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Low-dimensional (low-D) semiconductors such as carbon nanotubes (CNTs) and 2-D materials are promising channel materials for nanoscale field-effect transistors (FETs) due to their superior electrostatic control. However, classical scale length theory (SLT) does not incorporate the effect of channel extensions, which becomes crucial for thin channels (< 10 nm) and short gate lengths. Here, we extend the classical SLT by introducing two boundary coupling parameters, which describe the impact of gate and drain biases on the source- and drain-channel junction potentials. Moreover, we introduce a general expression for the scale length specifically for low-D FETs. This extended SLT accurately describes electrostatic short-channel effects (SCEs) of low-D FETs, with < 5% error in subthreshold slope over a wide range of parameters versus > $2\times $ error using the classical SLT. The extended SLT is based on three parameters (scale length, gate, and drain boundary coupling parameters) which can be extracted from potential profiles or FET transfer characteristics. In addition, the extended SLT uses analytical closed-form expressions that can be easily included in a compact model to facilitate design-technology co-optimization (DTCO) with low-D FETs to leverage the crucial role of their extensions. [ABSTRACT FROM AUTHOR]

In this work, we introduce a novel nonalloyed contact structure for n-GaAs and n-In0.53Ga0.47As by using single metals in combination with a thin dielectric to tune the effective metal/III-V work function toward the conduction band edge. We reduced the effective Schottky barrier height ([uppercase_phi_synonym]B,eff) of Al/GaAs from 0.75 to 0.17 eV through the use of a thin atomic layer deposition Al2O3. Barrier height reduction was verified for a variety of metals (Y, Er, Al, Ti, and W) through direct measurements and deduced from increased diode current and reduced contact resistance. Similar results were observed on n-In0.53Ga0.47As. Two possible underlying mechanisms are discussed: one based on the formation of a dielectric dipole and the other based on the blocking of metal induced gap states. This structure has applications as a nonalloyed low resistance ohmic contact for III-V metal-oxide-semiconductor field-effect transistors (MOSFETs) or high electron mobility transistors (HEMTs), and as a near zero barrier height contact for III-V Schottky barrier field-effect transistors or diodes. [ABSTRACT FROM AUTHOR]

We developed a fully analytical ballistic theory of carbon nanotube field effect transistors enabled by the development of an analytical surface potential capturing the temperature dependence and gate and quantum capacitance electrostatics. The analytical ballistic theory is compared to the experimental results of a ballistic transistor with good agreement. The validated analytical theory enables intuitive circuit design, provides techniques for parameter extraction of the bandgap and surface potential, and elucidates on the device physics of drain optical phonon scattering and its role in reducing the linear conductance and intrinsic gain of the transistor. Furthermore, a threshold voltage definition is proposed reflecting the bandgap-diameter dependence. Projections for key analog and digital performances are discussed. [ABSTRACT FROM AUTHOR]

The insights contained in Gordon Moore's now famous 1965 and 1975 papers have broadly guided the development of semiconductor electronics for over 50 years. However, the field-effect transistor is approaching some physical limits to further miniaturization, and the associated rising costs and reduced return on investment appear to be slowing the pace of development. Far from signaling an end to progress, this gradual "end of Moore's law" will open a new era in information technology as the focus of research and development shifts from miniaturization of long-established technologies to the coordinated introduction of new devices, new integration technologies, and new architectures for computing. [ABSTRACT FROM PUBLISHER]

A novel one-transistor-n-resistors (1TnR) array architecture is demonstrated as a cost-effective solution to the sneak path problem in large-scale cross-point memory arrays. In a 1TnR array, a single transistor (1T) with a 1D channel effectively controls a number of resistive switching nonvolatile memory (NVM) cells (nR) while limiting the sneak leakage current within the 1D channel without sacrificing the device density. To maximize these benefits, a carbon nanotube FET (CNFET) is employed as the 1D selection device, due to its near-ballistic electrical transport properties even at a small device width. Experimental demonstrations of the CNFET-based 1TnR concept are presented with two promising resistive switching NVM candidates: 1) resistive random access memory (RRAM) and 2) phase-change memory (PCM). Here, we report that the integrated bipolar Al2O3-based RRAM consumes programming energies as low as 0.1–7 pJ per bit and has a high programming endurance of up to 10^6\vphantom \sum ^R^R cycles. The 1TnR RRAM cell also has self-compliance characteristics, because the semiconducting carbon nanotube (CNT) that serves as the bottom electrode limits the device current. The unipolar PCM cells integrated with CNFETs show uniform electrical characteristics with high ON-/OFF-resistance ratios of >10. Owing to the extremely small contact area between the phase change material, Ge2Sb2Te5, and the CNT, remarkably low programming currents of <1~\mu \textA are achieved. [ABSTRACT FROM PUBLISHER]

Carbon nanotube field-effect transistors (CNFETs) are excellent candidates for building highly energy-efficient electronic systems of the future. Fundamental limitations inherent to carbon nanotubes (CNTs) pose major obstacles to the realization of robust CNFET digital very large-scale integration (VLSI): 1) it is nearly impossible to guarantee perfect alignment and positioning of all CNTs despite near-perfect CNT alignment achieved in recent years; 2) CNTs can be metallic or semiconducting depending on chirality; and 3) CNFET circuits can suffer from large performance variations, reduced yield, and increased susceptibility to noise. Today's CNT process improvements alone are inadequate to overcome these challenges. This paper presents an overview of: 1) imperfections and variations inherent to CNTs; 2) design and processing techniques, together with a probabilistic analysis framework, for robust CNFET digital VLSI circuits immune to inherent CNT imperfections and variations; and 3) recent experimental demonstration of CNFET digital circuits that are immune to CNT imperfections. Significant advances in design tools can enable robust and scalable CNFET circuits that overcome the challenges of the CNFET technology while retaining its energy-efficiency benefits. [ABSTRACT FROM AUTHOR]

In this paper, an analytical model of intrinsic carbon-nanotube field-effect transistors is presented. The origins of the channel carriers are analyzed in the ballistic limit. A noniterative surface-potential model is developed based on an analytical electrostatic model and a piecewise constant quantum-capacitance model. The model is computationally efficient with no iteration or numerical integration involved, thus facilitating fast circuit simulation and system optimization. Essential physics such as drain-induced barrier lowering and quantum capacitance are captured with reasonable accuracy. [ABSTRACT FROM PUBLISHER]

A physics-based compact model is developed for III–V field-effect transistors for digital logic applications. Quasi-ballistic ratios, trapezoidal quantum-well subband energy levels, and 2-D source/drain influence on both electrostatics and capacitance are considered. Furthermore, gate tunneling leakage current and parasitic capacitance models are included. These latter effects are important in future technology logic applications, particularly in circuits such as high-density cache arrays. In this paper, we describe the III–V compact model including the gate leakage current and parasitic capacitance analytical models. The efficacy of the compact model in a practical circuit environment is demonstrated using transient simulations of a 6T-static random access memory cell. In addition, we provide design guidelines for optimization of the intrinsic and the extrinsic structure with regard to the parasitic effects. [ABSTRACT FROM AUTHOR]

A physics-based analytical compact model of InGaAs field-effect transistors (FETs) for digital logic applications is developed. This model neither heavily depends on parameter extraction nor requires any time-consuming computation while capturing the essential physics, enabling digital circuit design and circuit-level performance estimation for III-V FETs. The model captures short channel effects, trapezoidal-shape quantum-well energies, bias-dependent ballistic ratios, and capacitances including 2-D potential profile information. Each is verified via numerical calculations and 2-D electrostatic simulation, followed by a comparison o the model I-V characteristics with experiment data. Finally, the transient response of FO4 inverters demonstrates the use of the compact model for future technology circuit simulations. [ABSTRACT FROM AUTHOR]

We demonstrate ACCNT (pronounced as "accent"), a solution to the metallic-nanotube problem that does not require any metallic-nanotube removal of any kind. ACCNT uses asymmetrically correlated carbon nanotubes to achieve metallic-nanotube tolerance, delivering high ON-OFF ratios (104-106) while preserving the current drive. In addition, this metallic-nanotube tolerance can be engineered arbitrarily close to 100%. We present the ACCNT concepts in detail, verifying the concepts and underlying assumptions via experimental results. We further demonstrate inverters using ACCNT and ACCNT scalability to a wafer scale. ACCNT marks the first demonstration of a VLSI-compatible metallic-nanotube-tolerant design methodology. [ABSTRACT FROM AUTHOR]

Carbon-nanotube (CNT) field-effect transistors (CNFETs) are promising extensions to silicon CMOS. Simulations show that CNFET inverters fabricated with a perfect CNFET technology have 13 times better energy delay product compared with 32-nm silicon CMOS inverters. The following two fundamental challenges prevent the fabrication of CNFET circuits with the aforementioned advantages: 1) misaligned and mispositioned CNTs and 2) metallic CNTs. Misaligned and mispositioned CNTs can cause incorrect functionality. This paper presents a technique for designing arbitrary logic functions using CNFET circuits that are guaranteed to implement correct functions even in the presence of a large number of misaligned and mispositioned CNTs. Experimental demonstration of misaligned and mispositioned CNT-immune logic structures is also presented. [ABSTRACT FROM AUTHOR]

This paper presents a circuit-compatible compact model for the intrinsic channel region of the MOSFET-like single-walled carbon-nanotube field-effect transistors (CNFETs). This model is valid for CNFET with a wide range of chiralities and diameters and for CNFET with either metallic or semiconducting carbon-nanotube (CNT) conducting channel. The modeled nonidealities include the quantum confinement effects on both circumferential and axial directions, the acoustical/optical phonon scattering in the channel region, and the screening effect by the parallel CNTs for CNFET with multiple CNTs. In order to be compatible with both large- (digital) and small-signal (analog) applications, a complete transcapacitance network is implemented to deliver the real-time dynamic response. This model is implemented with an HSPICE. Using this model, we project a 13 times CV/I improvement of the intrinsic CNFET with (19, 0) CNT over the bulk n-type MOSFET at the 32-nm node. The model described in this paper serves as a starting point toward the complete CNFET- device model incorporating the additional device/circuit-level nonidealities and multiple CNTs reported in the paper of Deng and Wong. [ABSTRACT FROM AUTHOR]

This paper presents accurate analytical models to calculate the electrostatic gate capacitance of 1-D field-effect transistors (FETs) with multiple cylindrical conducting channels. Gate capacitance Cgg is decomposed into three major components: 1) capacitance Cgc between the gate and the parallel cylindrical conducting channels (the number of channels ≥ 1) in dual-layer dielectric materials; 2) outer fringe capacitance Cof between the gate and the source/drain cylinder conductors; and 3) coupling capacitance Cgtg between the adjacent gates. A realistic planar-gate structure with high-k gate dielectric material is considered in this paper, including the screening effect of the parallel conductors and different dielectric materials on capacitance. An accuracy of 10% is achieved from the analytic models, compared with the values that were simulated by 3-D numerical field solvers. Using a simple analytical expression for the gate delay that includes the parasitic capacitance and screening of multiple parallel conducting channels, this paper also shows that both increasing the number of channels per gate and reducing the gate height are effective ways to improve device speed. [ABSTRACT FROM AUTHOR]

The theoretical performance of carbon nanotube field-effect transistors (CNFETs) with Schottky barriers (SBs) is examined by means of a general ballistic model. A novel approach is used to treat the SBs at the metal-nanotube contacts as mesoscopic scatterers by modifying the distribution functions for carriers in the channel. Noticeable current reduction is observed compared to previous ballistic models without SBs. Evanescent- mode analysis is used to derive a scale length and the potential profile near the contacts for radially symmetric CNFET structures. Band-to-band tunneling current and ambipolar conduction are also treated. The effects of different device geometries and different nanotube chiralities on the drain-current are studied using this simple model. Quantum conductance degradation due to SBs is also observed. [ABSTRACT FROM AUTHOR]

Double gate devices based upon the FinFET architecture are fabricated, with gate lengths as small as 30 nm. Particular attention is given to minimizing the parasitic series resistance. Angled extension implants and selective silicon epitaxy are investigated as methods for minimizing parasitic resistance in FinFETs. Using these two techniques high performance devices are fabricated with on-currents comparable to fully optimized bulk silicon technologies. The influence of fin thickness on device resistance and short channel effects is discussed in detail. Devices are fabricated with fins oriented in the 〈100〉 and 〈100〉 directions showing different transport properties. [ABSTRACT FROM AUTHOR]

A physics-based compact model for III–V FETs is developed for logic circuit applications. The model is applied to study sub-22-nm technology 6T-SRAM cells with InGaAs MOSFETs. The pull-down and pass gate combination is optimized for maximum cell stability. The drawbacks of having a weak III–V PMOS as the pull-up device in a SRAM cell are investigated. In this letter, we propose a minimum requirement for PMOS strength for all-III–V SRAM to be viable in a logic chip. Also, by assuming a high-performance PMOS, we observe a 26% higher static current noise margin and a two times faster write speed compared to conventional SRAM. [ABSTRACT FROM AUTHOR]

In this paper, high-performance back-gated carbon nanotube field-effect transistors based on transferred aligned carbon nanotubes were fabricated and studies found that the on/off ratio can reach 107 and the current density can reach 1.6 μA/μm after electrical breakdown. In addition, chemical doping with hydrazine was used to convert the p-type aligned nanotube devices into n-type. These devices were further utilized to demonstrate various logic circuits, including p-type metal-oxide-semiconductor inverters, diode-loaded inverters, complementary metal-oxide-semiconductor inverters, NAND, and NOR gates. This approach could work as the platform for future nanotube-based nanoelectronics. [ABSTRACT FROM AUTHOR]

SiGe-on-insulator material was fabricated by wafer bonding and hydrogen-induced layer transfer techniques. The transferred SiGe layer is strain relaxed and has a Ge content ranging from 15% to 25%. High-quality strained Si layers were grown on the SiGe-on-insulator substrates by the UHV/chemical vapor deposition process at 550 °C. An electron mobility of 40 000 cm[sup 2]/V s in a modulation-doped Si/SiGe heterostructure was achieved at 30 K on a SiGe-on-insulator substrate. © 2001 American Institute of Physics. [ABSTRACT FROM AUTHOR]

Black phosphorus (BP) is a promising two-dimensional (2D) material for nanoscale transistors, due to its expected higher mobility than other 2D semiconductors. While most studies have reported ambipolar BP with a stronger p-type transport, it is important to fabricate both unipolar p- and n-type transistors for low-power digital circuits. Here, we report unipolar n-type BP transistors with low work function Sc and Er contacts, demonstrating a record high n-type current of 200 μA/μm in 6.5 nm thick BP. Intriguingly, the electrical transport of the as-fabricated, capped devices changes from ambipolar to n-type unipolar behavior after a month at room temperature. Transmission electron microscopy analysis of the contact cross-section reveals an intermixing layer consisting of partly oxidized metal at the interface. This intermixing layer results in a low n-type Schottky barrier between Sc and BP, leading to the unipolar behavior of the BP transistor. This unipolar transport with a suppressed p-type current is favorable for digital logic circuits to ensure a lower off-power consumption. [ABSTRACT FROM AUTHOR]