1. Depth profiles of cluster-ion-implanted BSi in silicon
- Author
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Liang, Jenq-Horng, Chiang, Shiaw-Lung, Chen, Chin-Tsai, Niu, Huan, and Tseng, Mao-Sheng
- Subjects
- *
ION implantation , *RAPID thermal processing - Abstract
In this study, BSi cluster ions of 77 keV and B monomer ions of 22 keV were respectively implanted into silicon wafers at room temperature and geometrically tilted. Rapid thermal annealing of the as-implanted specimens at 1050
° C for 25 s was also employed. The results revealed that all the as-implanted and as-annealed range parameters (Rp ,ΔRp ,γ ,β andΔRt ) of the BSi cluster ion implantation are smaller than those of the B monomer ion implantation. The as-annealed range parameters are larger than the as-implanted ones for both the BSi cluster ion and the B monomer ion implantations mainly due to radiation enhanced diffusion (RED) effects. RED effects also tend to drive boron atoms out-diffusion towards the specimen surface. However, the SiO2 layer at the surface acts as a diffusion barrier by which it traps boron atoms nearby. The existence of larger amounts of defects explains the presence of a more pronounced accumulation of out-diffused boron atoms in the as-annealed boron depth profile of the BSi cluster ion implantation compared to that of the B monomer ion implantation. [Copyright &y& Elsevier]- Published
- 2002
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