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To effectively solve the crosstalk issue in high-density crossbar array (CBA), high rectifying characteristics should be introduced in the resistance random-access memory (ReRAM) device, and in-depth understanding of the affecting factors on rectifying properties is essential for the large-scale application of ReRAM. In this paper, a high-performance self-rectifying device with CMOS compatible Pd/HfO2/TaOx/Ta structure was demonstrated in a 1-kb CBA. Forming-free, self-compliance, and high uniformity characteristics were successfully achieved. By modulating the thickness of the HfO2 rectifying layer, the rectifying ratio of device could be achieved as high as $\sim 2\times 10^{\textsf {3}}$ under ±3 V at low-resistance state (LRS). It was also experimentally confirmed that the selected unit cell in high-resistance state (logically the “ OFF” state) was stably readable when it was surrounded by unselected LRS (logically the “ ON” state) cells, in an array of up to $32 \times 32$ cells. Furthermore, a model based on interfacial barrier modulation and defects trapping/detrapping was proposed to elucidate the impact of the dielectric thickness on the self-rectifying characteristics of the device. The results presented in this paper provide a great potential for selector-free high-density memory applications. [ABSTRACT FROM AUTHOR]

This paper reports on the design optimization of double gate (DG) tunnel FET (TFET) for dynamic memory applications in sub-100-nm regime. It is shown that incorporation of lateral spacing ( L_ \text gap) between the gates, and an underlap region ( L\text {un}) between drain and back gate reduces state “0” degradation, which along with optimal biases, results in an improved Retention Time (RT) at 85 °C. The systematic design optimization increases RT from ~80 to ~300 ms with the use of L\text {gap} at 85 °C, which can be further improved to ~600 ms with the introduction of L\text {un} . The careful investigation shows the back gate scaled down to 25 nm with a front gate region of 100 nm, and operation even at elevated temperatures (125 °C). The insights into DG TFET DRAM operation in terms of individual as well as total lengths highlights the RT enhancement by a factor of 3 with constant total length (200 nm) and an improved scalability with total length scaled down to 160 nm. This paper provides new opportunities to realize TFET-based DRAM with improved RT, scalability, and high temperature operation. [ABSTRACT FROM PUBLISHER]

Recently, exploiting emerging nonvolatile memories to implement the process-in-memory (PIM) paradigm have shown great potential to address the von Neumann bottleneck and have attracted extensive research and development. In this paper, we present a novel PIM platform—spintronic processing unit (SPU), within spin transfer toque magnetic random access memory (STT-MRAM). This energy-efficient and reconfigurable PIM platform can perform different tasks—data storage and logic computing—using the same physical fabric that is programmable at the finest grain, i.e., the individual memory cell level, without the need to move data outside the memory fabric. The proposed SPU works just like a typical memory and all the logic functions are achieved through regularmemory-like write and read operations with minimal modifications. The functionality and performance are evaluated via hybrid circuit simulations under the 40-nm process technology node. Our proposed SPU is expected to be a feasible PIM platform in the near future, owing to the increasing maturity of STT-MRAM. [ABSTRACT FROM AUTHOR]

This paper investigates the issues of oxygen accumulation and variation in the high-resistance state of HfO2-based resistive random access memory (RRAM), with improvement attained by inserting a thin oxygen-vacancy-rich layer of indium-tin-oxide (ITO) film. By acting as the oxygen ion reservoir, this ITO thin film on the TiN electrode can further stabilize resistance switching (RS) characteristics. In terms of reliability, ac endurance, and retention tests confirm stable RS characteristics for the Pt/HfO2/ITO/TiN device. Finally, a conducting model was proposed to explain the influence of the ITO thin layer and clarify the physical mechanism of electrical improvements. [ABSTRACT FROM AUTHOR]

In this paper, we propose a novel static random access memory (SRAM) unit cell design and its array structure consisting of single-gated feedback field-effect transistors (FBFETs). To verify the SRAM characteristics, the basic memory operations and write disturbances of the unit cell are investigated through the mixed-mode technology computer-aided design simulations. The unit cell exhibits the superior SRAM characteristics including a write speed of 0.6 ns, a fast read-out speed of ~0.1 ns, and a retention time of 3600 s. Furthermore, the unit cell design exhibits advantages in density, with a small cell area of 8F2, and in the power consumption; the standby power consumption is 0.24 nW/bit for holding “1” and negligible for holding “0.” Moreover, our SRAM array shows reliable ${3} \times {3}$ array operations without any disturbances. This paper demonstrates the promising potential of the FBFET SRAM for high-performance, high-density, and low-power memory applications. [ABSTRACT FROM AUTHOR]

In modern electronic devices, a variety of novel materials have been introduced such as transition metal oxides, chalcogenides, ferroelectric, and magnetic materials. The electrical response of such materials, used also as active layers, is strongly affected by atomic defects, which affect device performances, variability, and reliability. Extracting the defect properties (i.e., density, energy, and atomic nature) is, thus, crucial to both engineer the performances of electron devices and correctly project their scaling potential and reliability. In this paper, we propose a simple method to extract the atomic properties of defects from the thermal activation energy of the leakage current using a charge trapping relaxation model. [ABSTRACT FROM AUTHOR]

In-memory computing architecture is an emerging revolutionary computing paradigm that can break the von Neumann bottleneck. Computing methodology and circuit codesign using the CMOS compatible 1T1R resistive random access memory (RRAM) integration structure is presented in this paper. Functionally complete Boolean logic and arithmetic functions are experimentally demonstrated. With a single 40-nm CMOS process 1T1R unit, each of the 16 binary logics can be realized in two logic steps with an additional readout step for cascading, which shows functional reconfiguration and low computational complexity. Up to 107 cycles of NAND and XOR logic operations are performed to validate the correctness and reliability. Moreover, several fundamental adder circuits are designed and experimentally demonstrated in 1T1R devices as the proof of concept of the 1T1R computing architecture. The adders proposed in this paper include a ripple-carry adder and its optimized design and a carry-select adder, which all show promising advantages in nonvolatility, computation speed, and circuit area. This paper reports the most complex yet efficient RRAM-based 8-bit addition function experimentally so far and lays a solid foundation for constructing the future in-memory computing architecture. [ABSTRACT FROM AUTHOR]

The introduction of metal nanocrystals (NCs) has been confirmed to improve electrical uniformity of oxide-based resistive random access memory (RRAM) devices significantly; however, the current reports do not systematically elucidate the relationship between the size/distribution of NCs and the electrical uniformity of RRAM devices. In this paper, we focused on the impact of metal NCs size and areal density on the resistive switching (RS) performances of oxide RRAM by atomic layer deposition (ALD) based on the experimental results and theoretical calculation. The dependence of ALD cycles of 50–130 during Pt or CoPtx NCs growth on the RS parameters of Al2O3 or HfO2 memory units has been evaluated systematically. The RRAM embedded Pt or CoPtx NCs shows the trends: with increasing ALD cycles, the forming voltage, set/reset voltage, the resistance in off and on state, and ${R}_{ \mathrm{\scriptscriptstyle OFF}}/{R}_{ \mathrm{\scriptscriptstyle ON}}$ ratio entirely first decrease, then flatten, and increase later with a minimum value at about 100 cycles. Although all metal NCs with various sizes enhance the electric field strength compared to at the planar region, only metal NCs with proper NCs size and areal density (9 nm/6– $10\times 10^{\textsf {11}}$ /cm2 in this paper) can effectively produce stronger localized electric field at the tip of metal NCs, leading to optimal RS behavior. [ABSTRACT FROM AUTHOR]

The switching properties of Te and TeTiW top electrodes (TEs) on TiW/SiN/TiN resistive switching memory devices are explored in this paper. The TeTiW TE device exhibits more favorable bipolar resistive switching behavior because of the decrease in binding energy after its use. This finding is confirmed through X-ray photoelectron spectroscopy analyses. The filament of the TeTiW TE device is metal like after forming, and the reset process corresponds with the thermal-dissolution mechanism. A physical model based on a Te filament is constructed to explain such phenomena. The TeTiW TE device provides the excellent endurance of more than 104 cycles, with an ON/OFF ratio of 500. The improvement can be attributed to the filament’s robustness during the forming and set processes, which prevent its diffusion even at high temperature. The device also features long retention for up to 104 s at 225 °C without stress, and 104 s at 85 °C with stress of −0.3 V. Therefore, it has high potential for high-density nonvolatile memory applications. [ABSTRACT FROM AUTHOR]

In this paper, a 1-Transitor (1-T) capacitorless dynamic random access memory (DRAM) using bandgap-engineered silicon-germanium Bipolar ionization metal oxide semiconductor field effect transistor (I-MOS) is investigated through numerical simulations. We have demonstrated the application of the proposed Si0.6Ge0.4 Bipolar I-MOS for realization of a 1-T capacitorless DRAM. The proposed device can achieve hysteresis at significantly lower drain voltages ( V\mathrm{LD} =0.45 V to V\mathrm{LU} =1.15 V), in comparison to the inversion mode device ( V\mathrm{LD} = 8 V to V\mathrm{LU} =11 V). In addition, the proposed 1-T capacitorless DRAM exhibits a wider hysteresis window ( \Delta \textV ) of the order ~700 mV and a sensing margin ( \Delta \textI ) of ~5 orders in comparison to the inversion mode based 1-T capacitorless DRAM. Moreover, the proposed 1-T capacitorless DRAM exhibits the retention time of ~750 msec and ~320 msec for T = 25 °C and T = 85 °C, respectively. The proposed 1-T capacitorless DRAM also shows nondestructive read and an extreme long-term endurance. Therefore, the results presented in this paper can provide an opportunity for future DRAM design in deep nanometer technology. [ABSTRACT FROM PUBLISHER]

4H-silicon carbide (SiC) is a suitable candidate for high-temperature and radiation prone applications, due to its superior electrical and material properties. Several researchers have demonstrated small-scale logic circuits, entirely in 4H-SiC; however, to build a complete electronic module in 4H-SiC, a memory component is yet to be developed. This paper presents for the first time the design, optimization, and performance analysis of a 4H-SiC-based bipolar memory column including a static random access memory cell and peripherals, designed for voltages as low as 5 V. The memory column has average noise margins of 2 V and delays in the range of few nanoseconds at room temperature. The proposed memory architecture also demonstrates robust operation across a wide range of temperatures (27 °C–500 °C) with stable noise margins and speeds. This paper validates the potential of developing memory architectures in 4H-SiC, which operates reliably for varying conditions, paving the way to build complete electronic systems entirely based on 4H-SiC. [ABSTRACT FROM AUTHOR]

Performance of the crossbar memory array highly depends on the selector characteristics. In this paper, rigorous transient analyses are performed for a large-size crossbar memory array using novel NbO2-based selectors with a threshold switching behavior. To enable accurate and efficient array-level simulation, an electrostatic discharge-based compact model is employed to effectively describe the ${I}$ – ${V}$ characteristics of the selector. Multiple key design parameters of the selector are investigated, such as the threshold voltage, leakage current, and intrinsic switching speed. A sensitivity analysis is performed to evaluate the impact of hypothetical improvements in various selector parameters. In addition, the impacts of resistances of interconnect and memory element on the array-level access delay and energy dissipation are quantified. The results show that reducing the threshold voltage of selectors provides the most significant performance improvement, where up to 80% of the energy-delay product saving is observed if the threshold voltage is reduced by 50%. [ABSTRACT FROM AUTHOR]

In this paper, we demonstrate nondestructive readout memory characteristics of a bistable resistor (biristor) with an n+-p-n+ Si nanowire (SiNW) channel on a bendable substrate. The SiNW channel is fabricated using a top--down route, which is compatible with the current complementary metal-oxide-semiconductor technology. The SiNW biristor shows the outstanding memory characteristics such as a retention time of 10 s and a current sensing margin of ~23-μA at room temperature. These memory characteristics originate from a positive feedback process resulting from impact ionization near the p-n junction. Moreover, the positive feedback mechanism is comprehensively investigated using device simulation. [ABSTRACT FROM AUTHOR]

In this paper, we use an automated tool flow in a 14 nm CMOS fin-shaped field-effect transistor (FinFET)/ static random access memory (SRAM) simulation-based design-technology cooptimization (DTCO) including both process-induced and intrinsic statistical variabilities. A 22 nm FinFET CMOS technology is used to illustrate the sensitivity to process-induced fin shape variation and to motivate this paper. Predictive Technology Computer Aided Design (TCAD) simulations have been carried out to evaluate the transistor performance ahead of silicon. Draft-diffusion simulations calibrated to the ensemble Monte Carlo simulation results are used to explore the process and the statistical variability space. This has been enabled by the automation of the tool flow and the dataset handling. The interplay between the process and the statistical variability has been examined in details. A two-stage compact model strategy is used to capture the interplay between process and statistical variability. To close the DTCO loop, the static noise margin and write noise margin sensitivity to cell design parameters and variability in FinFET-based SRAM designs are studied in details. [ABSTRACT FROM AUTHOR]

This paper extensively evaluates the stability and performance of heterochannel 6T/8T SRAM cells integrated in monolithic 3-D scheme with interlayer coupling. Various bitcell layouts with different gate alignments of transistors from distinct layers are investigated. This paper indicates that stacking the NFET tier over the PFET tier results in larger design margins for cell robustness and performance. Furthermore, the partition of 3-D layout design among distinct layers shows profound impacts on the stability, standby leakage, and performance of monolithic 3-D SRAM cells. Compared with the Si-based cells, the use of heterochannel devices increases the improvements of monolithic 3-D design over the 2-D counterparts and emerges as a suitable candidate for future monolithic 3-D IC applications. [ABSTRACT FROM PUBLISHER]

A multilevel cell (MLC) memristor that provides high-density on-chip memory has become a promising solution for energy-efficient artificial neural networks (ANNs). However, MLC storage that stores multiple bits per cell is prone to device variation. In this paper, the device variation tolerance of ANN training is investigated based on our cell-specific variation modeling method, which focuses on characterizing realistic cell-level variation. The parameters of cycle-to-cycle variation (CCV) and device-to-device variation (DDV) are extracted separately from the experimental data of a 39-nm, 1-Gb phase-change random access memory (PCRAM) array. A quantized neural network designed for low bit-width (≥6-bit) training is used for simulations to demonstrate the potential of MLC storage. Our results demonstrate that training is more vulnerable to DDV than CCV, and CCV can even compensate for accuracy degradation caused by severe DDV. As a result, for a multilayer perceptron (MLP) on Modified National Institute of Standards and Technology (MNIST) database, 95% accuracy can be achieved with three MLC PCRAM devices per weight, which is a 40% reduction in the number of cells compared with using conventional single-level cells (SLCs). If the size of DDV is reduced by half, then only two cells, that is 60% fewer cells than using SLC, are needed. [ABSTRACT FROM AUTHOR]

In the study of resistive random access memory using GeTeOx film as the switching layer, the device performed excellent property of bipolar resistive switching (BRS), which could be gradually transformed to the complementary resistive switching (CRS) by varying SET process current compliance. The conductive filament conduction mechanism of BRS could be verified by electrical characteristics and reliable data fitting. Through increasing current compliance of the SET process, CRS could be achieved due to higher activity of oxygen vacancies originated from the intensified thermal effect. This paper was beneficial to understand the switching mechanisms of BRS and CRS and provide a method to realize interconversion. Moreover, it was also a potential and promising device to be applied in the neurosynaptic biomimetic field. [ABSTRACT FROM AUTHOR]

In this paper, we investigate in depth Forming, SET, and Retention of conductive-bridge random-access memory (CBRAM). A kinetic Monte Carlo model of the CBRAM has been developed considering ionic hopping and chemical reaction dynamics. Based on inputs from ab initio calculations and the physical properties of the materials, the model offers the simulation of both the Forming/SET and the Data Retention operations. It aims to create a bond between the physics at atomic level and the device behavior. From the model and experimental results obtained on decananometric devices, we propose an understanding of the physical mechanisms involved in the CBRAM operations. Using the consistent Forming/SET and Data Retention model, we obtained good agreement with the experimental data. Finally, the impact of each layer of the CBRAM on the Forming/SET behavior is decorrelated, allowing an optimization of the performance. [ABSTRACT FROM AUTHOR]

Write time is a critical component of memory performance, which often defines cycle time. In order to accurately predict static random access memory (SRAM) performance, it is also important to take temporal degradation effects into account. This paper investigates the influence of bias temperature instability induced transistor degradation on a dynamic write performance of 20 nm bulk CMOS SRAM. The circuit simulations are based on the comprehensive physical simulation of the aging process and on a very accurate statistical compact model extraction and generation technology. Several scenarios, which differ based on aging pattern of the cell, are investigated to identify the most important transistors and the corresponding critical aging conditions. Mismatch between the two inverters results in an imbalance of the cell, which enlarges the difference in write time between 0 and 1. Finally, we show a response surface of changes in write margin in response to different degradation levels in the ON and OFF transistors. [ABSTRACT FROM PUBLISHER]

In this paper, we investigated the performance of SrTiO3 (STO) resistive random-access memory (RRAM) as a candidate to realize short-term synaptic elements in neuromorphic circuits. Ionic defect movement within oxides is postulated to play a significant role in resistive state reconfiguration of these devices. This relatively small movement in oxides was sensed by developing a novel measurement technique using differential voltammetry. Using this technique, the widely hypothesized belief of drift and diffusion of ionic defects in oxides was systematically studied and linked to the state reconfiguration in STO RRAM. Next, the devices’ state retention was examined and a consistent decay of the resistive state was observed. The decay rate was found to be a function of the conditioning voltage, allowing us to control the state decay via operational voltages. We then developed a test battery that quantified how these devices operate within a spike-rate encoded learning paradigm. By utilizing a carefully tuned test battery, we were able to quantify the magnitude of potentiation and depression due to varying spike amplitudes and spike rates. These tests provide a systematic methodology to capture the constantly changing resistive state of short-term synaptic elements. [ABSTRACT FROM AUTHOR]

In this paper, we report about the derivation of a physics-based compact model of random telegraph noise (RTN) in HfO2-based resistive random access memory (RRAM) devices. Starting from the physics of charge transport, which is different in the high resistive states and low resistive states, we explore the mechanisms responsible for RTN exploiting a hybrid approach, based on self-consistent physics simulations and geometrical simplifications. Then, we develop a simple yet effective physics-based compact model of RTN valid in both states, which can be steadily integrated in state-of-the-art RRAM compact models. The RTN compact model predictions are validated by comparison with both a large experimental data set obtained by measuring RRAM devices in different conditions, and data reported in the literature. In addition, we show how the model enables advanced circuit simulations by exploring three different circuits for memory, security, and logic applications. [ABSTRACT FROM AUTHOR]

This paper reports on the potential benefits of a vertically stacked ${n}$ - and ${p}$ -type junctionless (JL) transistor physically decoupled through an intermediate oxide layer for dynamic memory application. The proposed topology enhances the retention time (RT) of capacitorless dynamic random access memory (1T-DRAM), with a significant improvement $(\sim \!\!\times 10^{3})$ compared with a conventional JL transistor with a doping (${N}_{\text{d}}$) of 1019 cm−3. The functionality of architecture as DRAM is based on physically decoupling the conduction region (top ${n}$ -type JL transistor) and storage region (bottom ${p}$ -type JL), while maintaining an electrostatic coupling between them. The charge stored in the ${p}$ -type JL determines RT, and also impacts the read currents, and thus, influences the sense margin of DRAM. Stacked JL (SJL) 1T-DRAM achieves a maximum RT of ~2.5 s for ${N}_{\text{d}} = 5 \times 10^{18}$ cm−3 and ~1 s for 1019 cm−3 with a gate length (${L}_{\text{g}}$) of 200 nm at 85 °C. Results demonstrate its functionality down to 20 nm. The enhanced DRAM metrics (better scalability and high RT) are attributed to optimal architecture due to the vertical stacking of ${n}$ - and ${p}$ -type regions. [ABSTRACT FROM AUTHOR]

Selector-less resistive random-access memory (RRAM) devices require high nonlinearity (NL) in low-resistance state current ( ${I}_{\textsf {LRS}}$ ). In this paper, we investigate the effect of composition (here, Ca%)-dependent material properties, viz., ion migration barrier, and thermal conductivity, on memory performance of recently demonstrated Pr1–xCaxMnO3-based selector-less RRAM with high NL. First, the NL increases as “ $\mathit {x}$ ” decreases. This is attributed to higher self-heating in $\textsf {PCMO}{(}\mathit {x}{)}$ films as composition-dependent thermal conductivity ( $\kappa $ ) decreases as “ $\mathit {x}$ ” is decreased. This enables selector-less operation. Second, larger memory window is observed as “ $\mathit {x}$ ” increases due to decrease in the voltage required for onset of RESET process (i.e., $V_{\textsf {MIN, RESET}}$ ) as “ $\mathit {x}$ ” is increased. Lower $V_{\textsf {MIN, RESET}}$ at higher “ $\mathit {x}$ ” is due to higher oxygen-ion conductivity attributed to lower migration barrier ( ${E}_{m}$ ). Third, retention is measured at different temperatures to extract composition-dependent ${E}_{m}$. The poor memory retention performance for $\mathit {x}= 1$ is consistent with lower ${E}_{m}$ estimated. Finally, enhanced endurance is observed for lower ${E}_{m}$ due to low-energy requirement for switching. Based on these observations, an interrelation between ${E}_{m}$ , retention, and endurance is established. Therefore, an interplay of composition-dependent thermal conductivity and oxygen-ion migration barrier enables tunable memory characteristics in Pr1–xCaxMnO3-based RRAM. [ABSTRACT FROM AUTHOR]

The understanding of failure behavior is one of the basic requirements for further development of nonvolatile resistive random access memory (RRAM) devices. In this paper, we show a detailed analysis of a temperature-dependent low-resistance state (LRS) retention failure behavior of RRAM based on TiOx/Al2O3 bilayer structure. The device is capable of showing good resistive switching properties with stable operating parameters. The LRS current conduction process is mostly dominated by the Fowler-Nordheim tunneling. Retention behavior has been studied with a wide range of temperatures from room temperature to 200 °C with different compliances. The experimental results of TiOx/Al2O3 bilayer resistive switching memory are further supported theoretically by the Meyer-Neldel rule, which is fit well to the retention failure time. [ABSTRACT FROM AUTHOR]

In this paper, we demonstrate, for the first time, 3-D Monolithic integration of short-channel replacement metal gate InGaAs n-FinFETs on fully-depleted silicon-on-insulator CMOS, with TiN/W interlayer contacts. Top layer InGaAs nFETs feature raised source-drain and bottom layer CMOS has Si raised source-drain for nFETs, SiGe raised source-drain for pFETS, implants, silicide, and TiN/W plug contacts. Scaled gate length (Lg) of 15 nm is achieved on bottom layer Si n- and pFETs, while the top layer InGaAs n-FinFETs are scaled to Lg of 25 nm. A densely integrated 3-D 6T-static random access memory circuit with planar InGaAs nFETs stacked on Si pFETs is demonstrated by taking advantage of the interlayer contacts. This yields significant area reduction when compared with 2-D layouts. [ABSTRACT FROM AUTHOR]

Phase-change memory (PCM) has undergone significant academic and industrial research in the last 15 years. After much development, it is now poised to enter the market as a storage-class memory (SCM), with performance and cost between that of NAND flash and DRAM. In this paper, we review the history of phase-transforming chalcogenides leading up to our current understanding of PCM as either a storage-type SCM, with high-density and better than NAND flash endurance, write speeds, and retention, or a memory-type SCM, with fast read/write times to function as a nonvolatile DRAM. Several of the key findings from the community relating to device dimensional scaling, cell design, thermal engineering, material exploration, and storing multiple levels per cell will be discussed. These areas have dramatically impacted the course of development and understanding of PCM. We will highlight the performance gains attained and the future prospects, which will help drive PCM to be as ubiquitous as NAND flash in the upcoming decade. [ABSTRACT FROM AUTHOR]

The aim of this paper is to introduce a compact model for perpendicular spin-transfer torque (STT)-magnetic tunnel junctions (MTJs) implemented in Verilog-A to assure easy integration with electrical circuit simulators. It takes into account the effects of voltage-dependent perpendicular magnetic anisotropy, temperature-dependent parameters, thermal heating/cooling, MTJ process variations, and the spin-torque asymmetry of the Slonczewski spin-polarization function in the switching process. This translates into a comprehensive modeling that was adopted to investigate the writing performance under voltage scaling of a $256\times256$ STT- magnetic random access memory array implemented at three different technology nodes. Obtained results show that scaling from 30- to 20-nm node allows a write energy saving of about 43%, while the supply voltage that assures the minimum-energy write operation increases. [ABSTRACT FROM PUBLISHER]

In this paper, we intensively investigated the proposed nanocontact phase-change memory (nano-C PCM) with incorporated nanostructures and high-resistivity nanolayer (nano-L) for reducing reset current. The high resistivity was able to be tuned by doping N into the conventional Ge2Sb2Te5 phase-change material. The analysis based on finite-element method exhibited that the current density in the nano-C PCM could be locally enhanced to about two times that of both conventional and nano-L PCM devices. This resulted in the localization of Joule heating in the nano-C PCM, making it have the highest temperature at the same programming current among the three types of PCM devices. Reset current of nano-C PCM could be greatly reduced to 8.2% of that of the conventional one, owing to its high-efficiency heating for amorphization. [ABSTRACT FROM PUBLISHER]

In this paper, we present a new 8T design for static random access memory (SRAM) cell that is based on traditional Si technology and reduces leakage power considerably compared with a conventional design. Proposed design can be fully functional at smaller supply voltages over the conventional 6T SRAM cell. To verify the proposed design, a 32 kb SRAM is designed and simulated in 90 nm CMOS technology using the proposed 8T and conventional 6T SRAM cells. Operating at their VDD \(_{\min }\) , simulations show improvement of 58% and 67% for write and read power per operation, respectively, for our design. To address the challenge of half-selection during write operation, a new low-power internal write-back scheme is presented. Finally, designing proposed cell using fin-shaped field effect transistors shows less sensitivity to variations and also improvement of \(2.08\times \) in read static noise margin at \({\rm VDD}=1.0\) V over bulk-CMOS-based SRAM cell. [ABSTRACT FROM AUTHOR]

This paper proposes a cantilever-based nanoelectro-mechanical (NEM) nonvolatile memory (NVM) with a novel write scheme for reliable memory operation at very high-operating temperature (up to 300 ^\circC ) in rugged electronics. The memory bit (0/1) is formed by the opening/closing of a cantilever beam. Permanent retention is obtained by adhesive force between two smooth surfaces in contact, eliminating leakage observed in all types of storage-layer-based NVMs. This allows the proposed NEM memory structure to be implemented using a simple bilayer design and easily integrated with the CMOS platform with leakage of 144 pA, which is significantly less compared with SRAM. The experimental analysis of vibrational reset is reported for the first time in this paper. An array structure using the proposed NEM memory device and CMOS devices is presented. Each bit cell consists of one NEM memory device and one nMOS transistor for realizing full random-access operation. [ABSTRACT FROM AUTHOR]

Underlap FinFET devices, or trigate transistors, are considered to be the most favorable substitute to the conventional bulk device below 22-nm technology node. However, their application in circuit design requires specific attention because of the fin width quantization and increased parasitic. This paper proposes a double dielectric or dual-k spacers technology to enhance the electrostatic integrity of underlap FinFETs. For the first time, we investigate the circuit performance such as that of static RAMs (SRAMs), based on the proposed dual-k spacer FinFETs. The proposed structure enhances SRAMs performance in terms of robustness, access times, and the leakage power during all possible modes of operation. The hold, read, and write-margin increases by 8.7%, 9.4%, and 10.4%, respectively, as compared with conventional FinFET SRAM. Furthermore, the read and write access times reduces by 56% and 17.1%, respectively. Moreover, the standby leakage power is also reduced by \sim73\% compared with the conventional FinFET-based SRAM while occupying same bit-cell area. [ABSTRACT FROM PUBLISHER]

We demonstrate a metal sandwiched Al-doped zinc tin oxide (AZTO) thin-film device to exhibit a characteristic evolution process from Schottky junction diode to resistive-switching random access memory (RRAM) applications. The proposed TiN/Ti/AZTO/Pt device can initially show good rectifying characteristics and high forward-bias current for Schottky diodes. After applying with an electrically triggered forming process, the transition of electrical behavior occurs and evolves from the diode to RRAM characteristics. The RRAM device exhibits the coexistence of bipolar and unipolar resistive-switching modes through the positive-bias forming and reversed-bias forming process, respectively. In addition, the RRAM device with bipolar mode can perform the functionality of multilevel cell storage, while the one with unipolar mode shows stable resistive-switching performance. Furthermore, one-transistor and one-resistor (1T1R) architecture with an RRAM cell connected with a thin-film transistor (TFT) device is developed in this paper. The TFT device using AZTO film as an active channel layer performs good electrical characteristics for a driver in the 1T1R operation scheme. The integration of AZTO-based electronic devices has great potential for increasing the application diversity of metal oxide AZTO thin film as well as the flexibility of circuit design in the emerging optoelectronic technologies. [ABSTRACT FROM PUBLISHER]

Emerging nonvolatile memories based on resistive switching mechanisms pull intense research and development efforts from both academia and industry. Oxide-based resistive random access memories (OxRAM) gather noteworthy performances, such as fast WRITE/READ speed, low power, high endurance, and large integration density that outperform conventional flash memories. To fully explore new design concepts, such as distributed memory in logic or biomimetic architectures, robust OxRAM compact models must be developed and implemented into electrical simulators to assess performances at a circuit level. In this paper, we propose a physics-based compact model used in electrical simulator for bipolar OxRAM memories. After uncovering the theoretical background and the set of relevant physical parameters, this model is confronted to experimental electrical data. The excellent agreement with these data suggests that this model can be confidently implemented into circuit simulators for design purpose. [ABSTRACT FROM PUBLISHER]

Resistive random access memory (RRAM) is a promising candidate for next generation nonvolatile memory technology. In this paper, electrothermal simulation in 3-D RRAM arrays is performed by using our in-house developed finite difference algorithm, which is validated by comparing the simulated temperature distribution with its counterpart obtained by commercial software. Both crossbar RRAM array and vertical RRAM array are studied comprehensively with careful consideration of the temperature-dependent constitute parameters. Simulations show that the temperature and thermal crosstalk are sensitive to the size and shape of conductive filament, which can further limit the scaling potential of RRAM array through affecting its reliability, such as retention time, current leakage, and so on. Scaling behavior of 3-D RRAM array is studied, and optimization guidance for reducing thermal crosstalk is proposed. The fabrication inaccuracy resulted cell offset has also been examined for investigation of thermal crosstalk. [ABSTRACT FROM PUBLISHER]

Resistive switching memory (RRAM) features many optimal properties for future memory applications that make RRAM a strong candidate for storage-class memory and embedded nonvolatile memory. This paper addresses the cycling-induced degradation of RRAM devices based on a HfO2 switching layer. We show that the cycling degradation results in the decrease of several RRAM parameters, such as the resistance of the low-resistance state, the set voltage V\mathrm{ set} , the reset voltage V\mathrm{ reset} , and others. The degradation with cycling is further attributed to enhanced ion mobility due to defect generation within the active filament area in the RRAM device. A distributed-energy model is developed to simulate the degradation kinetics and support our physical interpretation. This paper provides an efficient methodology to predict device degradation after any arbitrary number of cycles and allows for wear leveling in memory array. [ABSTRACT FROM AUTHOR]

The physical mechanisms that regulate carrier transport in polycrystalline chalcogenides, such as \Ge2\Sb2\Te5 (GST), are still debated. Recently, self-induced Joule-heating (SJH) effect has been claimed to be the key factor in explaining the nonlinearity of the I–V characteristics of polycrystalline GST-based phase-change memory (PCM). In this paper, we carefully investigate the SJH occurring in the GST material by analyzing the I–V characteristics of PCM cells at low voltages, i.e., in the memory-cell readout region. To accomplish the study, we use ad hoc fabricated PCM devices allowing an easier evaluation of SJH occurring in the chalcogenide layer. A novel procedure to test the SJH effect is also proposed. A comparison between numerical simulations and compact modeling is discussed as well. Our paper shows that the SJH effect is not sufficient to reproduce the experimental I–V nonlinearity, claiming for new experiments and theoretical investigations. Therefore, this paper can be considered a step forward toward the comprehension of the transport properties of polycrystalline GST, which is a key aspect for robust modeling of PCM devices. [ABSTRACT FROM PUBLISHER]

In this paper, the transition rate (TR) from the high-resistance state to the low-resistance state of a HfO2-based resistive random access memory (RRAM) is investigated. The TR is statistically characterized by applying constant voltage stresses in the range from 0.45 to 0.65 V. It is found that TR follows a voltage dependence which closely resembles the one exhibited by metal-insulator-semiconductor / metal-insulator-metal structures when subjected to constant voltage stress, but with remarkably different fitting parameters. This result suggests a common underlying mechanism in both evolutionary behaviors. Furthermore, the investigation provides additional evidence supporting the micro-structural changes in the oxide after the forming step as well as the role played by the atomic species during the SET event. [ABSTRACT FROM AUTHOR]

In Part I, we proposed reconfigurable ferroelectric transistors (R-FEFETs) with a unique property of dynamic modulation between the volatile (logic) and nonvolatile (memory) modes of operation with the help of a control signal. They showcase excellent robustness in the presence of gate leakage with larger hysteresis in the nonvolatile mode with respect to ferroelectric FETs (FEFETs) and higher ON current in the volatile mode compared with standard FETs. Using the unique attributes of R-FEFETs presented in Part I, we explain the dynamics of transition between various modes of operation for circuit-level applications in this paper. We propose a 3T nonvolatile memory design that offers significant power savings over FEFET-based memories by virtue of the control terminal. Our analysis shows that the proposed R-FEFET memory exhibits 55% lower write power and 37%–72% lower read power at iso access time and 33% lower area compared with a recently proposed standard FEFET-based memory. [ABSTRACT FROM AUTHOR]

We present a defect spectroscopy technique to profile the energy and spatial distribution of defects within a material stack from leakage current (${J}$ – ${V}$), capacitance (${C}$ – ${V}$), and conductance (${G}$ – ${V}$) measurements. The technique relies on the concept of sensitivity maps (SMs) that identify the bandgap regions, where defects affect those electrical characteristics. The information provided by SMs are used to reproduce ${J}$ – ${V}$ , ${C}$ – ${V}$ , and ${G}$ – ${V}$ data measured at different temperatures and frequencies by means of physics-based simulations relying on an accurate description of carrier-defect interactions. The proposed defect spectroscopy technique is applied to ZrO2-based metal–insulator–metal structures of different compositions for dynamic random-access memory capacitor applications. The origin of the observed voltage, temperature, and frequency dependencies of the ${I}$ – ${V}$ , ${C}$ – ${V}$ , and ${G}$ – ${V}$ data is understood, and the atomic structure of the relevant stack defects is identified. [ABSTRACT FROM AUTHOR]

The physical unclonable function (PUF) based on resistive random-access memory (RRAM) possesses a distinctive advantage that can offer higher security and lower cost than the traditional complementary metal–oxide–semiconductor-based cryptographic devices and other conventional PUFs. The intrinsic stochasticity of RRAM devices successfully provides attractive properties to implement PUF. In this paper, we present a novel multistate-based RRAM PUF to realize strong tolerance against attack. By applying multilevel states with bit shuffling to the RRAM PUF, the randomness and uniqueness were enhanced close to ideal values. In addition, the bit error rate was dramatically reduced using the temperature compensation mechanism. Moreover, our new method not only enables the generation of larger challenge–response pairs (CRPs) with less footprint but also can reconfigure CRPs. [ABSTRACT FROM AUTHOR]

From its conceptual inception in 2015, the combined capabilities of the multiple-state electrostatically formed nanowire transistor (MSET) have given way to a unique set of logic structures—in the example of NAND and NOR gates—which utilize fewer transistors as compared to conventional technologies. In this paper, we expand the recently published framework of MSET logic functions and present a static random access memory (SRAM) memory structure that consists entirely of MSET devices. Using TCAD simulations, we demonstrate the MSET-SRAM functionality in several phases of operation, while analyzing its performance in terms of speed, stability, and power consumption. [ABSTRACT FROM AUTHOR]

This paper reports on the usefulness of shell-doped (SD) junctionless (JL) transistor architecture for operation as capacitorless dynamic random-access memory (1T-DRAM). SD topology overcomes the problem associated with shallower potential depth in heavily doped devices, thereby enhancing the retention time (RT) along with improved scalability. The use of a thinner shell for achieving high RT is beneficial as it reduces generation and recombination of holes. The results show that an undoped core region with shell thickness (${T}_{\textsf {Shell}}$) of 2 nm yields maximum retention. An SD (${N}_{\mathrm {d}}$) of $10^{18}$ cm $^{-\textsf {3}}$ attains RT of ~5.5 s and ~630 ms at 27 °C and 85 °C, respectively, whereas higher ${N}_{\textsf {d}}$ ($10^{19}$ cm $^{-\textsf {3}}$ shows RT of ~13ms at 85 °C for ${L}_{\textsf {g}} = \textsf {200}$ nm. SD JL transistor shows less degradation in RT with temperature. A 10 nm SD JL device with RT of ~11 ms at 85 °C demonstrates applicability as 1T-DRAM at shorter gate lengths. [ABSTRACT FROM AUTHOR]

A recently reported zero impact ionization and zero subthreshold swing device Z2FET is a promising candidate for capacitor-less dynamic random access memory (DRAM) memory cell. In the memory operation, data retention time determines refresh frequency and is one of the most important memory merits. In this paper, we have systematically investigated the Z2FET retention time based on a newly proposed characterization methodology. It is found that the degradation of HOLD “0” retention time originates from the gated-silicon on insulator (SOI) portion rather than the intrinsic-SOI region of the Z2FET. Electrons accumulate under front gate and finally collapse the potential barrier turning logic “0”–“1.” It appears that Shockley–Read–Hall (SRH) generation is the main source for electrons accumulation. Z2FET scalability has been investigated in terms of retention time. As the Z2FET is downscaled, the mechanism dominating electrons accumulation switches from SRH to parasitic injection of electrons from the cathode. The results show that the downscaling of Lg has little effect on data “0” retention, but Lin is limited to ~125 nm. An optimization method of the fabrication process is proposed based on this new understanding, and Lin can be further scaled down to 75 nm. We have demonstrated by 2-D TCAD simulation that Z2FET is a promising DRAM cells’ candidate particularly for Internet-of-Things applications. [ABSTRACT FROM AUTHOR]

This paper analyzes the impacts of intrinsic process variations and negative bias temperature instability (NBTI)/positive BTI (PBTI)-induced time-dependent variations on the stability/variability of 6T FinFET static random access memory (SRAM) cells with various surface orientations and gate dielectrics. Due to quantum confinement, (110)-oriented pull-down n-channel FETs with fin line-edge roughness (LER) show larger Vread,0 and Vtrip variations, thus degrading read static noise margin (RSNM) and its variability. Pull-up p-channel FETs with fin LER that are (100)-oriented show larger Vwrite,0 and Vtrip variations, hence degrade the variability of write SNM. The combined effects of intrinsic process variations and NBTI/PBTI-induced statistical variations have been examined to optimize the FinFET SRAM cells. Worst-case stress scenario for SNM stability/variability is analyzed. With the presence of both NBTI and PBTI in high-k metal-gate FinFET SRAM, the RSNM suffers significant degradation as Vread,0 increases, whereas Vtrip simultaneously decreases. Variability comparisons for FinFET SRAM cells with different gate stacks (\SiO2 and \SiO2/\HfO2) are also examined. Our paper indicates that the consideration of NBTI/PBTI-induced temporal variation changes the optimal choice of FinFET SRAM cell surface orientations in terms of the \mu/\sigma ratio in RSNM. [ABSTRACT FROM PUBLISHER]

We analyze the augmentation of spin-transfer torque (STT) MRAM with electrically driven selective phase transition of a threshold switch (TS) to enhance the read operation. This paper provides a comprehensive discussion on necessary design considerations for TS augmented (TSA) MRAMs. We deduce constraints for read and write biasing that yields improved read operation of TSA MRAMs. We explain the dependence of read/write performance metrics on read/write biases and the properties (resistance and critical currents for transitions) of the TS. With proper device-circuit optimization, TSA MRAM shows up to 70% larger sense margin, ~27% higher data stability with ~40% less power for read operation compared to STT MRAM (in nominal condition). We evaluate the impact of variation on TSA MRAM through Monte Carlo simulations. We report that even with variation induced spread in the distribution of bit-line voltages, TSA MRAM provides $\sim 1.7\times $ larger voltage differential between parallel and antiparallel states. For the write operation, the TSA MRAM consumes ~10% less average power and demands only ~5% more write time extension than the STT MRAM to achieve the same level of variation tolerance. [ABSTRACT FROM AUTHOR]

A Monte Carlo SPICE framework is proposed to evaluate the impact of negative bias temperature instability (NBTI) variability on performance and static power (${P}_{\text {S}}$) of static random access memory (SRAM) array on 14-nm node FinFETs. Gamma distribution is found to be applicable for NBTI-induced threshold voltage ($\Delta {V}_{T}$) and subthreshold slope ($\Delta $ SS) shifts by using data set from different sources. A compact variability model is proposed for the time evolution of mean and variance of NBTI distribution, considering any possible correlation between time zero and NBTI variability. The relative sensitivity of device and SRAM degradation are evaluated, by correlating SRAM static noise margin degradation to transistor level ${V}_{T}$ shift. The impact of $\Delta $ SS on ${P}_{\text {S}}$ improvement due to NBTI is also evaluated. [ABSTRACT FROM AUTHOR]

In this paper, vanadium oxide (VOx) was chosen for the resistive switching layer in a typical resistive random access memory (RRAM) structure. During negative forming bias, we found an initial selector property. This indicates the presence of metal–insulator-transition characteristics in the VOx layer even without an annealing process. In order to study this phenomenon, material analyses were conducted, with results indicating that there are V-O stretching bonds and an oxide/vanadium ratio of nearly 2.2 (${O}/{V} = {2.2}$). In addition, the experimental results of the dc sweeping test indicated that off-state current gradually decreased after each cycle, meaning that the selectivity characteristics in the VOx selector could be improved. Endurance performance of our experimental devices reached 108, sufficient for integration with RRAM devices in a 1S1R array. To further investigate this special phenomenon, current fitting analysis and simulation analyses were conducted. The results of the fitting analysis indicated that the conduction mechanism for off-state current was Schottky emission and the Schottky distance increased with increasing numbers of cycles. In other words, oxide ions migrate toward the filament at low negative voltage during dc sweeping, causing the formation of VOx. Furthermore, the results of thermal field simulation analysis indicated that there is a thermal concentration effect in and around the filament. Thus, oxide ions more easily migrate toward the vanadium filament when a stronger electrical field is present around the filament during dc sweeping cycles. Finally, stable vanadium selector characteristics are obtained and a conduction filament behavior model is proposed. [ABSTRACT FROM AUTHOR]

A general macromodel of the phase change random access memory (PCRAM) elements for use in HSPICE-based computer simulator is proposed in this paper by introducing physical models of PCRAM elements. It can simulate the dc and transient behavior of PCRAM element. In this paper, the model was integrated with the standard R/W circuit and successfully simulated the R-I curve and dependence between amplitude and width of programming pulses. A comparison between experimental and simulation results were also given. Furthermore, by including the partial crystallization states, the macromodel was developed for simulating the multilevel storage. [ABSTRACT FROM AUTHOR]

Resistance drift of the amorphous states of multilevel phase change memory (PCM) cells is currently a great challenge for the commercial implementation of a reliable multiple-bit-per-cell memory technology. This paper reports observation of a stable intermediate state for a multilevel PCM cell that is achieved through nonuniform heating with a square current injection top electrode. Drift coefficient of the intermediate state is an order of magnitude lower than reset and has weaker temperature dependence. Using finite-element simulations and an analytical model for the subthreshold current–voltage characteristics, based on thermally activated hopping of charge carriers across Coulombic donor-like traps, we conclude that the defect density is two orders of magnitude larger in the intermediate state. We attribute the low drift coefficient of the intermediate state to a large number of stable interfacial defects which dominate the electron transport. Current findings give way to a more stable ultrahigh-density PCM device. [ABSTRACT FROM PUBLISHER]

Conventional spin transfer torque (STT) magneto-resistive random access memory (MRAM) generally includes a bulk n-channel MOS (NMOS) transistor as an access device that provides equal drive current in standalone conditions in both the directions. However, the switching current requirement of magnetic tunnel junctions (MTJs) in STT MRAM is highly asymmetric (2 to 3:1). With conventional access devices, the excess write current in one direction maps to unnecessarily higher power dissipation. Hence, in this paper, a novel STT MRAM cell with an asymmetric-dielectric (asymmetric- $k$ ) sidewall-spacer NMOS (ASNMOS) is presented. ASNMOS has different- $k$ sidewall spacers, i.e., one side high- $k$ and other side low- $k$ spacer. As desired, this novel ASNMOS provides asymmetric drive current and reduces the overall power dissipation. The proposed STT MRAM cell is analyzed with HSPICE simulations using calibrated Verilog-A models for access device and perpendicular magnetic anisotropy MTJ. The STT MRAM cell with the proposed ASNMOS exhibits up to 25% reduction in the dynamic power dissipation over the STT MRAM cell with the conventional symmetric NMOS as an access device. Moreover, ASNMOS-based cells shows higher reliability wherein the worst case current density through MTJ is reduced by 25%. [ABSTRACT FROM PUBLISHER]