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Your search keyword '"Semiconductor chips -- Production processes"' showing total 12 results
Start Over Descriptor "Semiconductor chips -- Production processes" Publisher pennwell publishing corp.
12 results on '"Semiconductor chips -- Production processes"'

1. Data collection and networking capabilities enable pump predictive diagnostics

Author

Mooney, Michael and Shelley, Gerald

Subjects
Standard IC, Integrated circuit fabrication, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Integrated circuit fabrication -- Research
Abstract

OVERVIEW Predictive diagnostics techniques are applied to networked vacuum systems in wafer-processing applications using an array of data collection, mining, and advanced analysis concepts. By utilizing data collection and networking […]

Published
2005

2. CMOS imagers fit niche vision needs: improvements in CMOS technology have increased flexibility and decreased costs in high-speed or low-light applications

Author

Hardin, R. Winn

Subjects
Standard IC, Digital camera, Technology application, Integrated circuits -- Production processes, Electronic cameras -- Technology application, Semiconductor chips -- Production processes, Camera industry -- Technology application, Complementary metal oxide semiconductors -- Usage -- Technology application
Abstract

For the past decade, the machine-vision industry has waited for complementary-metal-oxide-semiconductor (CMOS) cameras to eclipse the more popular and expensive charge-coupled-device (CCD) cameras. CMOS cameras can be made less expensively […]

Published
2004

3. Understanding and controlling wafer charging damage

Author

Lukaszek, Wes

Subjects
Standard IC, Semiconductor wafers -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

Although wafer charging damage has been studied for the last 20 years, the recent emergence of conferences devoted exclusively to this topic [1] underscores the importance of this vexing problem […]

Published
1998

4. Random yield loss during wafer cleaning

Author

Venkatesh, R. Prasanna, Lim, Jung-Soo, and Park, Jin-Goo

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Silicon -- Production processes, Standard IC, Business, Electronics and electrical industries
Abstract

EXECUTIVE OVERVIEW The cleaning process performance in both conventional wet-bath and a single-wafer processor was evaluated. Experiments performed in this study were primarily oriented toward the determination of the number [...]

Published
2011

5. Choosing the right ionization gauge for high-vacuum processes

Author

Rutt, Paul M. and Smith, Steven

Subjects
Standard IC, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Vacuum-gages -- Usage
Abstract

OVERVIEW The selection of high-vacuum gauge technologies for measurements in pressure-dependent semiconductor processes can affect overall cost and manufacturing yields depending on the application and the environment in tool chambers. […]

Published
2005

6. Next-generation valve design for copper CMP: addressing agglomeration, shear forces, contamination and waste: the movement from aluminum to copper seeding and the attending challenges of copper CMP have placed tremendous responsibility on slurry delivery systems. New designs, new thinking begin to emerge

Author

Heffel, Mark

Subjects
Semiconductor chips -- Equipment and supplies, Semiconductor chips -- Production processes, Integrated circuits -- Equipment and supplies, Integrated circuits -- Production processes, Standard IC, Business, Engineering and manufacturing industries, High technology industry
Abstract

Copper physical vapor deposition (PVD) seeding and subsequent fill by electroplating has become the process of choice for microchip fabrication. As line widths shrink, aluminum becomes insufficiently effective as a [...]

Published
2003

7. Surface preparation prior to deposition

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Standard IC, Business, Engineering and manufacturing industries, High technology industry
Abstract

Integrated circuit design is constantly being scaled down in pursuit of faster circuit operation and lower power consumption. Scaled dimensions in a circuit design generally require attendant changes in fabrication [...]

Published
2006

8. Diverse CMP needs require a dielectric selectivity platform

Author

Grover, Gautam and Dirksen, James

Subjects
Semiconductor industry, Standard IC, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

OVERVIEW It is likely the 45nm technology node will see the introduction of new materials and integration schemes. For the early adopters, the choice of materials, applications, and integration schemes […]

Published
2005

10. AMD & SOI: winning with performance/watt/dollar: Nick Kepler, vice president of logic technology development at AMD talks about the role of SOI in the company's strategy

Author

Kepler, Nick

Subjects
Semiconductor industry, Standard IC, Microcomputer industry, Computer industry, International Business Machines Corp. -- Production processes, Executives -- Interviews, Technology, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Computer industry -- Production processes
Abstract

AMD Advanced Substrate News: How important is SOI to your strategy? Nick Kepler: SOI is an important part of AMD's product strategy. We are currently utilizing it for our entire […]

Published
2006

11. Process enhances spin-on low-k dielectric processing. (Technology News)

Author

Fitzgerald, Kevin

Subjects
Semiconductor industry, Standard IC, Shipley Co. -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes
Abstract

A new processing scheme allows for the solid-phase processing of spin-on porous low-k materials, overcoming the issues of barrier layer integrity, mechanical polishing, process-induced k value increases, and other integration […]

Published
2003

12. Ohmi heads new Japanese research consortia(*). (Asiafocus)

Author

Kimura, Masahide

Subjects
Standard IC, Company business management, Company financing, Company process management, High-Performance and Agilent Cleanroom Association -- Finance, Tohoku University -- Officials and employees -- Management, Societies -- Finance, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Associations, institutions, etc. -- Finance, Japan -- Science and technology policy
Abstract

Tadahiro Ohmi, Tohoku University heads two new Japanese research projects. Other ongoing Japanese research consortia include the government-supported MIRAI project on basic 0.07-0.05µm technology, and the privately funded ASKA/Selete efforts […]

Published
2002

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