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22 results on '"Barmak, K."'

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1. A1 to [L1.sub.0] transformation in FePt films with ternary alloying additions of Ag and Au

2. Calorimetric studies of the A1 to Li(sub 0) transformation in binary FePt thin films with compositions in the range of 47.5-54.4 at percentage Fe

3. On the relationship of high coercivity and L1(sub 0) ordered phase in CoPt and FePt thin films

6. Grain boundary diffusion and its effects on the magnetic properties of Co/Cu and Co/Cr thin film bilayers

7. Crystallization of coevaporated and ion-irradiated amorphous CoSi2

8. The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films

9. Crystallization of amorphous Co-Si alloys

10. Thin film reaction kinetics of niobium/aluminum multilayers

11. The A1 to L1(sub 0) ordering transformation in binary FePt films with compositions in the range of 47.5 to 55 at. percentage Fe and in ternary alloys of FePt with Cu, Co, Ag and Au is examined. The kinetic ordering temperature is increased by the ternary additions of Co (28 at. %), Ag (11 at.%) and Au (7 and 12 at.%)

12. Magnetic signature of compositional gradient in exchange-spring bilayer films of CoPt/Co

13. Grain growth and ordering kinetics in CoPt thin films

14. Effect of alloy composition on the thermodynamic and kinetic parameters of the A1 to L[1.sub.0] transformation in FePt, FeNiPt, and FeCuPt films

15. Time-temperature-transformation diagrams for the A1 to L[1.sub.0] phase transformation in FePt and FeCuPt thin films

16. The A1 to [L1.sub.0] transformation in FePt and FeCuPt thin films: Determination of isothermal transformation kinetics from nonisothermal measurements

17. On the relationship of magnetocrystalline anisotropy and stoichiometry in epitaxial L1(sub 0) CoPt (001) and FePt (001) thin films

18. Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity

19. Robust exchange coupling in bilayer exchange-spring thin films

20. Metastable and equilibrium phase formation in sputter-deposited Ti/Al multilayer thin films

21. Dissociation of dilute immiscible copper alloy thin films

22. A methodology for automated quantitative microstructural analysis of transmission electron micrographs

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