1. Electrical, thermal and mechanical properties of poly-etherimide epoxy-diamine blend
- Author
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Sébastien Pruvost, Hervé Morel, O. Gain, Nour Halawani, J.-L. Auge, Ampère, Département Energie Electrique (EE), Ampère (AMPERE), École Centrale de Lyon (ECL), Université de Lyon-Université de Lyon-Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Institut National des Sciences Appliquées (INSA)-Université de Lyon-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE)-École Centrale de Lyon (ECL), Institut National des Sciences Appliquées (INSA)-Université de Lyon-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE), Ingénierie des Matériaux Polymères - Laboratoire des Matériaux Polymères et des Biomatériaux (IMP-LMPB), Centre National de la Recherche Scientifique (CNRS)-Université Jean Monnet [Saint-Étienne] (UJM)-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Institut National des Sciences Appliquées (INSA)-Université de Lyon-Institut National des Sciences Appliquées (INSA)-Université de Lyon-Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Institut de Chimie du CNRS (INC), Ingénierie des Matériaux Polymères (IMP), Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS)-Université Jean Monnet [Saint-Étienne] (UJM)-Institut National des Sciences Appliquées de Lyon (INSA Lyon), and Université de Lyon
- Subjects
[SPI.OTHER]Engineering Sciences [physics]/Other ,Thermogravimetric analysis ,Materials science ,Passivation ,02 engineering and technology ,Dielectric ,01 natural sciences ,Industrial and Manufacturing Engineering ,chemistry.chemical_compound ,Differential scanning calorimetry ,Parylene ,Phase (matter) ,0103 physical sciences ,Composite material ,Thermosetting resin Organic-organic blend Thermoplastic Electrical properties ,010302 applied physics ,Mechanical Engineering ,[SPI.NRJ]Engineering Sciences [physics]/Electric power ,Dynamic mechanical analysis ,Epoxy ,021001 nanoscience & nanotechnology ,chemistry ,Mechanics of Materials ,visual_art ,Ceramics and Composites ,visual_art.visual_art_medium ,0210 nano-technology - Abstract
International audience; This work deals with the study of thermoset-thermoplastic blend forming an epoxy-amine/poly-etherimide phase separated to assess the dielectric and thermal performances. These materials would be good candidates to replace the passivation layer in semiconductors, particularly ones used as switches in power electronic applications. Polyimide and Parylene are usually quoted and studied. Mixtures based on polymers would be a novel candidate that can manage to be an insulator for the system. The modified and non-modified systems where characterized by transmission electron microscopy, scanning electron microscopy, differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analysis, dielectric analysis and analytical simulation was carried out on dielectric measurements. These complementary techniques were used first to investigate the presence of the phase separation phenomenon and second to quantify the separated nodules size. The effect of this phase separation was examined and showed enhancement in the dielectric values compared to the pure epoxy system. It was finally simulated to show a close assumption of what is found experimentally.
- Published
- 2017
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