1. Investigation of HfO2/Ti based vertical RRAM - Performances and variability
- Author
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Piccolboni, G., Molas, G., Carabasse, C., Nodin, J., Pellissier, C., Brianceau, P., Vianello, E., Pollet, O., Perrin, F., Cluzel, J., Toffoli, A., Aussenac, F., Delaye, V., Ghibaudo, G., de Salvo, B., Perniola, L., Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation (IMEP-LAHC), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Institut National Polytechnique de Grenoble (INPG)-Centre National de la Recherche Scientifique (CNRS), ANR-10-LABX-0055,MINOS Lab,Minatec Novel Devices Scaling Laboratory(2010), European Project: 621217,EC:FP7:SP1-JTI,ENIAC-2013-2,PANACHE(2014), and Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut National Polytechnique de Grenoble (INPG)-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Centre National de la Recherche Scientifique (CNRS)
- Subjects
Vertical RAM ,Ti ,resistive RAM ,[SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics ,OXRAM ,Scaling ,HfO2 - Abstract
International audience; An easy-to-fabricate, low-cost, sidewall TiN/HfO 2 /Ti vertical resistive RAM (VRRAM) device is proposed. Devices with bottom electrode thickness down to 10nm were fabricated and characterized. Forming, SET and RESET voltages of respectively 2V, 0.5V and -0.5V were measured. A stable memory window of one decade was maintained after 10 5 s at 200°C. The impact of scaling on the operating voltages and memory resistance levels was evaluated, showing a SET and RESET voltage reduction as the cell diameter is reduced. Finally the cycle-to-cycle resistance variability was addressed.
- Published
- 2014
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