83 results on '"Dim-Lee Kwong"'
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2. Optical OFDM transmission using low-noise Kerr frequency comb generated in on-chip microresonator.
3. Low-voltage silicon Mach-Zehnder modulator operating at high temperatures without thermo-electric cooling.
4. Silicon Nanowires embedded pressure sensor with annularly grooved diaphragm for sensitivity improvement.
5. Development of flexible neural probes using SU-8/parylene.
6. Characterization of a multi-layered MEMS pressure sensor using piezoresistive silicon nanowire within large measurable strain range.
7. Real-time spectral dynamics of femtosecond solitons under free-carrier nonlinearity in silicon photonic crystals.
8. A low-phase-noise 18 GHz Kerr frequency comb spanning 65 THz.
9. A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications.
10. Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement.
11. Nucleic Acid Extraction, Amplification, and Detection on Si-based Microfluidic Platforms.
12. 128-Gb/s DP-QPSK using low-loss monolithic silicon IQ modulator integrated with partial-rib polarization rotator.
13. 128Gb/s DP-QPSK silicon modulator module integrated with driver amplifiers.
14. 20-Gb/s DPSK transmission with 550-ps/nm dispersion tolerance using silicon Mach-Zehnder modulator.
15. DQPSK/QPSK modulation at 40-60 Gb/s using low-loss nested silicon Mach-Zehnder modulator.
16. A 0.18μm CMOS 802.15.4a UWB Transceiver for Communication and Localization.
17. Active MEMS metamaterial with uniaxially isotropic dual band switching characteristics in terahertz region.
18. High Speed Selective-Area-Epitaxial Ge-on-SOI PIN Photo-detector Using Thin Low Temperature Si0.8Ge0.2 Buffer by Ultra-High-Vacuum Chemical Vapor Deposition
19. High-ON/OFF-contrast 10-Gb/s silicon Mach-zehnder modulator in high-speed low-loss package.
20. Ultrasensitive pressure sensor based on gate- all-around nanowire fet.
21. Experimental demonstration of microfabricated phononic crystal resonators based on two-dimensional silicon plate.
22. Horizontal nanoplasmonic slot waveguide-based subwavelength photonic components for on-chip integration.
23. Silicon photonics technologies for monolithic electronic-photonic integrated circuit applications.
24. Theoretical investigation of silicon MOS-type plasmonic slot waveguide based electrooptic modulators.
25. Silicon waveguide based TE mode converter.
26. Energy-efficient Germanium electro-absorption modulator for ‘Green’ photonics applications.
27. Sensorized guidewires with MEMS tri-axial force sensor for minimally invasive surgical applications.
28. Wafer level embedding technology for 3D wafer level embedded package.
29. A novel method to predict die shift during compression molding in embedded wafer level package.
30. Study of 15µm pitch solder microbumps for 3D IC integration.
31. Sub-modeling technique for thermo-mechanical simulation of solder microbumps assembly in 3D chip stacking.
32. Surface nanostructure optimization for solar energy harvesting in Si thin film based solar cells.
33. Stress Analysis of Embedded Active Devices in Substrate Cavity for System-On-Package (SOP).
34. Manipulating interface dipoles of opposing polarity for work function engineering within a single metal gate stack.
35. Band edge NMOS work function for nickel fully-silicided (FUSI) gate obtained by the insertion of novel Y-, Tb-, and Yb-based interlayers.
36. The Analysis of Dielectric Breakdown in Cu/Low-k Interconnect System.
37. Advanced MOSFETs using HfTaON/SiO/sub 2/ gate dielectric and TaN metal gate with excellent performances for low standby power application.
38. CMOS integration issues with high-k gate stack.
39. Substituted aluminum metal gate on high-k dielectric for low work-function and Fermi-level pinning free.
40. A novel program-erasable high-k AlN capacitor with memory function.
41. Molybdenum metal gate MOS technology for post-SiO2 gate dielectrics.
42. Physical model for the diffusion of ion implanted boron and BF/sub 2/ during rapid thermal annealing.
43. High performance depletion-mode silicon modulators.
44. Silicon photonics for monolithic electronic-photonic integrated circuit applications: Opportunities and challenges.
45. Silicon photonics technologies for monolithic electronic-photonic integrated circuit applications.
46. An ultra-compact polarization rotator based on surface plasmon polariton effect.
47. A polarization diversity circuit for silicon photonics.
48. Silicon Mach-Zehnder modulator of extinction ratio beyond 10dB at 10.0–12.5Gbps.
49. Low power silicon photonics switch.
50. Waveguide-integrated Ge/Si avalanche photodetector with 105GHz gain-bandwidth product.
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