10 results on '"Sohn, D.K."'
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2. Study of upstream electromigration bimodality and its improvement in Cu low-k interconnects.
3. A novel methodology to analyze time-dependent dielectric breakdown failure mechanism of copper/low-k interconnects.
4. Effect of chemical mechanical polishing scratch on TDDB reliability and its reduction in 45nm BEOL process.
5. Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package.
6. TDDB robustness of highly dense 65NM BEOL vertical natural capacitor with competitive area capacitance for RF and mixed-signal applications.
7. Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance.
8. The effects of dielectric slots on Copper/Low-k interconnects reliability.
9. Aggressively scaled high-k last metal gate stack with low variability for 20nm logic high performance and low power applications.
10. Impact of Interstitial Carbon on Base Current Ideality in SiGe:C Heterojunction Bipolar Transistors.
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