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1. Performance Prediction of InP/GaAsSb Double Heterojunction Bipolar Transistors for THz applications

3. 3D Logic Cells Design and Results Based on Vertical NWFET Technology Including Tied Compact Model

6. High Efficiency O‐band Preamplified Receiver Integrated with Semiconductor Optical Amplifier and Uni‐travelling Carrier Photodiode for Passive Optical Network.

9. Characterization of intra device mutual thermal coupling in multi finger SiGe:C HBTs

15. 3D Logic circuit design oriented electrothermal modeling of vertical junctionless nanowire FETs

17. Circuit Design Flow dedicated to 3D vertical nanowire FET

24. An Access Modelling-based De-embedding Method for High-frequency Characterization of Uni-traveling carrier Photodiodes

25. 0.4-µm InP/InGaAs DHBT with a 380-GHz fT > 600-GHz fMAX and BVCE0 > 4.5 V

26. Electro-thermal limitations and device degradation of SiGe HBTs with emphasis on circuit performance (Invited)

27. Multiscale Compact Modelling of UTC-Photodiodes Enabling Monolithic Terahertz Communication Systems Design

28. THz electronics and Photonics compact modelling on InP Substrate (Invited)

29. Why neuromorphic computing need novel 3D technologies? A view from FVLLMONTI European project consortium (Invited)

39. Compact Modeling and Parameter Extraction Strategies for InP Double Heterojunciton Bipolar Transistors

40. Implementation of tunneling phenomena in a CNTFET compact model

41. Implementation of electron-phonon scattering in a CNTFET compact model

42. Computationally efficient physics-based compact CNTFET model for circuit design

43. Electrical behavior and technology optimization of Si/SiGeC HBTs on thin-film SOI

44. Analysis of Energy-Delay-Product for a 3D Vertical Nanowire FET Technology for Logic Applications

45. CNTFET modeling and reconfigurable logic-circuit design

46. Towards Monolithic Indium Phosphide (InP)-Based Electronic Photonic Technologies for beyond 5G Communication Systems

47. Design of On-Wafer TRL Calibration Kit for InP Technologies Characterization up to 500 GHz

50. Compact Modeling of UTC Photodiodes Enabling Future Terahertz Communication System Design

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