sr2CrOsO6 and Ca2CrOsO6 have been synthesized and characterized with neutron powder diffraction, electrical transport measurements, and high field magnetization experiments. As reported previously Sr2CrOsO6 crystallizes with R 3 ¯ symmetry due to a−a−a− octahedral tilting. A decrease in the tolerance factor leads to a−a−b+ octahedral tilting and P21/n space group symmetry for Ca2CrOsO6. Both materials are found to be ferrimagnetic insulators with saturation magnetizations near 0.2 μB. Sr2CrOsO6 orders at 660 K while Ca2CrOsO6 orders at 490 K. Variable temperature magnetization measurements suggest that the magnetization of the Cr3+ and Os3+ sublattices have different temperature dependences in Sr2CrOsO6. This leads to a non-monotonic temperature evolution of the magnetic moment. Similar behavior is not seen in Ca2CrOsO6. Both compounds have similar levels of Os/Cr antisite disorder, with order parameters of η=80.2(4)% for Sr2CrOsO6 and η=76.2(5)% for Ca2CrOsO6, where η=2θ−1 and θ is the occupancy of the osmium ion on the osmium-rich Wyckoff site.

In this work, we fabricate Van der Pauw structures on AlGaN/GaN high electron mobility transistors (HEMTs) with both SiN and AlN passivation layers and both SiC and GaN substrates to study temperature dependent electron transport properties of 2 dimensional electron gases (2DEG) in as-fabricated and proton irradiated devices. We confirm that using a GaN substrate or AlN passivation layer enhances the mobility particularly at low temperatures, though this enhancement is greatly reduced upon irradiating the samples with high proton fluences. Our results suggest that the sheet density may be affected by Al diffusion in the sample creating electron donating impurities, which freeze out around 200 K and are more prominent in AlN passivated samples and minimized by using a GaN over a SiC substrate. Additionally, we show that a large dose of radiation forms traps in the AlGaN layer, which drop the sheet density at high proton fluences.

Single crystal (−201) β-Ga2O3 substrates doped with Si and Sn have been thermally annealed in N2 and O2 atmospheres. Structural and electrical properties evaluation was performed via a number of experimental methods in order to quantify the effects of the doping and annealing ambient on the properties of these samples. All samples annealed in O2 exhibited significantly lower carrier concentration, as determined by capacitance–voltage measurements. Schottky barrier diodes exhibited excellent rectification when the Ga2O3 was annealed in N2, and significantly lower forward current using O2-annealed Ga2O3 substrates. Deep level transient spectroscopy revealed four deep trap levels with activation energies in the range of 0.40–1.07 eV. Electron spin resonance showed a decrease in shallow donor concentration, and cathodoluminescence spectroscopy revealed nearly two orders of magnitude lower emission intensity in O2-annealed Ga2O3 samples. Raman spectroscopy revealed a carrier concentration dependent Raman mode around 254 cm−1 observed only when the final anneal of (−201) β-Ga2O3 was not done in O2. Secondary ion mass spectroscopy measurements revealed diffusion of unintentional Fe towards the surface of the (−201) Ga2O3 samples after annealing in O2. Depth resolved positron annihilation spectroscopy showed an increased density of vacancy defects in the bulk region of O2-annealed Ga2O3 substrates.

We demonstrate p-type activation of GaN doped by Mg ion implantation, and in situ during metalorganic chemical vapor deposition through sequential short-duration gyrotron microwave heating cycles at temperatures of 1200–1350 °C. GaN is implanted with 1019 cm−3 Mg ions, capped with AlN, and annealed under 3 MPa N2 overpressure in 5 s heating cycles for less than 60 s total using a high-power gyrotron microwave heating source. Through I–V characterization, photoluminescence spectroscopy, and Raman spectroscopy, we study the evolution of electrical properties, optically active point defects, and material strain in response to implantation and annealing. For Mg-implanted samples, increasing annealing temperature is characterized by an increase in the PL substitutional Mg-related peak (UVL) relative to the shallow-donor vacancy-related peak (GL2). Through comparison of implanted and in situ doped samples, it is demonstrated that the origin of compensating VN lies primarily in implantation rather than degradation from the annealing process. Transmission line measurements and diode I–V measurements show a sheet resistance of 1083 kΩ/□ and a hole concentration of 1.23 × 1015 cm−3, respectively, in the Mg-implanted material annealed at 1350 °C. We conclude that temperature-cycled gyrotron annealing at 1350 °C decreases implant-induced compensating point defects and activates Mg to obtain selective p-type conduction.

Plasma etching of p-type GaN creates n-type nitrogen vacancy (VN) defects at the etched surface, which can be detrimental to device performance. In mesa isolated diodes, etch damage on the sidewalls degrades the ideality factor and leakage current. A treatment was developed to recover both the ideality factor and leakage current, which uses UV/O3 treatment to oxidize the damaged layers followed by HF etching to remove them. The temperature dependent I–V measurement shows that the reverse leakage transport mechanism is dominated by Poole–Frenkel emission at room temperature through the etch-induced VN defect. Depth resolved cathodoluminescence confirms that the damage is limited to first several nanometers and is consistent with the VN defect.

Androgen Receptor (AR) signaling is a critical driver of hormone-dependent prostate cancer and has also been proposed to have biological activity in female hormone-dependent cancers, including type I endometrial carcinoma (EMC). In this study, we evaluated the preclinical efficacy of a third-generation AR antagonist, enzalutamide, in a genetic mouse model of EMC, Sprr2f-Cre;Ptenfl/fl. In this model, ablation of Pten in the uterine epithelium leads to localized and distant malignant disease as observed in human EMC. We hypothesized that administering enzalutamide through the diet would temporarily decrease the incidence of invasive and metastatic carcinoma, while prolonged administration would result in development of resistance. Short-term treatment with enzalutamide reduced overall tumor burden through increased apoptosis but failed to prevent progression of invasive and metastatic disease suggesting that AR signaling may have biphasic, oncogenic and tumor suppressive roles in EMC. Enzalutamide treatment increased Progesterone Receptor (PR) expression within both stromal and tumor cell compartments. Prolonged administration of enzalutamide decreased apoptosis, increased tumor burden and resulted in the clonal expansion of tumor cells expressing high levels of p53 protein, suggestive of acquired Trp53 mutations. In conclusion, we show that enzalutamide induces apoptosis in EMC but has limited efficacy overall as a single agent. Induction of PR, a negative regulator of endometrial proliferation, suggests that adding progestin therapy to enzalutamide administration may further decrease tumor burden and result in a prolonged response. Citation Format: Christopher Steven Koivisto, Parrish Melodie, Bonala Santosh, Soo Ngoi, Georges J. Nahhas, Bei Liu, Adrian Torres, James Gallagher, Rebekah Snchez-Hodge, Victor Zeinner, David Cohn, Floor Backes, Paul Goodfellow, Helen Chamberlin, Gustavo Leone. Evaluating the efficacy of enzalutamide and the development of resistance in a preclinical mouse model of type-I endometrial carcinoma [abstract]. In: Proceedings of the Annual Meeting of the American Association for Cancer Research 2020; 2020 Apr 27-28 and Jun 22-24. Philadelphia (PA): AACR; Cancer Res 2020;80(16 Suppl):Abstract nr 627.

Semi-insulating GaN films with controlled dopant profiles have significant potential to improve the performance of high-power electronics. Beryllium doped GaN (GaN:Be) films previously demonstrated a semi-insulating nature, but the Be-dopant profiles in these films exhibited Be surface segregation and accumulation, which would lead to undesired leakage current paths in devices and deterioration of breakdown voltage. Improved growth kinetics of metal modulated epitaxy at low growth temperatures are applied in the study of GaN:Be films to achieve selectively controlled and abrupt step-doped Be profiles. The GaN:Be films were found to be semi-insulating via Hall effect measurements at elevated temperatures of 495 K. The films were shown to effectively electrically compensate surface contaminants at regrowth interfaces. Surface contaminants (O, Si, and C) typically result in unintentional n-type doping at the GaN on GaN regrowth interface. In order to demonstrate the utility of Be doping, GaN:Mg p-type films are grown atop GaN:Be buffer, AlN buffer, and control samples without any insulating buffer on GaN:Fe templates. Remarkably, the p-type films grown atop control samples up to 400 nm thick are compensated from surface contaminants, whereas the films grown atop AlN and GaN:Be insulating layers effectively electrically neutralize the surface contaminants and result in high hole concentrations of 2.3 and 2.5 × 1019 cm−3, respectively. The use of GaN:Be instead of AlN buffers eliminates the need to deconvolve the effects of the AlN/GaN 2D sheet charges and defects from lattice mismatch, removes lateral conduction paths, and reduces inherently high static vertical electric fields that detract from power device performance.

III-Nitride high electron mobility transistors (HEMTs) have been of critical importance for commercial and military applications which require the high frequency, high power density enabled by the favorable properties of Gallium Nitride. However, the long-term reliable operation of GaN at high power has continued to face unique challenges originating from the simultaneously high electric field and high temperature within a small volume of a HEMT [1]. Mitigating self-heating using a CVD diamond cap have resulted in about 20% lower device temperature at the expense of additional process complexity in order to integrate the heat spreading close to the 2DEG channel [2]. Similarly, GaN -on-diamond technology has produced excellent electrothermal performance by integrating GaN -on-Si with CVD diamond growth on the N-polar back side [3]. Such advances in thermal management have demonstrated that GaN HEMTs have the potential to operate reliably at very high power density $(> 10\mathrm{W}/\mathrm{mm})$ . In this work, we have quantified the electrothermal performance of state-of-the-art AIGaN/GaN HEMTs on Si and diamond substrates and demonstrate very high DC output power operation at a reliably low temperature.

We experimentally study the excitation and propagation of acoustic solitary waves in a one-dimensional dusty plasma (i.e. a Yukawa chain) with $n=65$ particles interacting through a screened Coulomb potential. The lattice constant $a=1.02\pm 0.02$ mm. Waves are launched by applying a 100 mW laser pulse to one end of the chain for laser pulse durations from 0.10 to 2.0 s. We observe damped solitary waves which propagate for distances ${\gtrsim}30a$ with an acoustic speed $c_{s}=11.5\pm 0.2~\text{mm}~\text{s}^{-1}$. The maximum velocity perturbation increases with laser pulse duration for durations ${\leqslant}0.5$ s and then saturates at ${\approx}15\,\%$. The wave speed is found to be independent of the maximum amplitude, indicating that the formation of nonlinear solitons is prevented by neutral-gas damping.

Vertical heterojunction p-CuI/n-Ga2O3 diodes were fabricated on commercial β-Ga2O3 substrates using the reaction of epitaxially-sputtered Cu with natural I2 vapor at room temperature followed by either a high temperature I2 gas reaction or an I2 solution treatment to remove iodine vacancies. Results show that using an epitaxially-oriented over a polycrystalline Cu layer produces larger and more strongly bonded CuI crystals. Hall and current–voltage measurements support rectifying behavior consistent with p-CuI/n-Ga2O3 heterojunction characteristics including 8 orders of magnitude I on/I off ratio and an ideality factor of 1.37 measured on the sample with the lowest concentration of iodine vacancies.

Vertical GaN power switch technology is expected to be utilized in next-generation medium to high voltage power converters due to the low ON-resistance and high breakdown voltage enabled by the improved critical electric field and mobility compared to Si and SiC-based devices. As large area substrates have become available by hydride vapor phase epitaxy (HVPE) and ammonothermal growth, the properties of nitrides are no longer dominated by defects introduced by heteroepitaxial growth, allowing recent realization of several fundamental vertical power devices, including diodes with edge termination, trench MOSFETs, and CAVETs. However, additional materials challenges are coming to the forefront that need to be understood and surmounted in order to allow vertical GaN power devices to achieve their full potential, notably the realization of repeatable thick drift layers with low background doping. To enable this, a deeper understanding of substrate preparation and the effects of the substrate and growth initiation on the characteristics of the epitaxial layers is required for MOCVD growth of homoepitaxial films. We investigate these effects on epi morphology, uniformity, and impurity incorporation by growing simultaneously on wafers from different vendors. The goal of this work is to detect and identify defects in GaN substrates with a series of quick, non-destructive, inexpensive techniques with capabilities of mapping whole wafers. Four different substrates - three grown by hydride vapor phase epitaxy and the fourth by ammonothermal technique were obtained from multiple vendors. All had nominally similar as-received specifications (resistivity, thickness, off-cut angle, bow, surface finish). The substrates were evaluated with a variety of techniques including Raman spectroscopy, photoluminescence, white light interferometry, and Nomarski imaging, enabling to detection of different concentrations of grain boundaries, sample impurities, point defects, v-shaped pits, polishing defects, crystal stress damage, and non-uniform insulating and conducive regions. Comparing these results to those from homoepitaxial growth on the same wafers, the effects are both subtle and overt. Macroscopic surface morphology, which has shown a direct correlation to leakage current, copies and exaggerates that of the underlying substrate. Donor incorporation in the epitaxy is relatively uniform, regardless of the substrate doping. However, homoepitaxy on substrates with inhomogeneous impurity incorporation did show some near band edge broadening by PL. Carbon incorporation varied with substrate offcut angle, which is supported by DFT calculations. All interfaces between epitaxy and substrate have a large Si peak, which requires further study. Following optical characterization, vertical Schottky diodes were fabricated to quickly evaluate device performance. While most of the films showed the ability to withstand high electric fields, those with more uniform properties in the substrate also showed more uniform electrical properties. These results show that the bulk substrates enable the path to high voltage vertical devices, but also show the significant influence that substrates can play in device performance.

GaN-based power switching devices are of significant interest for high efficiency power conversion circuits in medium voltage applications. However, there are still significant challenges preventing mass production and widespread adoption. Recently, GaN-based vertical and lateral power devices have attracted significant interest due to promising device results coupled with progress in native substrate, epitaxial growth, and processing technology developments. However, there are two significant limiting factors for vertical GaN power devices at present. The first issue is substrate and epitaxial layer uniformity and reliability, and the second is the lack of a planar selective-area doping process. While p-type epitaxial growth capability and the ability to stack layers are quite mature from the LED industry, power devices require planar selective-area doping, which is a routine step by ion implantation in the Si and SiC device industry. The ability to implant and activate dopants, particularly p-type dopants, in GaN still remains a challenge as implant activation typically requires annealing at temperatures ~ 2/3 of the melting point, which is a region where the GaN crystal is unstable and readily decomposes to Ga + N2 at atmospheric pressure. The NRL-developed symmetric multicycle rapid thermal annealing (SMTRA) technique has been the most successful, demonstrating electrical activation of up to ~10% of the implanted Mg dopant atoms using a combination of a temporary, thermally stable capping layer, annealing in a moderate nitrogen overpressure, and performing a well-optimized annealing temperature profile including multiple spike anneals. Advances in the SMRTA process development, including optimization of capping processes, implantation profile, and processing steps such as metallization and surface treatments will be reviewed here. In addition, the evaluation of components of the SMRTA process, such as the cap and overpressure anneal, have been applied to Si implantation for n-type doping and will be presented here. This is a critical step to reduce contact resistance in lateral GaN structures as well as form the source regions of vertical devices that is typically accomplished by selective area regrowth. The use of ion implantation and activation utilizes fewer process steps and avoids impurity incorporation at sidewalls compared to the selective area regrowth process, and has been shown to yield lower contact resistance as well. This presentation will review advances in both Mg and Si ion implantation and assess the viability of this process for practical device fabrication.

Ferromagnetic L10−MnGa was grown by molecular beam epitaxy under ultrahigh vacuum conditions to a 73±5nm thickness atop of 50±5nm thick molecular beam epitaxy grown antiferromagnetic η⊥−Mn3N2 on an MgO(001) substrate. The MnGa grew along the c-axis with an out-of-plane spacing of c=3.71±0.01A and a relaxed in-plane spacing of a=4.00±0.05A measured with x-ray diffraction and reflection high-energy electron diffraction, respectively. Williamson–Hall analysis revealed 67±17nm tall columnar grains with a residual strain of 2.40±0.26(×10−3). A radial distribution plot of screw dislocations observed in scanning tunneling microscopy images showed an in-plane coherence length of 15±5nm. Reflection high-energy electron diffraction analysis of the in-plane lattice spacing during growth reveals a critical thickness of 1.05±0.65nm for the MnGa, after which the MnGa film relaxes by incorporating dislocations of both edge and screw type. Vibrating sample magnetometry was employed to obtain the magnetic properties of the bilayer system. It is found that the dislocation density plays a significant role in influencing the measured moment per unit cell, where a large dislocation density lowers the moment per unit cell significantly due to chemical layer disordering.