30 results on '"Tsui, Bing-Yue"'
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2. Reduction of Contact Resistivity by Nano-Textured Contact
3. Modeling and Characterization of the Narrow-Width Effect of 4H-SiC MOSFETs With Local Oxidation of SiC Isolation
4. A Study on the Isolation Ability of LOCal Oxidation of SiC (LOCOSiC) for 4H-SiC CMOS Process
5. 1100 V, 22.9 mΩcm2 4H-SiC RESURF Lateral Double-Implanted MOSFET With Trench Isolation
6. Digital Logic and Asynchronous Datapath With Heterogeneous TFET-MOSFET Structure for Ultralow-Energy Electronics
7. A novel wafer reclaim method for amorphous SiC and carbon doped oxide films
8. Process sensitivity and robustness analysis of via-first dual-damascene process
9. A Study on the Isolation Ability of LOC al O xidation of SiC (LOCOSiC) for 4H-SiC CMOS Process.
10. Electrical instability of low-dielectric constant diffusion barrier film (a-SiC:H) for copper interconnect
11. Degradation Mechanism of Ge N+-P Shallow Junction With Thin GeSn Surface Layer
12. Photon-Detection-Probability Simulation Method for CMOS Single-Photon Avalanche Diodes
13. 1100 V, 22.9 mΩcm 2 4H-SiC RESURF Lateral Double-Implanted MOSFET With Trench Isolation.
14. Series resistance of self-aligned silicided source/drain structure
15. Effect of fluorine incorporation on the thermal stability of PtSi/Si structure
16. Effect of Ion-Implantation Temperature on Contact Resistance of Metal/n-Type 4H-SiC With Ar Plasma Treatment
17. Effects of Rapid Thermal Annealing on Ar Inductively Coupled Plasma-Treated n-Type 4H-SiC Schottky and Ohmic Contacts
18. Degradation Mechanism of Ge N+-P Shallow Junction With Thin GeSn Surface Layer.
19. Trenched 4H-SiC with tapered sidewall formed by Cl2/O2 reactive ion etching
20. Investigation Into Gate-to-Source Capacitance Induced by Highly Efficient Band-to-Band Tunneling in p-Channel Ge Epitaxial Tunnel Layer Tunnel FET
21. A Novel Approach Using Discrete Grain-Boundary Traps to Study the Variability of 3-D Vertical-Gate NAND Flash Memory Cells
22. Modeling the Impact of Random Grain Boundary Traps on the Electrical Behavior of Vertical Gate 3-D NAND Flash Memory Devices
23. Microtrenching-free two-step reactive ion etching of 4H-SiC using NF3/HBr/O2 and Cl2/O2
24. ${\rm Si}_{\rm x}{\rm Ge}_{1\hbox{-}{\rm x}}$ Epitaxial Tunnel Layer Structure for P-Channel Tunnel FET Improvement
25. Process and Characteristics of Fully Silicided Source/Drain (FSD) Thin-Film Transistors
26. Schottky Barrier TFTs with Source/Drain Sub-Gates
27. Modeling the Impact of Random Grain Boundary Traps on the Electrical Behavior of Vertical Gate 3-D <sc>NAND</sc> Flash Memory Devices.
28. Six\rm Ge1\-{\rm x} Epitaxial Tunnel Layer Structure for P-Channel Tunnel FET Improvement.
29. A Comprehensive Study on the FIBL of Nanoscale MOSFETs.
30. Microtrenching-free two-step reactive ion etching of 4H-SiC using NF{sub 3}/HBr/O{sub 2} and Cl{sub 2}/O{sub 2}
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