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43 results on '"Pathak, Mohit"'

1. Modelling Financial Variables Using Neural Networking to Access Creditworthiness

Author

Ubarhande Prashant, Chandani Arti, Pathak Mohit, Agrawal Reena, and Bagade Sonali

Subjects
creditworthiness, credit rating model, neural networking, test data, accuracy model testing, c45, e51, Finance, HG1-9999
Abstract

This study examines the existing credit rating methodology proposed in the literature to explore the development of a new credit rating model based on the financial variables of the enterprise. The focus is on the period after the financial crisis of 2018. This study aims to develop a credit rating model using neural networking and tests the same for its accuracy. The goal of this study is to address the issue brought up by previous research on subjectivity in the data used to determine creditworthiness. The database for the study includes financial data up to July 2022 from December 2018. A model is created to assess an enterprise's creditworthiness using neural networking. This study first evaluated the existing credit rating models proposed in the literature. Next, based on financial data and neural networking, a model is developed. It was evident that the model developed in this study has an accuracy of 85.16% and 76.47% on train and test data respectively. There exist several models to determine the creditworthiness of borrowers but all failed to address the concern of subjectivity in the data. The model created in this study made use of cutting-edge technology such as neural networking and financial data. This paper's unique approach and model construction based on a comparison of existing models is rare in the literature and justify the originality of this paper with a practical value at the global level.

Published
2024
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2. Role of Financial Literacy and Trust in Perceived Usefulness of Robo Advisory Services

Author

Bhatia, Ankita, Chandani, Arti, Divekar, Rajiv, Pathak, Mohit, Ubarhande, Prashant, Lenka, Reena, Kacprzyk, Janusz, Series Editor, Gomide, Fernando, Advisory Editor, Kaynak, Okyay, Advisory Editor, Liu, Derong, Advisory Editor, Pedrycz, Witold, Advisory Editor, Polycarpou, Marios M., Advisory Editor, Rudas, Imre J., Advisory Editor, Wang, Jun, Advisory Editor, Kaiser, M. Shamim, editor, Xie, Juanying, editor, and Rathore, Vijay Singh, editor

Published
2024
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6. Does Stock Exchange Influence Economic Growth? An Exploratory Study from the Prospective of Gambia

Author

Jeng, Malick, Pathak, Mohit, Chandani, Arti, Kacprzyk, Janusz, Series Editor, Gomide, Fernando, Advisory Editor, Kaynak, Okyay, Advisory Editor, Liu, Derong, Advisory Editor, Pedrycz, Witold, Advisory Editor, Polycarpou, Marios M., Advisory Editor, Rudas, Imre J., Advisory Editor, Wang, Jun, Advisory Editor, Kaiser, M. Shamim, editor, Xie, Juanying, editor, and Rathore, Vijay Singh, editor

Published
2023
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8. Strategies on Smart Energy Management Policies in India

Author

Kumar, Sujit, Banshwar, Anuj, Sharma, Naveen, Sharma, Bharat Bhushan, Pathak, Mohit, Bansal, Jagdish Chand, Series Editor, Deep, Kusum, Series Editor, Nagar, Atulya K., Series Editor, Das, Kedar Nath, editor, Das, Debasish, editor, Ray, Anjan Kumar, editor, and Suganthan, Ponnuthurai Nagaratnam, editor

Published
2022
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9. DGA-Based Health Assessment of a 20 MVA Power Transformer

Author

Sharma, Naveen Kumar, Banshwar, Anuj, Sharma, Bharat Bhushan, Pathak, Mohit, Kumar, Sujit, Cavas-Martínez, Francisco, Series Editor, Chaari, Fakher, Series Editor, Gherardini, Francesco, Series Editor, Haddar, Mohamed, Series Editor, Ivanov, Vitalii, Series Editor, Kwon, Young W., Series Editor, Trojanowska, Justyna, Series Editor, di Mare, Francesca, Series Editor, Govindan, Kannan, editor, Kumar, Harish, editor, and Yadav, Sanjay, editor

Published
2022
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10. An Investigation to Different Methods of Health Assessment in Power Transformers

Author

Banshwar, Anuj, Kumar Sharma, Naveen, Pathak, Mohit, Sharma, Bharat Bhushan, Kumar, Sujit, Cavas-Martínez, Francisco, Series Editor, Chaari, Fakher, Series Editor, Gherardini, Francesco, Series Editor, Haddar, Mohamed, Series Editor, Ivanov, Vitalii, Series Editor, Kwon, Young W., Series Editor, Trojanowska, Justyna, Series Editor, di Mare, Francesca, Series Editor, Govindan, Kannan, editor, Kumar, Harish, editor, and Yadav, Sanjay, editor

Published
2022
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12. Probabilistic Approach for Load Flow Analysis of Radial Distribution System

Author

Banshwar, Anuj, Pathak, Mohit, Sharma, Bharat Bhushan, Sharma, Naveen Kumar, Kumar, Sumit, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zhang, Junjie James, Series Editor, Dewan, Lillie, editor, C. Bansal, Ramesh, editor, and Kumar Kalla, Ujjwal, editor

Published
2021
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13. Microcontroller-based PID Temperature Controller Using Genetic Algorithms

Author

Sharma, Bharat Bhushan, Banshwar, Anuj, Pathak, Mohit, Sharma, Naveen Kumar, Joshi, Aman, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zhang, Junjie James, Series Editor, Dewan, Lillie, editor, C. Bansal, Ramesh, editor, and Kumar Kalla, Ujjwal, editor

Published
2021
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21. Performance and thermal-aware Steiner routing for 3-D stacked ICs

Author

Pathak, Mohit and Sung Kyu Lim

Subjects
Standard IC, Algorithm, Thermal diffusivity -- Measurement, Algorithms -- Usage, Integrated circuits -- Design and construction, Integrated circuits -- Thermal properties, Semiconductor chips -- Design and construction, Semiconductor chips -- Thermal properties
Published
2009

28. Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)

Author

Kim, Dae Hyun, primary, Athikulwongse, Krit, additional, Healy, Michael B., additional, Hossain, Mohammad M., additional, Jung, Moongon, additional, Khorosh, Ilya, additional, Kumar, Gokul, additional, Lee, Young-Joon, additional, Lewis, Dean L., additional, Lin, Tzu-Wei, additional, Liu, Chang, additional, Panth, Shreepad, additional, Pathak, Mohit, additional, Ren, Minzhen, additional, Shen, Guanhao, additional, Song, Taigon, additional, Woo, Dong Hyuk, additional, Zhao, Xin, additional, Kim, Joungho, additional, Choi, Ho, additional, Loh, Gabriel H., additional, Lee, Hsien-Hsin S., additional, and Lim, Sung Kyu, additional

Published
2015
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30. 3D-MAPS: 3D Massively parallel processor with stacked memory

Author

Kim, Dae Hyun, primary, Athikulwongse, Krit, additional, Healy, Michael, additional, Hossain, Mohammad, additional, Jung, Moongon, additional, Khorosh, Ilya, additional, Kumar, Gokul, additional, Lee, Young-Joon, additional, Lewis, Dean, additional, Lin, Tzu-Wei, additional, Liu, Chang, additional, Panth, Shreepad, additional, Pathak, Mohit, additional, Ren, Minzhen, additional, Shen, Guanhao, additional, Song, Taigon, additional, Woo, Dong Hyuk, additional, Zhao, Xin, additional, Kim, Joungho, additional, Choi, Ho, additional, Loh, Gabriel, additional, Lee, Hsien-Hsin, additional, and Lim, Sung Kyu, additional

Published
2012
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37. Exploiting Die-to-Die Thermal Coupling in 3D IC Placement.

Author

Athikulwongse, Krit, Pathak, Mohit, and Sung Kyu Lim

Subjects
COUPLINGS (Gearing), INTEGRATED circuits, THROUGH-silicon via, THERMAL conductivity, HEAT sinks (Electronics)
Abstract

In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce the local power den- sity and vertically aligned across dies simultaneously to increase thermal conductivity to the heatsink. Second, we move high-power logic cells to the location that has higher conductivity to the heatsink while moving TSVs in the upper dies so that high-power cells are vertically overlapping below the TSVs. These methods are em- ployed in a force-directed 3D placement successfully and outper- form several state-of-the-art placers published in recent literature. [ABSTRACT FROM AUTHOR]

Published
2012

38. Design for manufacturability and reliability for TSV-based 3D ICs.

Author

Pan, David Z., Sung Kyu Lim, Athikulwongse, Krit, Jung, Moongon, Mitra, Joydeep, Pak, Jiwoo, Pathak, Mohit, and Yang, Jae-seok

Abstract

The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technologies, new modeling and design techniques need to be developed for 3D IC manufacturability and reliability. In particular, TSVs in 3D IC may cause significant thermal mechanical stress, which not only results in systematic mobility/performance variations, but also leads to mechanical reliability concerns such as interfacial cracking. Meanwhile, the huge dimensional gaps between TSV, on-chip wires, and bonding/packaging all lead to new electromigration concerns. Thus full-chip/package modeling and physical design tools need to be developed to achieve more reliable 3D IC integration. In this paper, we will discuss some key design for manufacturability and reliability challenges and possible solutions for TSV-based 3D IC integration, as well as future research directions. [ABSTRACT FROM PUBLISHER]

Published
2012
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42. Placement and Routing for 3-D System-On-Package Designs.

Author

Minz, Jacob Rajkumar, Wong, Eric, Pathak, Mohit, and Sung Kyu Lim

Subjects
THERMALS (Meteorology), ELECTRONICS, CROSSTALK, SYSTEMS design, ELECTRONIC circuit design, COMPUTER integrated manufacturing systems
Abstract

Three-dimensional (3-D) packaging via system-on-package (SOP) is a viable alternative to system-on-chip (SOC) to meet the rigorous requirements of today's mixed signal system integration. In this article, we present the first physical design algorithms for thermal and power supply noise-aware 3-D placement and crosstalk-aware 3-D global routing. Existing approaches consider the thermal distribution, power supply noise, and crosstalk issues as an afterthought, which may require an expensive cooling scheme, more decoupling capacitors (=decap), and additional routing layers. Our goal is to overcome this problem with our thermal/decap/crosstalk-aware 3-D layout automation tools. The traditional design objectives such as performance, area, wirelength, and via are considered simultaneously to ensure high quality results. The related experimental results demonstrate the effectiveness of our approaches. [ABSTRACT FROM AUTHOR]

Published
2006
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